KR-20260067411-A - Manufacturing method of grounding electrode containing a grounding reducing agent

KR20260067411AKR 20260067411 AKR20260067411 AKR 20260067411AKR-20260067411-A

Abstract

The present invention relates to a method for manufacturing a grounding electrode containing a grounding reducing agent, which can increase the surge current removal efficiency by impregnating a conductive metal with a grounding reducing agent to transfer an incoming surge current to the grounding reducing agent. A method for manufacturing a grounding electrode containing a grounding reduction agent according to the first embodiment of the present invention is characterized by comprising the steps of classifying the size of the grounding reduction agent (S110), positioning the grounding reduction agent inside a mold for manufacturing a grounding electrode (S120), melting a conductive metal (S130), injecting a molten metal liquid into the mold (S140), cooling the mold (S150), and separating the grounding electrode from the mold (S160).

Inventors

김동진
권완성
서상원
이성준

Assignees

선광엘티아이(주)

Dates

Publication Date: 20260513
Application Date: 20241104

Claims (9)

Step of classifying the size of grounding reduction agents (S110), A step (S120) of positioning a grounding reducing agent inside a mold for manufacturing a grounding electrode, and A step of melting a conductive metal (S130), and A step of injecting molten metal liquid into the mold (S140), and, Step of cooling the mold (S150) and A method for manufacturing a grounding electrode containing a grounding reduction agent, characterized by including the step (S160) of separating the grounding electrode from the mold.
Step of classifying the size of grounding reduction agents (S210), A step (S220) of positioning a grounding reducing agent at a certain height inside a mold for manufacturing a grounding electrode, and A step of melting a conductive metal (S230), and A step of injecting molten metal liquid into the molding die to a certain height (S240), and Step (S250) of cooling the mold to form a ground electrode layer and Step S220, Step S240, Step S250, and a step of forming a multilayer ground electrode layer inside the mold while repeating steps (S260). A method for manufacturing a grounding electrode containing a grounding reduction agent, characterized by including the step (S270) of separating a multilayer grounding electrode layer from a mold.
A method for manufacturing a grounding electrode containing a grounding reducing agent according to claim 2, characterized in that, in step S240, the molten metal is injected to the same height as the grounding reducing agent injected into the mold or to a height capable of covering the grounding reducing agent.
A method for manufacturing a grounding electrode containing a grounding reducing agent according to claim 1 or claim 2, characterized in that the size of the grounding reducing agent is 1 mm to 50 mm.
Step of classifying grounding reduction agent powder (S310), A step (S320) of generating a grounding reduction agent sludge paste, and A step (S330) for generating grounding reduction agent beads, and A step (S340) of positioning a grounding reduction agent bead inside the mold of a grounding electrode, and A step of melting a conductive metal (S350), and A step of injecting molten metal liquid into the mold (S360), and, A method for manufacturing a grounding electrode containing a grounding reduction agent, characterized by including a step of cooling a molding die (S370) and a step of separating the grounding electrode from the molding die (S380).
Step of classifying grounding reduction agent powder (S410), A step (S420) for generating a grounding reduction agent sludge paste, and A step (S430) for generating grounding reduction agent beads, and A step (S440) of positioning a grounding reducing agent at a certain height inside a mold for manufacturing a grounding electrode, and A step of melting a conductive metal (S450), and A step of injecting molten metal liquid into a mold to a certain height (S460), and a step of cooling the mold to form a ground electrode layer (S470), and Step S480, a step of forming a multilayer ground electrode layer inside a mold while repeating steps S440, S460, and S470. A method for manufacturing a grounding electrode containing a grounding reduction agent, characterized by including the step (S490) of separating a multilayer grounding electrode layer from a mold.
A method for manufacturing a grounding electrode containing a grounding reducing agent according to claim 6, characterized in that, in step S460, the molten metal is injected to the same height as the grounding reducing agent bead introduced into the mold or to a height capable of covering the grounding reducing agent bead.
A method for manufacturing a grounding electrode containing a grounding reducing agent according to claim 5 or claim 6, characterized in that the grounding reducing agent powder is less than 10 mm and the size of the grounding reducing agent beads is 12 mm to 50 mm.
A method for manufacturing a grounding electrode containing a grounding reducing agent according to claim 5 or claim 6, characterized in that the grounding reducing agent sludge paste is mixed with water in a volume ratio of 1:0.5 to 1.5.

