KR-20260067203-A - GLASS BOTTLE CLEANER

Abstract

The glass bottle cleaning device according to the present invention has a shoulder with an upper slanted shape and is an ultrasonic cleaning device for cleaning a glass bottle containing semiconductor chemical materials, comprising a conveying rail for conveying the glass bottle, a position sensor for detecting the position of the glass bottle moving along the conveying rail, a DI water injection nozzle that descends from the upper part of the opening of the glass bottle to inject DI water into the interior of the glass bottle, a rod-shaped ultrasonic generator that descends from the upper part of the opening of the glass bottle and is inserted into the interior of the glass bottle to output ultrasonic waves when the DI water injection is completed, and a water supply nozzle that descends from the upper part of the shoulder of the glass bottle to clean the exterior of the glass bottle with DI water.

Inventors

• 심재희

Assignees

• 주식회사 올도완

Dates

Publication Date

20260512

Application Date

20241105

Claims (7)

1. As an ultrasonic cleaner having a shoulder with a sloping upper shape and cleaning glass bottles containing semiconductor chemical materials, A conveyor rail for transporting glass bottles; A position sensor for detecting the position of a glass bottle moving along the above transfer rail; A DI water injection nozzle that descends from the upper part of the glass bottle opening and injects DI water into the glass bottle; A rod-shaped ultrasonic generator that descends from the upper part of the glass bottle opening and is inserted into the glass bottle to output ultrasound when DI water injection is completed; and An ultrasonic cleaner for cleaning a glass bottle containing semiconductor chemical materials, characterized by including a water supply nozzle that descends from the upper shoulder of the glass bottle and washes the exterior of the glass bottle with DI water.
2. In paragraph 1, An ultrasonic cleaner characterized by the above-mentioned water supply nozzle having a bent end shape that descends from the upper part of a slanted shoulder to spray DI water onto the surface of a glass bottle.
3. In paragraph 1, It further includes a control unit that controls the above-mentioned transfer rail, the discharge amount of the DI water injection nozzle, the ultrasonic generator, and the water supply nozzle, and An ultrasonic cleaner characterized by the above-described control unit controlling the discharge amount of the DI water injection nozzle to exceed the capacity of the glass bottle.
4. In paragraph 1, An ultrasonic cleaner characterized by the above-mentioned ultrasonic generator descending 165 mm to 190 mm from the opening of a glass bottle to generate ultrasonic waves.
5. In paragraph 4, An ultrasonic cleaner characterized by the above-mentioned ultrasonic generator descending from the opening of a glass bottle and oscillating at 20 kHz to 30 kHz for 30 to 40 seconds.
6. In paragraph 1, An ultrasonic cleaner characterized by the fact that the ultrasonic generator oscillates inside a glass bottle containing DI water, while the water supply nozzle cleans the outside of the glass bottle with DI water.
7. In paragraph 1, It further includes an upright plate that fixes the above-mentioned DI water injection nozzle, the above-mentioned ultrasonic generator, and the water supply nozzle, and A first gripper that moves up and down along a first track hole formed in the standing plate is connected to the DI water injection nozzle, and An ultrasonic cleaner characterized in that a second gripper, which moves up and down along a second track hole formed in the above-mentioned standing plate, is connected to the above-mentioned ultrasonic generator and water supply nozzle.

Description

Glass Bottle Cleaner The present invention relates to a glass bottle cleaning machine, and more specifically, to a device for cleaning glass bottles containing chemicals used in semiconductor processes. Many of the chemicals used in semiconductor manufacturing processes are unstable and contain solvents harmful to the human body. In particular, photoresist, which is used in large quantities during the photolithography process, is a chemical at risk of deterioration when exposed to air or sunlight. To prevent this deterioration, the bottles used to transport the photoresist are generally translucent dark brown. Using plastic bottles to hold photoresist has limitations because foreign substances may leach out from the inside. In semiconductor manufacturing processes, glass bottles containing photoresist have a fixed standard with a capacity of 1 gallon. In particular, if they deviate from the specified standard, they cannot be accurately secured to the mount that fixes the glass bottle in the semiconductor manufacturing process, making them unusable. In particular, there must be no particles ranging in size from tens of nanometers to tens of micrometers inside a 1-gallon glass bottle, and if particles are mixed into the photoresist during the photolithography process, it causes wafer defects. Therefore, washing the glass bottle is a very important process to ensure the photoresist is free of foreign substances. When cleaning glass bottles containing photoresist, wiping the inside or outside with a cloth or brush can cause new particles to form, and there is a difficulty in cleaning the bottles thoroughly without physical contact. To solve this, ultrasonic waves are applied while the glass bottle is submerged in water to remove particles attached to the glass bottle. However, when ultrasound is applied to a glass bottle containing photoresist to detach particles from the inner wall of the bottle, damage to the inner wall of the bottle occurs depending on the intensity and duration of the ultrasound. In addition, there is a problem in that the particles break down into smaller particles and reattach to the inner wall of the bottle, or some of the particles remain inside the bottle. FIG. 1 is a perspective view of an ultrasonic cleaner according to an embodiment of the present invention. FIG. 2 is an enlarged view of an ultrasonic generator according to an embodiment of the present invention. FIG. 3 is an enlarged view of a transfer rail according to an embodiment of the present invention. Figure 4 is a photograph showing the number of particles inside a glass bottle washed according to an embodiment of the present invention. Figure 5 is a photograph showing the number of particles measured inside a glass bottle washed according to Comparative Example 1. Figure 6 is a photograph showing the number of particles inside a glass bottle washed according to Comparative Example 2. Specific structural or functional descriptions of embodiments according to the concept of the present invention disclosed herein are provided merely for the purpose of explaining embodiments according to the concept of the present invention, and embodiments according to the concept of the present invention may be implemented in various forms and are not limited to the embodiments described herein. Embodiments according to the concept of the present invention may be subject to various modifications and may take various forms; therefore, embodiments are illustrated in the drawings and described in detail in this specification. However, this is not intended to limit the embodiments according to the concept of the present invention to specific disclosed forms, and includes modifications, equivalents, or substitutions that fall within the spirit and scope of the present invention. Terms such as "first" or "second" may be used to describe various components, but said components should not be limited by said terms. For the sole purpose of distinguishing one component from another, for example, without departing from the scope of rights according to the concept of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component. When it is stated that one component is "connected" or "connected" to another component, it should be understood that while it may be directly connected or connected to that other component, there may also be other components in between. Conversely, when it is stated that one component is "directly connected" or "directly connected" to another component, it should be understood that there are no other components in between. Expressions describing the relationships between components, such as "between," "exactly between," or "directly adjacent to," should be interpreted in the same way. The terms used herein are used merely to describe specific embodiments and are not intended to limit the invention. Singular expressions include plural expression