KR-20260067280-A - Vision inspection method for pin type parts

KR20260067280AKR 20260067280 AKR20260067280 AKR 20260067280AKR-20260067280-A

Abstract

A vision inspection method for a pin-shaped component according to one embodiment of the present invention may include the steps of: a pin-shaped component being placed on the upper surface of an inspection stage in a tilted position; the pin-shaped component being corrected to an upright position based on a magnet; the pin-shaped component being rotated and the surface of the pin-shaped component being photographed; and a defect inspection of the pin-shaped component being performed based on a plurality of captured images of the surface of the pin-shaped component.

Inventors

권혁기
류지만
최상진
김성기
가인호

Assignees

(주)인스케이프

Dates

Publication Date: 20260512
Application Date: 20250304
Priority Date: 20241105

Claims (11)

A step in which a pin-shaped part is placed on the upper surface of an inspection stage in an inclined position; A step in which the pin-shaped part is corrected to an upright position based on a magnet; A step in which the pin-shaped part is rotated and the surface of the pin-shaped part is photographed; and A vision inspection method for a pin-shaped component, comprising the step of performing a defect inspection on the pin-shaped component based on a plurality of captured images of the surface of the pin-shaped component.
In paragraph 1, In the step where the above-mentioned pin-shaped part is corrected to an upright position, A vision inspection method for a pin-shaped part, wherein the magnet is moved relative to the pin-shaped part so that the pin-shaped part is corrected to the upright position.
In paragraph 2, In the step where the above-mentioned pin-shaped part is corrected to an upright position, A vision inspection method for a pin-shaped component, wherein the magnet driving unit that moves the magnet is controlled by a PI control method, with the goal of moving the magnet so that the central axis of the magnet and the central axis of the pin-shaped component are coaxial.
In paragraph 2, In the step where the above pin-shaped part is corrected to an upright position, A vision inspection method for a pin-shaped component, wherein the distance (M) for moving the magnet located on the lower side of the inspection stage toward the pin-shaped component in a horizontal direction is calculated using the formula M = KX, where K is a proportionality constant obtained experimentally and X is the length of the pin-shaped component projected onto the upper surface of the inspection stage.
In paragraph 1, Prior to the step in which the surface of the above-mentioned pin-shaped part is photographed, A vision inspection method for a pin-shaped component, further comprising the step of adjusting the relative position of the inspection stage with respect to the rotary drive unit such that the lower portion of the pin-shaped component is positioned on the rotation axis of the rotary drive unit that rotates the inspection stage.
In paragraph 1, The step in which the above defect inspection is performed is, A step of obtaining a plurality of modified images in which the pin-shaped part shown in each of the above-mentioned captured images is changed to a predetermined position; A step of extracting an extraction target area in which a part of the pin-shaped component appears in each of the above-mentioned modified images, and obtaining a merged image in which a plurality of the above-mentioned extraction target areas are connected to each other; and A vision inspection method for a pin-shaped part comprising the step of performing a vision inspection on the merged image above.
In paragraph 6, In the step where the surface of the above-mentioned pin-shaped component is photographed, A vision inspection method for a pin-shaped component, wherein the surface of the pin-shaped component is photographed while light from a lighting module is irradiated onto the pin-shaped component.
In Paragraph 7, In the step where the merged image is obtained, A vision inspection method for a pin-shaped component, wherein the extraction target area is identified based on the difference in pixel values between the surface of the pin-shaped component and the background appearing in the modified image due to the influence of light from the lighting module.
In paragraph 6, The step of obtaining the above modified image is, A step of distinguishing multiple regions of interest for each of the pin-shaped parts appearing in the above-mentioned captured images; A step of obtaining a plurality of segmented images by dividing each of the aforementioned captured images so that a plurality of the aforementioned regions of interest appear on different images; and A vision inspection method for a pin-shaped component, comprising the step of acquiring a plurality of modified images in which the region of interest shown in each of the above-mentioned segmented images is changed to the above-mentioned predetermined posture.
In paragraph 6, In the step where the merged image is obtained, A vision inspection method for a pin-shaped component, wherein a plurality of the above-mentioned extraction target regions are continuously connected to each other so as to correspond to the actual positions in the pin-shaped component, and the merged image is obtained.
In Paragraph 9, In the step where the above modified image is obtained, A vision inspection method for a pin-shaped part, wherein the above-mentioned predetermined posture is a posture captured when the pin-shaped part is exactly perpendicular to the inspection stage.

