KR-20260067010-A - Printed circuit heat exchanger for improving heat transfer efficiency and method for manufacturing the same

Abstract

According to one embodiment of the technical concept of the present invention, a printed circuit board type heat exchanger for improving heat transfer efficiency and a method for manufacturing the same relates to a printed circuit board type heat exchanger and a method for manufacturing the same, wherein the lower cross-sectional shape of the flow path of the printed circuit board type heat exchanger is a W-shaped curve, thereby enabling the generation of regular and symmetrical vortices and an increase in the heat exchange area, and comprises a plurality of flow paths, wherein the cross-sectional shape of at least one flow path is composed of an upper shape and a lower shape, wherein the upper shape is a horizontal straight line and the lower shape is a W-shaped left-right symmetrical curve.

Inventors

• 김창현
• 도규형
• 김태훈
• 유화롱
• 김민창
• 배준혁
• 한용식
• 최병일

Assignees

• 한국기계연구원

Dates

Publication Date

20260512

Application Date

20241105

Claims (13)

1. In a method for manufacturing a printed circuit board type heat exchanger, A step of forming concave channels extending longitudinally and having an open top on the upper surface of a first metal plate; A step of connecting two mutually adjacent Euros along the longitudinal direction; and A method for manufacturing a printed circuit board type heat exchanger characterized by including the step of positioning and joining a second metal plate on the upper surface of a first metal plate.
2. In Article 1, A method for manufacturing a printed circuit board type heat exchanger characterized in that no flow path is formed on the lower surface of the second metal plate.
3. In Article 1, The cross-section of the Euros is semicircular, and A method for manufacturing a printed circuit board type heat exchanger characterized by having an open top and being interconnected by a connecting space with a depth smaller than the diameter of the flow path.
4. In Paragraph 3, A method for manufacturing a printed circuit board type heat exchanger, characterized in that the connection space is formed by etching the Euros in a first etching step and then etching them in a second etching step.
5. In Paragraph 3, A method for manufacturing a printed circuit board type heat exchanger characterized in that the cross-sectional lower shape of the interconnected Euros is a W-shaped curve.
6. In a printed circuit board type heat exchanger comprising a plurality of flow paths, At least one cross-sectional shape of the Euro consists of an upper shape and a lower shape, The upper shape is a horizontal straight line, and A printed circuit board type heat exchanger characterized by a lower shape that is a W-shaped left-right symmetrical curve.
7. In Article 6, A printed circuit board type heat exchanger characterized in that the lower shape contacts only at both ends of the upper shape.
8. In a printed circuit board type heat exchanger comprising a plurality of flow paths, At least one cross-sectional shape of the Euro consists of an upper shape and a lower shape, The upper shape is a horizontal straight line, and A printed circuit board type heat exchanger characterized in that the lower shape is a shape in which a first downward convex curve, an upward convex curve, and a second downward convex curve are continuously connected.
9. In Article 8, A printed circuit board type heat exchanger characterized in that the upward convex curve has a left-right symmetrical shape, and the first downward convex curve and the second downward convex curve have the same shape.
10. In Article 9, A printed circuit board type heat exchanger characterized by an upward convex curve that is spaced apart from the upper shape.
11. In a printed circuit board type heat exchanger formed by stacking and connecting metal plates having formed channels, The first metal plate is located beneath the second metal plate, and A flow path is not formed on the lower surface of the second metal plate, and On the upper surface of the first metal plate, a channel with an open top and a concave bottom is formed and extends along the longitudinal direction, and A printed circuit board type heat exchanger characterized by having a convex protrusion extending along the longitudinal direction located at the lower part of a concavely formed channel.
12. In Article 11, The cross-section of the protrusion is symmetrical, and A printed circuit board type heat exchanger characterized by the cross-section of the Euro being symmetrical with respect to the protrusion.
13. In Article 12, A printed circuit board type heat exchanger characterized in that the cross-section of the protrusion has a curved shape.

