KR-20260067006-A - FLEXIBLE SURFACE-ENHANCED RAMAN SCATTERING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Abstract

One embodiment of the present invention provides a flexible surface-enhanced Raman scattering substrate having a structure comprising a flexible substrate, a trench portion including a plurality of convex portions and a plurality of concave portions located on the flexible substrate, a first metal particle layer located on the plurality of convex portions, and a second metal particle layer located on the plurality of concave portions, thereby providing an effect capable of controlling the nanogap.

Inventors

• 이용희
• 안치원
• 한희
• 조수호
• 최소담
• 하휘헌
• 박재홍

Assignees

• 한국과학기술원

Dates

Publication Date

20260512

Application Date

20241105

Claims (17)

1. Flexible substrate; A trench portion comprising a plurality of convex portions and a plurality of concave portions located on the flexible substrate; A first metal particle layer located on the plurality of convex portions; and A flexible surface-enhanced Raman scattering substrate characterized by including a second metal particle layer located on the plurality of concave portions.
2. In Article 1, When the flexible substrate is bent so that the spacing between the plurality of convex portions becomes closer, A flexible surface-enhanced Raman scattering substrate characterized by adjusting the nano-gap between the first metal particle layers located on the convex portion, thereby improving Raman signal sensitivity compared to before bending the flexible substrate.
3. In Article 1, A flexible surface-enhanced Raman scattering substrate characterized by the radius of curvature of the flexible substrate being 10R to 15R.
4. In Article 1, A flexible surface-enhanced Raman scattering substrate characterized by the spacing of the convex portions being 20 nm to 200 nm.
5. In Article 1, A flexible surface-enhanced Raman scattering substrate characterized by the width of the convex portion being 20 nm to 200 nm.
6. In Article 1, A flexible surface-enhanced Raman scattering substrate characterized by the height of the convex portion being 10 nm to 400 nm.
7. In Article 1, A flexible surface-enhanced Raman scattering substrate characterized in that the height of the first metal particle layer is 50% to 100% of the convex spacing.
8. In Article 1, A flexible surface-enhanced Raman scattering substrate characterized in that the height of the second metal particle layer is 100% or less of the spacing of the convex portions.
9. In Article 1, A flexible surface-enhanced Raman scattering substrate characterized by comprising one or more types from the group consisting of a polymer substrate including polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polyimide (PI), and a metal foil.
10. In Article 1, A flexible surface-enhanced Raman scattering substrate characterized in that the above trench portion comprises one or more materials selected from the group consisting of a photocurable synthetic resin, polydimethylsiloxane (PDMS), polyurethane acrylate (PUA), and negative photoresist.
11. In Article 1, A flexible surface-enhanced Raman scattering substrate characterized in that the first metal particle layer comprises one or more types selected from the group consisting of silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), and palladium (Pd).
12. In Article 1, A flexible surface-enhanced Raman scattering substrate characterized in that the second metal particle layer comprises one or more types from the group consisting of silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), and palladium (Pd).
13. A step of forming a trench portion including a plurality of convex portions and a plurality of concave portions on a flexible substrate; and A method for manufacturing a flexible surface-enhanced Raman scattering substrate characterized by including the step of forming a first metal particle layer on the plurality of convex portions and a second metal particle layer on the plurality of concave portions.
14. In Paragraph 13, The step of forming the trench section above is, A step of applying a solution containing a photocurable polymer onto a mold having a shape corresponding to the shape of the trench portion and positioning a flexible substrate on the applied solution containing the photocurable polymer; and A method for manufacturing a flexible surface-enhanced Raman scattering substrate characterized by including the step of curing a solution containing the photocurable polymer applied on the mold by irradiating it with UV light and then removing the mold.
15. In Paragraph 14, A method for manufacturing a flexible surface-enhanced Raman scattering substrate, characterized in that the above-mentioned photocurable polymer comprises one or more types selected from the group consisting of photocurable synthetic resin, polydimethylsiloxane (PDMS), polyurethane acrylate (PUA), and negative photoresist.
16. In Paragraph 13, A method for manufacturing a flexible surface-enhanced Raman scattering substrate, characterized in that the first metal particle layer comprises one or more types from the group consisting of silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), and palladium (Pd).
17. In Paragraph 13, A method for manufacturing a flexible surface-enhanced Raman scattering substrate, characterized in that the second metal particle layer comprises one or more types selected from the group consisting of silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), and palladium (Pd).

