KR-20260067231-A - Substrate processing apparatus and substrate processing method using the same

Abstract

The technical concept of the present invention provides a substrate processing apparatus comprising: a substrate stage that supports and rotates a substrate; a dispenser that discharges a solution toward the edge of the substrate; and a heater that heats at least a portion of the edge of the substrate, wherein the dispenser and the heater are synchronized with an encoder signal of the substrate stage.

Inventors

• 김윤재
• 이주형
• 이민우
• 민준홍
• 이승돈
• 이현진
• 이호진
• 장주희

Assignees

• 삼성전자주식회사

Dates

Publication Date

20260512

Application Date

20241105

Claims (10)

1. A substrate stage that supports and rotates the substrate; A dispenser for dispensing a solution toward the edge of the substrate; and A heater that heats at least a portion of the edge of the substrate; comprising, A substrate processing apparatus characterized in that the dispenser and the heater are synchronized with the encoder signal of the substrate stage.
2. In paragraph 1, The above substrate includes a first substrate and a second substrate in contact in a first direction, and A substrate processing device characterized by the dispenser dispensing the solution between the first substrate and the second substrate.
3. In paragraph 2, A substrate processing device characterized in that the heater is spaced apart from the substrate in a second direction perpendicular to the first direction.
4. In paragraph 1, A substrate processing device characterized by further including a vision system that captures the edges of the substrate to acquire vision information.
5. In paragraph 4, A substrate processing device characterized in that the dispenser and the heater operate based on the vision information.
6. A step of acquiring an encoder signal of a substrate stage supporting a substrate; A step of discharging a solution toward the edge of the substrate based on a discharge signal synchronized with the encoder signal; A step of heating at least a portion of the edge of the substrate based on a heating signal synchronized with the encoder signal; A substrate processing method comprising the step of capturing the edge of the substrate to obtain vision information.
7. In paragraph 6, The step of discharging the solution toward the edge of the substrate is, A substrate processing method characterized by a dispenser dispensing the solution in a horizontal direction onto the substrate.
8. In Paragraph 7, A substrate processing method characterized in that the dispenser is turned on or turned off based on the vision information.
9. In Paragraph 7, The step of discharging the solution toward the edge of the substrate is, A substrate processing method characterized by the above dispenser dispensing a solution during a first period and a second period that are discontinuous from each other.
10. A substrate stage supporting a substrate including a first substrate and a second substrate in contact in a vertical direction; A dispenser that discharges a solution in a horizontal direction between the first substrate and the second substrate; A heater located adjacent to the above substrate in the horizontal direction; An encoder that generates an encoder signal including rotation information of the above-mentioned substrate stage; A dispensing controller that controls the operation of the dispenser with a discharge signal synchronized with the encoder signal; A current controller that controls the operation of the heater with a heating signal synchronized with the encoder signal; and A substrate processing device characterized by further including a vision system that captures the above substrate to acquire vision information.

Description

Substrate processing apparatus and substrate processing method using the same The present invention relates to a substrate processing apparatus and a substrate processing method using the same, and more specifically, to an apparatus and method for processing the edges of a substrate. In the manufacturing process of a semiconductor device, the thickness of a wafer can be reduced by performing a grinding process after performing a process of bonding wafers together. Due to the structure in which wafers are bonded together, gaps (or unbonded regions) may be formed where the wafers do not come into contact with each other. A wafer structure with such gaps may have weak mechanical strength, which can lead to breakage of the wafer structure (e.g., chipping) during subsequent processes such as the grinding process. FIG. 1 is a schematic perspective view of a substrate processing apparatus according to one embodiment of the technical concept of the present invention. FIG. 2a is a cross-sectional view showing an exemplary substrate structure processed by a substrate processing method according to one embodiment of the technical concept of the present invention. FIG. 2b is a plan view showing an exemplary substrate structure processed by a substrate processing method according to one embodiment of the technical concept of the present invention. FIG. 3 is a drawing for explaining a dispenser of a substrate processing device according to one embodiment of the technical concept of the present invention. FIG. 4 is a schematic cross-sectional view of a substrate structure for explaining a substrate processing apparatus according to one embodiment of the technical concept of the present invention. FIG. 5 is a schematic cross-sectional view of a substrate structure for explaining a substrate processing apparatus according to one embodiment of the technical concept of the present invention. FIG. 6 is a schematic flowchart for explaining a substrate processing method according to one embodiment of the technical concept of the present invention. Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Identical components in the drawings are denoted by the same reference numerals, and redundant descriptions thereof are omitted. In the following embodiments, terms such as first, second, etc. are used not in a limiting sense, but for the purpose of distinguishing one component from another component. In the following examples, singular expressions include plural expressions unless the context clearly indicates otherwise. FIG. 1 is a schematic perspective view of a substrate processing apparatus according to one embodiment of the technical concept of the present invention. FIG. 2a is a cross-sectional view showing an exemplary substrate structure processed by a substrate processing method according to one embodiment of the technical concept of the present invention. FIG. 2b is a plan view showing an exemplary substrate structure processed by a substrate processing method according to one embodiment of the technical concept of the present invention. FIG. 3 is a drawing for explaining a dispenser of a substrate processing apparatus according to one embodiment of the technical concept of the present invention. FIG. 4 is a schematic cross-sectional view of a substrate structure for explaining a substrate processing apparatus according to one embodiment of the technical concept of the present invention. Referring to FIG. 1, a substrate processing apparatus (1) according to various embodiments of the present invention may include a substrate stage (10), a dispenser (20), and a heater. The substrate stage (10) may be placed in a chamber for performing a semiconductor device manufacturing process on a substrate (W). The substrate stage (10) may include a chuck table (12) that supports the substrate (W) and a chuck rotating body (14) that rotates the chuck table (12). In a planar view, the outer shape of the chuck table (12) may be circular. The chuck table (12) may be composed of, for example, a disc-shaped frame formed using an alloy such as ceramics or stainless steel on the upper surface of the chuck table. A substrate (W) can be placed on the upper surface of the chuck table (12). In one embodiment, the lower surface of the substrate (W) and the upper surface of the chuck table (12) may be in direct contact. Various methods for fixing the substrate (W) may be applied to the chuck table (12). For example, the chuck table (12) may include a separate external member for fixing the substrate (W). The separate external member may be a fixing member that fixes the upper surface or side surface of the substrate (W). A member such as a support plate may be included on the upper surface of the chuck table (12) for fixing the substrate (W). For example, a member such as a support plate formed in the shape of a porous disc may be placed on the upper surface of the chuck table (12