Search

KR-20260067149-A - SUBSTRATE TREATING APPARATUS MOUNTED WITH SUBSTRATE HEATING PART

KR20260067149AKR 20260067149 AKR20260067149 AKR 20260067149AKR-20260067149-A

Abstract

The present invention relates to a substrate processing apparatus equipped with a substrate heating unit, comprising: a ring-shaped spin chuck having a chuck pin installed on its upper portion for horizontally supporting a substrate; a chuck base including a chuck support formed horizontally on the inside of the spin chuck and rotatably installed around a vertical rotation axis; a bag nozzle assembly installed through a hollow portion formed in the center of the chuck base for spraying a processing liquid onto the lower surface of the substrate; and a cover glass disposed between the substrate and the chuck support, installed on the spin chuck in a state facing the chuck support, covering the upper opening of the spin chuck, and having a through hole formed in the center through which the bag nozzle assembly passes. The substrate heating unit comprises a plurality of heating lamps, which are disposed between the cover glass and the chuck support and installed on the inner circumferential surface of the spin chuck in a state facing the cover glass, and which are installed on the upper surface of the lamp support module and the lamp support module; wherein at least one of the plurality of heating lamps is configured as a reflective heating lamp, and a reflector plate is installed at a position close to the reflective heating lamp to reflect light irradiated from the at least one reflective heating lamp to a predetermined position on the substrate, so that even if the back nozzle assembly protrudes upward through the cover glass, the light irradiated from the reflective heating lamp is reflected at an appropriate angle by the reflector plate and reaches a predetermined point on the substrate, such as the center of the substrate or near the edge of the substrate, thereby enabling the entire substrate to be heated uniformly.

Inventors

  • 김준혁

Assignees

  • 주식회사 디바이스

Dates

Publication Date
20260512
Application Date
20241105

Claims (10)

  1. A ring-shaped spin chuck having a chuck pin installed on the upper portion to horizontally support a substrate, and a chuck base including a chuck support formed horizontally on the inside of the spin chuck and installed to be rotatable about a vertical rotation axis; A back nozzle assembly installed through a hollow portion formed in the center of the chuck base to spray a processing liquid onto the lower surface of a substrate; A cover glass disposed between the substrate and the chuck support and installed on the spin chuck in a state facing the chuck support, covering the upper opening of the spin chuck, and having a through hole formed in the center through which the back nozzle assembly passes; and A substrate heating unit comprising a plurality of heating lamps disposed between the cover glass and the chuck support member and installed on the inner circumferential surface of the spin chuck in a state facing the cover glass, and installed on the upper surface of the lamp support module and the lamp support module; Includes, A substrate processing apparatus equipped with a substrate heating unit, characterized in that at least one of the plurality of heating lamps is configured as a reflective heating lamp, and a reflector is installed at a position close to the reflective heating lamp to reflect light irradiated from the at least one reflective heating lamp to a predetermined position on the substrate.
  2. In paragraph 1, The above reflector is, A base plate installed on the upper surface of the lamp support module above; A connecting plate extending upward from one end of the base plate; and A reflective plate configured to extend from the top of the above-mentioned connecting plate at an obtuse angle relative to the above-mentioned connecting plate and cover at least a portion of the above-mentioned reflective heating lamp when viewed in a plan view; A substrate processing device equipped with a substrate heating unit characterized by being configured to include
  3. In paragraph 2, A substrate processing device equipped with a substrate heating unit, characterized in that the above-mentioned connecting plate and reflective plate are hinge-connected to each other and configured to rotate relative to each other around a boundary.
  4. In paragraph 1, A substrate processing device equipped with a substrate heating unit, characterized in that the above-mentioned reflective heating lamp and reflector are arranged on a virtual straight line following the radial direction of the substrate with respect to the rotation axis.
  5. In paragraph 4, A substrate processing device equipped with a substrate heating unit, characterized in that a plurality of first positioning holes are formed radially spaced apart from each other on the upper surface of the lamp support module with respect to the center of the substrate, and a connecting rod inserted into the first positioning holes is formed on the base plate.
  6. In any one of paragraphs 1 through 5, A substrate processing apparatus equipped with a substrate heating unit, wherein the above-mentioned reflector includes a first reflector positioned further from the center of the substrate along a radial direction than the reflective heating lamp, and the first reflector is positioned to reflect light irradiated from the reflective heating lamp toward the vicinity of the center of the substrate.
  7. In any one of paragraphs 1 through 5, A substrate processing apparatus equipped with a substrate heating unit, wherein the above-mentioned reflector includes a second reflector positioned closer to the center of the substrate along a radial direction than the reflective heating lamp, and the second reflector is positioned to reflect light irradiated from the reflective heating lamp toward the vicinity of the edge of the substrate.
  8. In any one of paragraphs 1 through 5, A substrate processing apparatus equipped with a substrate heating unit, wherein the reflector comprises a first reflector positioned further away from the center of the substrate along a radial direction than the reflective heating lamp, wherein the first reflector is positioned to reflect light irradiated from the reflective heating lamp toward the vicinity of the center of the substrate, and the reflector further comprises a second reflector positioned closer to the center of the substrate along a radial direction than the reflective heating lamp, wherein the second reflector is positioned to reflect light irradiated from the reflective heating lamp toward the vicinity of the edge of the substrate, and wherein the first reflector is positioned closer to the center of the substrate than the second reflector.
  9. In paragraph 2 or 3, A substrate processing device equipped with a substrate heating unit, characterized in that a plurality of second positioning holes are formed on the upper surface of the lamp support module, spaced apart from each other in a circumferential direction with respect to the center of the substrate, and a connecting rod inserted into the second positioning holes is formed on the base plate.
  10. In any one of paragraphs 1 through 5, A substrate processing device equipped with a substrate heating unit, characterized in that the above-mentioned reflective heating lamp is controlled independently of the remaining heating lamps.