Description

Flexible Surface-Enhanced Raman Scattering Substrate and Method of Manufacturing the Same The present invention relates to a surface-enhanced Raman scattering substrate, and more specifically, to a flexible surface-enhanced Raman scattering substrate utilizing the flexible properties of the substrate and a method for manufacturing the same. Although conventional sensors based on flexible surface-enhanced Raman scattering substrates are utilized for field diagnostics using flexible substrates, they have relatively low sensitivity and somewhat poor reproducibility because it is difficult to find correlations between changes in Raman intensity and deformation. Although various studies are being conducted in this regard, there are still many problems, such as irregular buckling patterns and difficulty in predicting sensitivity based on shape changes even when using flexible substrates, or limitations in the sensing area due to the formation of local nanogaps. Therefore, research on sensors based on high-sensitivity, flexible surface-enhanced Raman scattering substrates is necessary. FIG. 1 is a flowchart showing the steps of a method for manufacturing a flexible surface-enhanced Raman scattering substrate according to one embodiment of the present invention. FIG. 2 is a flowchart showing detailed steps of forming a trench portion including a plurality of convex portions and a plurality of concave portions on a flexible substrate in a method for manufacturing a flexible surface-enhanced Raman scattering substrate according to one embodiment of the present invention. FIG. 3 is a schematic diagram briefly illustrating the principle of a flexible surface-enhanced Raman scattering substrate according to one embodiment of the present invention. FIG. 4 is a schematic diagram briefly showing a trench formed on a flexible substrate, comprising a plurality of convex portions and a plurality of concave portions. FIG. 5 is a schematic diagram briefly showing the first metal particle layer and the second metal particle layer formed on the trench portion. FIG. 6 is a schematic diagram briefly illustrating the steps of a method for manufacturing a flexible surface-enhanced Raman scattering substrate according to one embodiment of the present invention. FIG. 7 is a photograph showing an experimental method for actually bending a flexible surface-enhanced Raman scattering substrate according to one embodiment of the present invention. Figure 8 is an SEM image of a transfer sample prepared by applying a solution containing a photocurable polymer onto a mold with a shape corresponding to the shape of the trench portion. Figure 9 is an SEM image of a sample having a first metal particle layer and a second metal particle layer deposited on the trench portion. Figure 10 is the result of a Raman measurement experiment of a flexible surface-enhanced Raman scattering substrate according to one embodiment of the present invention. FIG. 11 is a schematic diagram to help calculate the nanogap distance according to the bending of a flexible surface-enhanced Raman scattering substrate according to one embodiment of the present invention. The present invention will be described below with reference to the attached drawings. However, the present invention may be implemented in various different forms and is therefore not limited to the embodiments described herein. Furthermore, in order to clearly explain the present invention in the drawings, parts unrelated to the explanation have been omitted, and similar parts throughout the specification have been given similar reference numerals. Throughout the specification, when it is stated that a part is "connected (connected, in contact, combined)" with another part, this includes not only cases where they are "directly connected," but also cases where they are "indirectly connected" with other members interposed between them. Furthermore, when it is stated that a part "includes" a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but rather allows for the inclusion of additional components. The terms used herein are merely for describing specific embodiments and are not intended to limit the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this specification, terms such as “comprising” or “having” are intended to indicate the presence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof. Embodiments of the present invention will be described in detail below with reference to the attached drawings. Conventional flexible surface-enhanced Raman scattering substrates could not escape the problem of relatively low sensitivity and a lack of information reg