Description

Manufacturing method of grounding electrode containing a grounding reducing agent The present invention relates to a grounding electrode, and more specifically, to a method for manufacturing a grounding electrode containing a grounding reducing agent that can increase the surge current removal efficiency by impregnating a conductive metal with a grounding reducing agent and transferring the incoming surge current to the grounding reducing agent. Grounding is the process of electrically connecting electrical equipment, such as communication equipment, electronic measuring equipment, lightning protection equipment, and power equipment, to the earth by connecting a grounding electrode to the soil. This prevents damage to various equipment by diverting overloads caused by abnormal currents or surges caused by lightning strikes to the earth. The contact resistance occurring between the grounding electrode and the earth is called grounding resistance. While the ideal value is '0' to discharge abnormal overcurrents or surges to the ground within an extremely short time, in reality, it is impossible to achieve this ideal grounding resistance in most cases. If the grounding resistance becomes too high, only a portion of the overcurrent or lightning current is discharged through the grounding rod (or plate), while the remaining charge flows backward and is transmitted to various equipment or nearby humans, causing various damages. To prevent this, grounding rods or plates are installed and used so that the grounding resistance is 10 to 100Ω or less, depending on the application. Grounding resistance decreases exponentially as the number of grounding rods (plates) increases. However, once the grounding resistance decreases to a certain level, it reaches a critical threshold where it no longer decreases, no matter how much the number of grounding rods (plates) is increased. This critical threshold of grounding resistance is related to the grounding area and the soil resistivity. Grounding resistance is related to the contact area between the grounding rod (plate) and the earth, and as the size and length of the grounding rod (plate) increase, the grounding resistance decreases exponentially. Therefore, a grounding rod having blades formed on its surface is disclosed in order to lower grounding resistance by increasing the contact area of the grounding rod (plate). Soil resistivity is an absolute function in the calculation of grounding resistance and the number of grounding electrodes. The value of soil resistivity varies significantly depending on climate and regional characteristics, such as soil moisture content, the chemical composition of the moisture, soil type, geological composition, and ground temperature. In soils with high ground resistance, ground resistance cannot be lowered by burying only grounding rods (plates) or lead wires, so ground resistance reducing agents are used to reduce ground resistance. However, in order to maintain a constant ground resistance, the amount of ground resistance reducing agent must be maintained; in the case of chemical reducing agents, as time passes, the injected agent is lost due to rainwater or groundwater, which not only causes the agent to lose its function but also leads to the problem of soil contamination. FIG. 1 is a flowchart of the manufacturing process of a grounding electrode containing a grounding reducing agent according to the first embodiment of the present invention. FIG. 1 is a flowchart of the manufacturing process of a grounding electrode containing a grounding reducing agent according to a second embodiment of the present invention. FIG. 3 is a flowchart of the manufacturing process of a grounding electrode containing a grounding reducing agent according to the third embodiment of the present invention. FIG. 4 is a flowchart of the manufacturing process of a grounding electrode containing a grounding reducing agent according to the fourth embodiment of the present invention. Hereinafter, a method for manufacturing a grounding electrode containing a grounding reduction agent according to the present invention will be described in detail with reference to the attached drawings. However, a person skilled in the art will recognize that the present invention may be modified or changed in various ways within the scope of the embodiments described below, and that such modifications or changes are also included within the scope of the present invention. A method for manufacturing a grounding electrode containing a grounding reduction agent according to the first embodiment of the present invention comprises the steps of classifying the size of the grounding reduction agent (S110), positioning the grounding reduction agent inside a mold for manufacturing a grounding electrode (S120), melting a conductive metal (S130), injecting a molten metal liquid into the mold (S140), cooling the mold (S150), and separating the grounding electrode from the mold (S160). Accord