KR-20260067036-A - Probe card

Abstract

A probe card is provided. A probe card according to one aspect of the present invention is a probe card that electrically connects a test head and a wafer, comprising: a card having one side and another side; a plurality of probes provided on one side of the card; and a plurality of pogo blocks connected to a plurality of pads provided on the other side of the card; wherein the plurality of pogo blocks each include an interposer that transmits an electrical signal and a housing on which the interposer is mounted.

Inventors

• 박상영
• 김우준

Assignees

• 주식회사 비이링크

Dates

Publication Date

20260512

Application Date

20241105

Claims (20)

1. As a probe card that electrically connects the test head and the wafer, A card having one side and the other side; A plurality of probes provided on one side of the above card; and A plurality of pogo blocks fastened to a plurality of pads provided on the other side of the above card; comprising, A probe card comprising a plurality of the above-mentioned pogo blocks, an interposer that transmits electrical signals, and a housing on which the interposer is mounted.
2. In Article 1, The above interposer is a probe card, one end of which is connected to the test head and the other end of which is connected to the pad.
3. In Article 1, Multiple of the above pads are formed in two or more different shapes, and A plurality of the above-mentioned pogo blocks, A probe card in which the cross-sectional shape perpendicular to the longitudinal direction of the above pogo block is formed in two or more different shapes corresponding to the pad.
4. In Article 1, The above pogo block is a probe card that is detachable from the pad.
5. In Article 1, A plurality of the above pads are arranged to form a predetermined pattern on the other side of the card, and The above pogo block is a probe card placed at a position corresponding to the above pattern.
6. In Article 1, The above housing is, A top plate having a plurality of first holes formed that penetrate one side and the other side; A bottom plate having a plurality of second holes formed that penetrate one side and the other side; and A probe card comprising a middle plate disposed between the top plate and the bottom plate.
7. In Article 6, The above interposer is, A plurality of top contactors inserted into the first hole above; A plurality of bottom contactors inserted into the second hole; and A probe card comprising: a conductor disposed between the top plate and the bottom plate, wherein one end is electrically connected to the top contactor and the other end is electrically connected to the bottom contactor.
8. In Article 7, The above middle plate includes a plurality of third holes penetrating one side and the other side of the above middle plate, and The above conductor is a probe card that penetrates the third hole.
9. In Article 7, A probe card further comprising a spacer disposed at one or more positions between the middle plate and the top plate or between the middle plate and the bottom plate.
10. In Article 9, The above spacers are provided in a plurality, and are formed such that the sum of the thicknesses of the middle plate and the plurality of spacers corresponds to a predetermined first distance. One end of the top contactor and the other end of the bottom contactor are partially inserted into the spacer, and The above first distance is, A probe card corresponding to the sum of the distance between one end of the conductor and the other end of the conductor, and the depth to which the top contactor and the bottom contactor are inserted into the spacer.
11. In Article 9, The above spacers are provided in a plurality, and are formed such that the sum of the thicknesses of the middle plate and the plurality of spacers corresponds to a predetermined first distance. The above first distance is, A probe card corresponding to the distance between one end of the conductor and the other end of the conductor.
12. In Article 7, The thickness of the above middle plate is formed to correspond to a predetermined first distance, and One end of the top contactor and the other end of the bottom contactor are partially inserted into the middle plate, and The above first distance is, A probe card corresponding to the sum of the distance between one end of the conductor and the other end of the conductor, and the depth to which the top contactor and the bottom contactor are inserted into the middle plate.
13. In Article 9, The above spacer includes a plurality of fourth holes penetrating one side and the other side of the spacer, and The above conductor is a probe card inserted into the above fourth hole.
14. In Article 7, A plurality of fifth holes are formed penetrating one side and the other side, and further include a top holder disposed on the other side of the top plate, The above top contactor is a probe card that simultaneously penetrates the first hole and the fifth hole.
15. In Article 7, A plurality of sixth holes are formed penetrating one side and the other side, and further include a bottom holder disposed on one side of the bottom plate. The above bottom contactor is a probe card that simultaneously penetrates the above second hole and the above sixth hole.
16. In Article 7, A probe card in which at least one of the top contactor and the bottom contactor is formed as a pogo pin.
17. In Article 7, The above conductor is formed in the shape of a bar extending in one direction, a probe card.
18. In Article 7, The above conductor includes the one end and the other end and a connecting portion connecting the one end and the other end, wherein A probe card formed in a shape that can be bent from the connecting portion so that the above-mentioned first end and the above-mentioned other end are oriented in the same direction.
19. In Article 18, The above conductor is formed as a flexible circuit board, A probe card in which the portion in contact with the top contactor and the bottom contactor is formed of an electrically conductive material.
20. In Article 6, The above housing further includes a refrigerant flow path through which refrigerant can flow, a probe card.