Description

Substrate treating apparatus mounted with substrate heating part The present invention relates to a substrate processing apparatus equipped with a substrate heating unit, and more specifically, to a substrate processing apparatus equipped with a substrate heating unit configured such that radiant heat from the substrate heating unit can be uniformly transferred to the entire surface of the substrate. A substrate processing device is a device for depositing, developing, etching, or cleaning substrates such as semiconductor wafers, display substrates, optical disc substrates, magnetic disc substrates, photomask substrates, ceramic substrates, and solar cell substrates using a processing solution. Among these, the cleaning process is a process for removing foreign substances or particles present on the substrate, and a typical example is a process in which the substrate is supported on a chuck base (spin head) and rotated at high speed while a processing liquid is supplied to the surface or back side of the substrate for processing. In this case, if a substrate heating element such as an LED is installed on the underside of the substrate and the substrate is heated and rotated to process the substrate, the reaction occurs quickly, which reduces the amount of processing solution used. This has the advantage of minimizing environmental pollution, shortening processing time to increase productivity, and significantly reducing electricity consumption. Accordingly, various technologies and research have been conducted regarding substrate processing devices that rotate a substrate while it is heated. Meanwhile, as shown in FIG. 1, a chuck pin (5) for supporting a substrate (W) is installed on the upper surface of the chuck base (1), and a back nozzle assembly (2) is erected through the chuck base (1) at the lower center of the substrate (W) supported by the chuck pin (5) so as to spray a processing liquid toward the bottom surface of the substrate (W), and a substrate heating unit (3) equipped with a heating lamp such as an LED is installed oppositely on the lower side of the substrate (W). In addition, a cover glass (4) is installed between the substrate heating unit (3) and the substrate (W) to prevent the processing liquid sprayed from the bag nozzle assembly (2) from flowing into the substrate heating unit (3) and to allow the radiant heat of the substrate heating unit (3) to pass through smoothly. The above substrate heating unit (4) is positioned between the inner surface of the annular chuck base (1) and the outer surface of the back nozzle assembly (2), and the cover glass (4) is installed on the chuck base (1) in a spaced-apart position opposite to the substrate heating unit (3). In this case, the back nozzle assembly (2) protrudes above the cover glass (4), and the chuck base (1) to which the cover glass (4) is fixed is also positioned higher than the substrate heating unit (3), so the radiant heat generated from the substrate heating unit (3) is interfered with by the back nozzle assembly (2) and the chuck base (1), resulting in a disadvantage of reduced heat transfer effect. Of course, even though radiant heat is transferred to the center of the substrate (W) from a heating lamp located at a certain distance from the center of the substrate (W), a decrease in the heat transfer effect was inevitable because the distance became much greater than the minimum distance between the substrate (W) and the heating lamp. To prevent interference with such heat transfer, the substrate heating unit (3) may be distributed at a certain distance from the outer surface of the back nozzle assembly (2) and the inner surface of the chuck base (1), respectively; however, in this case, the area where the substrate heating unit (3) is distributed becomes narrow, which has the disadvantage of making it difficult to achieve a sufficient amount of heat transfer to the entire substrate (W). FIG. 1 is a cross-sectional view showing a substrate processing device equipped with a substrate heating unit according to the prior art. FIG. 2 is a perspective view showing a substrate processing device equipped with a substrate heating unit according to the present invention. FIG. 3 is a cross-sectional view showing a substrate processing device equipped with a substrate heating unit according to the present invention. Figure 4 is a perspective view showing the structure of the substrate heating section in Figure 3. FIG. 5 is a perspective view showing the structure of the reflector in FIG. 4, where (a) shows the first embodiment and (b) shows the second embodiment. FIG. 6 is a cross-sectional view showing a state in which light is intensively irradiated to the center of a substrate by a reflector according to the present invention. FIG. 7 is a perspective view showing the structure of a substrate heating unit according to another embodiment of the present invention. FIG. 8 is a partial cross-sectional view showing a substrate processing app