Description

Printed circuit heat exchanger for improving heat transfer efficiency and method for manufacturing the same The present invention relates to a printed circuit board type heat exchanger for improving heat transfer efficiency and a method for manufacturing the same. More specifically, the invention relates to a printed circuit board type heat exchanger and a method for manufacturing the same, wherein the shape of the lower cross-section of the flow path of the printed circuit board type heat exchanger is a W-shaped curve, thereby enabling the generation of regular and symmetrical vortices and an increase in the heat exchange area. A Printed Circuit Heat Exchanger (PCHE) is a heat exchanger designed to withstand extreme environments such as high pressure and low temperature, and is capable of providing stable structural and thermal fluid performance in cryogenic environments such as liquid hydrogen. A printed circuit board type heat exchanger is formed by stacking and combining multiple metal plates, and generally, one fluid flows through a single metal plate, while two or more fluids flow alternately across multiple layers to enable heat exchange between a high-temperature fluid and a low-temperature fluid. In a printed circuit board type heat exchanger, the heat transfer performance and flow characteristics vary depending on the cross-sectional shape of the heat exchanger. FIG. 1 is a diagram showing the cross-sectional shape of a flow path of a conventional printed circuit board type heat exchanger, and FIG. 2 shows the internal flow of a flow path when sloshing occurs in a flow path where the cross-section of a conventional printed circuit board type heat exchanger is semicircular. In the case of the semicircular cross-section flow path (11) of the printed circuit board type heat exchanger (10) shown in FIG. 1(a), it has the advantage of being structurally stable and advantageous under high pressure conditions, but it has the disadvantage that the heat transfer area is not large, so the efficiency may be somewhat lower, and in the case of the rectangular cross-section flow path (21) of the printed circuit board type heat exchanger (20) shown in FIG. 1(b), the heat transfer area increases, but the fluid flow may be uneven at the corners. In addition, when a conventional printed circuit board type heat exchanger generates radial flow inside due to sloshing (shaking/movement), there is a problem in that vortices can be formed in somewhat irregular shapes and sizes, as shown in Fig. 2, in the case of a flow path with a semicircular cross-section. Many inventors recognize that heat transfer performance and flow characteristics vary depending on the shape of the heat exchanger's flow path, and they are researching and developing printed circuit board type heat exchangers that can improve heat transfer efficiency by generating regular and left-right symmetrical vortices and increasing the heat exchange area, but satisfactory results have not been obtained to date. A brief description of each drawing is provided to help to better understand the drawings cited in this specification. Figure 1 is a drawing illustrating the cross-sectional shape of a flow path of a conventional printed circuit board type heat exchanger. Figure 2 illustrates the internal flow of a flow path when sloshing occurs in a flow path where the cross-section of a conventional printed circuit board type heat exchanger is semicircular. FIG. 3 illustrates an etching step performed by a method for manufacturing a printed circuit board type heat exchanger according to a first embodiment of the technical concept of the present invention. FIG. 4 illustrates an example of forming a flow path with a W-shaped cross section by a method for manufacturing a printed circuit board type heat exchanger according to a first embodiment of the technical concept of the present invention. FIG. 5 illustrates another example of forming a flow path with a W-shaped cross section by a method for manufacturing a printed circuit board type heat exchanger according to the first embodiment of the technical concept of the present invention. FIG. 6 illustrates the lamination and diffusion bonding steps performed by the method for manufacturing a printed circuit board type heat exchanger according to the first embodiment of the technical concept of the present invention. FIG. 7 illustrates the internal flow of a flow path when sloshing occurs in a flow path with a W-shaped cross section formed by the method of manufacturing a printed circuit board type heat exchanger according to the first embodiment of the technical concept of the present invention. FIG. 8 is a drawing illustrating the shapes of the flow paths of a printed circuit board type heat exchanger according to embodiments of the technical concept of the present invention. The present invention is capable of various modifications and may have various embodiments, and specific embodiments are illustrated in the drawings