Description

Probe card The present invention relates to a probe card, and more specifically, to a probe card having a pogo block directly connected to a tester head. Generally, a wafer prober, a type of semiconductor inspection equipment, is a device that checks for defects by inspecting the electrical characteristics of semiconductor devices manufactured on a wafer immediately before it enters the back-end process, after the entire front-end process has been completed. In a semiconductor wafer on which a plurality of semiconductor devices are formed, a probe is used as a wafer inspection device to inspect the electrical characteristics of each semiconductor device. The probe is equipped with a probe card having a probe provided on one side facing the wafer. The probe card is equipped with a plurality of probes, which are contact terminals, on one surface facing each electrode pad or each solder bump of the semiconductor device on the wafer. A plurality of probes provided on the probe card come into contact with the electrode pads or solder bumps of the semiconductor device, and by allowing each probe to flow a test signal to the electrical circuit of the semiconductor device connected to each electrode pad or each solder bump, the conduction status of the electrical circuit is tested. Figure 1 is a diagram illustrating the use of a conventional probe card. Referring to FIG. 1, the conventional probe card (1') includes a conventional card (20') with a probe (30) mounted on the lower side, a conventional interposer (10') mounted on the upper side of the conventional card (20'), a printed circuit board (40') and a reinforcing plate (50') connected to the upper side of the interposer (10'), and a conventional pogo block (10'') disposed within the reinforcing plate (50'), coupled to the printed circuit board (40') on one side and coupled to the test head (2) on the other side. In a conventional probe card (1'), a plurality of interposers (10') were connected to a printed circuit board (40') placed at the bottom of a conventional pogo block (10''), but as the number of interposers (10') increased, there was a problem in that the printed circuit board (40') supporting the weight of the interposers (10') would bend. To solve this problem, the conventional probe card (1') is equipped with a reinforcing plate (50') to reinforce the bending rigidity of the printed circuit board (40'). At this time, as the area of the interposer (10') connected to the printed circuit board (40') increases, the bending load applied to the printed circuit board (40') increases, and in response, the thickness of the reinforcing plate (50') and the printed circuit board (40') increases. As a result, the conventional probe card (1') had a problem of becoming unnecessarily thick in the vertical direction as the thickness of the reinforcing plate (50'), the thickness of the printed circuit board (40'), the length of the interposer (20'), and the thickness of the card (20') were added together. In addition, to cope with bending loads, the reinforcing plate (50') is formed with an area smaller than the area of the test head (2), and the printed circuit board (40') is formed with an area smaller than the area of the reinforcing plate (50'). Accordingly, the bonding area of the interposer (10') bonded on the printed circuit board (40') is also formed to be smaller than the area of the printed circuit board (40'). Accordingly, the card (20') of the conventional probe card (1') is formed with a relatively narrow area to account for bending loads. As the conventional probe card (1') is formed with a narrow area, there was a problem in that the size of the wafer (3') inspected by the conventional probe card (1') was also limited. In addition, in the case of a conventional probe card (1'), an interposer (10') is arranged in a shape corresponding to the pads of the card (20') constituting the probe card (1'). At this time, the pads are composed of multiple pads and have various shapes or various arrangements depending on the type of wafer or probe to be inspected. A plurality of interposers (10') provided in a conventional probe card (1') are provided in a single pogo block, and a structure is adopted in which a single pogo block is connected to all the pads constituting the probe card. Accordingly, even if only some of the numerous interposers (10') of the pogo block that come into contact with the pad of the conventional probe card (1') are damaged, it is very difficult to replace or repair the part in question because the pogo block is made as a single unit. In addition, as the size of the conventional probe card (1') increased, a problem occurred in which bending occurred due to the load of the pogo block itself. In addition, there was a problem where the entire pogo block had to be remanufactured or reprocessed if a small error occurred in a part of the manufacturing process due to the pogo block itself. In addition, the pad arrangement of the conventional p