Description

Vision inspection method for pin type parts The present invention relates to a vision inspection method for pin-shaped parts. The transition to a data economy is driving a surge in demand for semiconductors across various industrial sectors, including autonomous vehicles, robots, 5G, and mobile appliances, as technologies such as AI, IoT, and big data advance. In semiconductor manufacturing processes, pogo pins are required as key components for testing the performance and reliability of semiconductors. Regarding these pogo pins, Korean Registered Patent No. 1204273 is disclosed. These pogo pins are produced with various specifications, with a minimum diameter of approximately 0.15 mm and a minimum length of 1 mm. Until now, the appearance inspection of pogo pins has been performed by microscopic visual inspection, and sorting has also been done manually, which has resulted in low production efficiency. In order to solve conventional problems, a method for automatically performing visual inspection of pogo pins is required, and additionally, a means of maintaining the pogo pins in an appropriate position while the visual inspection is being performed is also essential. FIG. 1 is a schematic diagram illustrating a pin-shaped component that can be inspected using a vision inspection method for pin-shaped components according to one embodiment of the present invention. FIG. 2 is a perspective view of an exemplary non-contact alignment device available in a vision inspection method for pin-shaped parts according to one embodiment of the present invention. Figure 3 is an exploded view of the non-contact alignment device shown in Figure 2. FIG. 4 is a flowchart of a vision inspection method for a pin-shaped component according to one embodiment of the present invention. Figure 6 is a drawing illustrating a situation in which a pin-shaped component is seated in a tilted position on an inspection stage. Figure 7 is a drawing illustrating a situation in which a pin-shaped part is corrected to an upright position by the movement of a magnet. FIG. 8 is a drawing for explaining a method for determining the horizontal movement distance of a magnet according to an embodiment of the present invention. FIG. 9 is a diagram illustrating that the X-axis error of an inspection stage is adjusted by a non-contact alignment device according to an embodiment of the present invention. FIG. 10 is a diagram illustrating that the Y-axis error of an inspection stage is adjusted by a non-contact alignment device according to one embodiment of the present invention. FIG. 11 is a diagram illustrating a situation in which a rotary drive unit of a non-contact alignment device according to one embodiment of the present invention is operated. FIG. 12 is a flowchart of the steps for performing a defect inspection on a pin-type component according to one embodiment of the present invention. FIG. 13 is a flowchart of the steps for obtaining a plurality of modified images based on a captured image according to one embodiment of the present invention. FIG. 14 is a drawing showing a modified image obtained based on one of the divided images. FIG. 15 is a diagram illustrating the identification of a target extraction area in the modified image of FIG. 14 and the formation of a merged image based on the target extraction area. The advantages and features of the present invention and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but can be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims. Furthermore, the embodiments described herein will be explained with reference to cross-sectional views and/or schematic drawings, which are exemplary illustrations of the present invention. Accordingly, the form of the exemplary drawings may be modified due to manufacturing techniques and/or tolerances, etc. Additionally, in each drawing of the present invention, each component may be depicted slightly enlarged or reduced for convenience of explanation. Throughout the specification, the same reference numerals refer to the same components. The directions of "Up/Down/Front/Back/Left/Right" mentioned below are illustrative directions described based on a single reference point to facilitate the easy understanding of the invention. Therefore, the present invention is not interpreted as being limited to the directions described below. That is, it is possible for the actual use of the present invention to differ from the directions mentioned below, and the present invention is interpreted to include such modified embodiments. Meanwhile, the pin-shaped com