KR-20260067283-A - INTERGRATED LED PACKAGE DEVICE

Abstract

An integrated LED package device is disclosed. An integrated LED package device according to one embodiment of the present invention includes a power supply unit that supplies power supplied from an external power source, a communication unit that transmits LED bin information to an external controller and receives an LED driving signal from the external controller, a storage unit that stores bin information, and a driver unit that controls a voltage or current applied to an LED according to a control signal received from the external controller, and an LED that receives the voltage or current controlled by the control unit and emits light under preset conditions.

Inventors

• 김은성
• 이재철
• 이창길

Assignees

• (주)엔바이어스

Dates

Publication Date

20260512

Application Date

20250314

Priority Date

20241105

Claims (6)

1. A power supply unit that supplies power from an external power source; A communication unit that transmits LED empty information to an external controller and receives an LED driving signal from the external controller; A driver comprising a storage unit for storing empty information and a control unit for controlling the voltage or current applied to an LED according to a control signal received from the external controller; and An integrated LED package device comprising: an LED that emits light under preset conditions by receiving a voltage or current controlled by the above-mentioned control unit.
2. In paragraph 1, The above communication unit is an integrated LED package device that selectively switches to UART or CAN communication methods via a CNF PIN.
3. In paragraph 1, The above storage unit is, An integrated LED package device that stores empty information including at least one of the light quantity, voltage, and color information of the above LED.
4. In paragraph 1, The above control unit is, An integrated LED package device that controls the voltage or current applied to the LED according to the above empty information.
5. In paragraph 1, The above storage unit is, An integrated LED package device that stores a unique address assigned by the above external controller.
6. In paragraph 1, The above communication unit is, Transmitting LED empty information stored in the storage unit to the external controller, and receiving a control signal from the external controller to drive the LED under preset conditions, The above control unit is, An integrated LED package device that stores a unique address assigned by the external controller that determines the voltage or current applied to the LED according to the above control signal.

Description

Integrated LED Package Device The present invention relates to an integrated LED package device, and more specifically, to an integrated LED package device in which an LED, a driver for controlling the LED, and a memory storing LED bin information are integrated into a single chip. LEDs are efficient light-emitting devices widely used in electronic equipment, employing them in various fields such as lighting, displays, and traffic lights. While LEDs offer advantages like low power consumption and a long lifespan, the required current or voltage values may vary depending on the specific characteristics of each LED. Consequently, in systems utilizing multiple LEDs, separate current settings must be applied to account for the specific properties of each LED, which presents various challenges during design and implementation. In particular, when connecting multiple LEDs to the same circuit or attempting to control multiple LEDs within the same package, a problem arises in that the appropriate current value must be set individually for each LED because each LED has different unique characteristics (empty information). Here, bin information refers to data that determines the optimal current, voltage, color, brightness, etc., for each LED to emit light. However, conventionally, since the bin information for each LED is managed separately and current control must be performed based on it, individual control circuits and settings are required for each LED. This has resulted in the problem of requiring complex design and extensive wiring work. Furthermore, if the empty information for each LED is stored in a separate external memory or control device, communication with external devices or additional wiring is required to properly control the current based on that information. This leads to problems such as increased system size and complexity, as well as additional costs and time required to implement optimized control. Consequently, existing LED systems suffered from issues including complex circuit configurations for managing empty information and individual control of each LED, increased wiring, and reduced system efficiency. Consequently, there was a need for a new LED package device configured as a single chip that integrates a control circuit and a memory in which LED blank information is pre-stored. FIG. 1 is a functional block diagram for explaining an integrated LED package device (100) according to one embodiment of the present invention. FIG. 2 is a diagram illustrating that a plurality of integrated LED package devices are connected to one external controller according to an embodiment of the present invention. FIG. 3 is a diagram illustrating a method for controlling a plurality of integrated LED package devices (100-1, 100-2, ??, 100-n) with a single external controller according to an embodiment of the present invention. FIG. 4 is a flowchart illustrating the process of an external controller controlling a plurality of integrated LED package devices according to an embodiment of the present invention. Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the attached drawings. The advantages and features of the present disclosure and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the attached drawings. However, the technical concept of the present disclosure is not limited to the following embodiments but can be implemented in various different forms. The following embodiments are provided merely to complete the technical concept of the present disclosure and to fully inform those skilled in the art of the scope of the present disclosure, and the technical concept of the present disclosure is defined only by the scope of the claims. It should be noted that when assigning reference numerals to the components of each drawing, the same components are given the same reference numeral whenever possible, even if they are shown in different drawings. Furthermore, in describing the present disclosure, if it is determined that a detailed description of related known components or functions could obscure the essence of the present disclosure, such detailed description is omitted. Unless otherwise defined, all terms used herein (including technical and scientific terms) may be used in a meaning commonly understood by those skilled in the art to which this disclosure pertains. Additionally, terms defined in commonly used dictionaries are not to be interpreted ideally or excessively unless explicitly and specifically defined otherwise. The terms used herein are for describing the embodiments and are not intended to limit this disclosure. In this specification, the singular form includes the plural form unless specifically stated otherwise in the text. Additionally, terms such as first, second, A, B, (a), (b), etc., may be used to describe the components of the present disclosure. These ter