KR-20260066994-A - A barrel plating device in which both the anode and cathode are installed inside the barrel in electroplating

Abstract

The present invention relates to a barrel plating device with positive and negative electrodes installed inside an electroplating barrel, and more specifically, to a barrel plating device that improves plating quality by minimizing variations in plating thickness and making the plating thickness uniform by installing the positive electrode, which was previously located only outside the barrel into which the workpiece is inserted, so as to be positioned adjacently inside the barrel into which the workpiece is inserted, thereby dispersing the current and bringing the distance to the workpiece closer.

Inventors

• 이원준
• 스즈키 미찌마사
• 김영수
• 김미애

Assignees

• (주)진합

Dates

Publication Date

20260512

Application Date

20241105

Claims (3)

1. It is an electro-barrel plating device for plating screws and bolts, which are the items to be plated, and A plating tank (40) filled with plating solution inside; A barrel (10) installed so as to be rotatable, immersed in a plating tank (40) to the extent that the workpiece to be plated is submerged, with the workpiece to be plated placed inside; An auxiliary anode (60) installed in a diagonal shape such that one side of it is adjacent to and facing the workpiece inside the barrel (10), corresponding to the workpiece being pushed to the lower side inside the barrel (10) as the barrel (10) rotates; A negative power supply (70) connected to the workpiece to be plated inside the barrel (10) from outside the plating tank (40); The anode power supply unit (71) is distributed into two lines: a first line (72) provided in a circular shape spaced apart from the lower outer periphery of the barrel (10) within the plating tank (40), and a second line (73) connected to the auxiliary anode (60). An electroplating barrel plating device with positive and negative electrodes installed inside the barrel, characterized in that the current of the positive power supply unit (71) is dispersed, and the distance from the positive power supply unit (71) is increased through the auxiliary anode (60), thereby reducing the voltage used and reducing the power consumption, and reducing the variation in plating thickness of the workpiece during the plating process and making the plating thickness uniform to improve the plating quality.
2. In Paragraph 1, The above plating tank (40) A plating solution circulation pipe (41) installed to lower the electrolytic heat generated during plating; A wastewater drain (42) installed at the top and bottom of the plating tank (40) to discharge the waste plating solution to the outside after the process is completed; A circulation pipe (43) that allows the plating solution inside the plating tank (40) to be transferred to a filter and circulated by the plating solution input; A gas discharge line (44) for discharging gas generated inside the plating tank (40) to the outside; An air injection unit (45) is installed on the upper side of the plating tank (40) so as to be positioned on the same horizontal line as the gas discharge line (44), and injects air toward the inside of the plating tank (40) to move the gas toward the gas discharge line (44) when gas is generated inside the plating tank (40); An electroplating barrel plating device characterized by having positive and negative electrodes installed inside the barrel.
3. In paragraph 1 The above plating tank (40) A plurality of plating tanks (40) are connected in one direction and installed continuously, so that the barrel (10) can be transported in one direction while contained in the plurality of plating tanks (40), and roller rails (32) are installed on both upper sides of the plating tanks (40). An electroplating barrel plating device characterized by having positive and negative electrodes installed inside the barrel, wherein roller parts (24) formed on both sides of a pickup part (20) installed on the upper part of the barrel (10) and which rotates and moves the barrel (10) are rotated in correspondence, so that the barrel (10) can move to both sides of the plating tank (40) along the roller rail (32) of the plating tank (40).

Description

Barrel plating device in which both the anode and cathode are installed inside the barrel in electroplating The present invention relates to an electro-barrel plating apparatus for plating screws and bolts. Generally, plating methods can be broadly classified into rack plating and barrel plating. Rack plating is a method of plating in which the workpiece is hung on a jig or hook. Plating can be performed with fewer restrictions on the size or shape of the product, and There are no anodes or obstacles, and the short distance from the product ensures good uniformity of plating thickness. In addition, it has the advantage of a shorter time required to achieve a uniform plating thickness compared to barrel plating. On the other hand, there is a disadvantage in that work efficiency is poor and manpower is required due to the procedure of individually hanging and removing the objects to be plated. Barrel plating is a method of plating a large quantity of small items (workpieces) at once. The barrel plating method has high productivity, and due to its characteristics, it is also possible to achieve a high-gloss finish. On the other hand, it has the disadvantage of poor plating thickness uniformity and requires a longer time to achieve the same plating thickness compared to rack plating. Additionally, it requires the use of higher voltage than rack plating and necessitates significant caution regarding current flow. Accordingly, there is an urgent need to develop a plating device that can overcome the aforementioned disadvantages of plating and possesses an efficient plating method. FIG. 1 is a drawing of an embodiment showing a connection structure between a cathode and an anode and an auxiliary anode according to the present invention. FIGS. 2 and FIGS. 3 are drawings of an embodiment showing a barrel and a plating bath according to the present invention. Before describing various embodiments of the present invention in detail, it will be understood that the application is not limited to the details of the configuration and arrangement of components described in the following detailed description or illustrated in the drawings. The present invention may be embodied and practiced in other embodiments and may be carried out in various ways. Furthermore, it will be understood that the expressions and terms used herein regarding device or element orientations (e.g., "front," "back," "up," "down," "top," "bottom," "left," "right," "lateral") are used merely to simplify the description of the present invention and do not indicate or imply that the related device or element must simply have a specific orientation. Additionally, terms such as "first" and "second" are used in this and the appended claims for illustrative purposes and are not intended to indicate or imply relative importance or intent. The present invention has the following features to achieve the above objective. Preferred embodiments of the present invention will be described in detail below with reference to the attached drawings. Prior to this, terms and words used in this specification and claims should not be interpreted as being limited to their ordinary or dictionary meanings. Instead, based on the principle that the inventor can appropriately define the concepts of terms to best describe his invention, they should be interpreted in a meaning and concept consistent with the technical spirit of the present invention. Therefore, it should be understood that the embodiments described in this specification and the configurations illustrated in the drawings are merely the most preferred embodiments of the present invention and do not represent all of the technical ideas of the present invention, and that various equivalents and modifications that can replace them may exist at the time of filing this application. Hereinafter, a barrel plating apparatus with positive and negative electrodes installed inside an electroplating barrel according to a preferred embodiment of the present invention will be described in detail with reference to FIGS. 1 to 5. The electroplating barrel plating device according to the present invention, which is an electroplating barrel plating device for plating a screw and a bolt that are gold objects, is composed of a plating tank (40), a barrel (10), an auxiliary anode (60), and an anode power supply unit (71). The plating tank (40) is a treatment tank filled with plating solution and into which the barrel (10), to be described later, is submerged. This plating tank (40) is further equipped with a plating solution circulation pipe (41), a wastewater drain (42), a circulation pipe (43), a gas discharge line (44), and an air injection part (45). The above plating solution circulation pipe (41) is a pipe installed inside the plating tank (40) to reduce the electrolytic heat generated during plating. The above wastewater drain (42) is a drain pipe connected to the upper and lower ends of the plating tank (40) to discharge the waste