KR-20260067436-A - DISPLAY APPARATUS AND METHOD FOR MANUFACTURING THE SAME

KR20260067436AKR 20260067436 AKR20260067436 AKR 20260067436AKR-20260067436-A

Abstract

The present specification relates to a display device and a method for manufacturing the same that can prevent the occurrence of defects and improve yield by preventing cathode lifting when a temporary protective adhesive film is removed. A display device according to one embodiment of the present specification may include a substrate including a display area for displaying an image and a non-display area which is a peripheral part of the display area; a thin-film transistor disposed on the substrate of the display area; a planarization layer disposed on the display area and the non-display area of the thin-film transistor having a first contact hole on the thin-film transistor; a bank layer disposed on the display area and the non-display area of the planarization layer having an open portion in the light-emitting area; a light-emitting element disposed on the planarization layer to be connected to the thin-film transistor through the first contact hole; and an organic insulating film pattern disposed on the bank layer of the non-display area to cover the end of the cathode electrode of the light-emitting element.

Inventors

한규형
임헌배
이윤석
차언호
전은솔
신상빈
한대희

Assignees

엘지디스플레이 주식회사

Dates

Publication Date: 20260513
Application Date: 20241104

Claims (18)

A substrate including a display area for displaying an image and a non-display area which is the periphery of the display area; A thin-film transistor disposed on a substrate of the above-mentioned display area; A planarization layer having a first contact hole on the thin-film transistor and disposed in the display area and the non-display area on the thin-film transistor; A bank layer having an open portion in a light-emitting region and disposed in the display region and the non-display region on the planarization layer; A light-emitting element disposed on the planarization layer to be connected to the thin-film transistor through the first contact hole; A display device comprising: an organic insulating film pattern disposed on the bank layer of the non-display area to cover the end of the cathode electrode of the light-emitting element.
In Article 1, A display device further comprising a metal pattern disposed on the bank layer of the above non-display area.
In Article 2, The above metal pattern is a display device located at the end of the cathode electrode.
In Article 1, A voltage supply line disposed below the flattening layer of the above-mentioned non-display area and supplying voltage; and It further includes a connecting electrode disposed on the flattening layer of the above-mentioned non-display area; and The above connecting electrode is a display device connected to the voltage supply line through a second contact hole formed in the planarization layer.
In Article 4, A display device in which the cathode electrode of the light-emitting element is connected to the connecting electrode through a third contact hole formed in the bank layer in the non-display area.
In Article 5, An organic insulating film pattern is a display device that covers the end of the cathode electrode, the third contact hole, and the end of the bank layer.
In Article 1, A display device further comprising a cathode electrode and an encapsulation layer disposed on the organic insulating film pattern.
In Article 7, The above-mentioned bag layer is, A first inorganic encapsulation layer that is arranged extending from the display area to the non-display area and extending through the organic insulating film pattern to the bezel area, and An organic encapsulation layer disposed on the first inorganic encapsulation layer and extending from the display area to the inside of the organic insulating film pattern, and A display device comprising a second inorganic encapsulation layer disposed on the organic encapsulation layer and extending from the display area through the organic insulating film pattern to the bezel area.
In Article 1, The above organic insulating film pattern is a display device containing a high-viscosity material.
In Article 9, The above organic insulating film pattern comprises a non-photosensitive organic insulating material such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, and polyethylene or silicon oxycarbon, or a photosensitive organic insulating material such as photoacrylic.
A step of preparing a substrate including a display area for displaying an image and a non-display area which is the periphery of the display area; A step of forming a thin-film transistor on a substrate of the above-mentioned display area; A step of forming a voltage supply line on the non-display area of the substrate; A step of forming a planarization layer on the thin film transistor and the voltage supply line so as to have first and second contact holes on the thin film transistor and the voltage supply line; A step of forming an anode electrode of a light-emitting element on the planarization layer so as to be connected to the thin-film transistor through the first contact hole; A step of forming a connecting electrode on the flattening layer to be connected to the voltage supply line through the second contact hole; A step of forming a bank layer on the planarization layer including the anode electrode and the connecting electrode so as to have an open region on the anode electrode and a third contact hole on the connecting electrode; A step of forming a light-emitting layer on the anode electrode of the open region; A step of forming a cathode electrode on the light-emitting layer and the bank layer so as to be electrically connected to the connecting electrode through the third contact hole; A method for manufacturing a display device comprising the step of forming an organic insulating film pattern on the bank layer of the non-display area to cover the end of the cathode electrode, the third contact hole, and the end of the bank layer.
In Article 11, A method for manufacturing a display device, further comprising the step of forming a metal pattern between the bank layer of the non-display area and the cathode electrode so as to overlap with the end of the cathode electrode.
In Article 12, A method for manufacturing a display device that removes the end of the cathode electrode overlapping with the metal pattern by irradiating a laser.
In Article 11, A method for manufacturing a display device comprising the step of forming an encapsulation layer on the cathode electrode and the organic insulating film pattern.
In Article 14, The above-mentioned bag layer is, A first inorganic encapsulation layer that is arranged extending from the display area to the non-display area and extending through the organic insulating film pattern to the bezel area, and An organic encapsulation layer disposed on the first inorganic encapsulation layer and extending from the display area to the inside of the organic insulating film pattern, and A method for manufacturing a display device comprising a second inorganic encapsulation layer disposed on the organic encapsulation layer and extending from the display area through the organic insulating film pattern to the bezel area.
In Article 14, A method for manufacturing a display device comprising the step of adhering a temporary protective adhesive film onto the above-mentioned encapsulation layer.
In Article 16, A method for manufacturing a display device, further comprising the step of attaching a flat plate, a touch sensor, and a cover glass in sequence after removing the above temporary protective adhesive film.
In Article 11, A method for manufacturing a display device comprising the above organic insulating film pattern, the above organic insulating film pattern comprising a non-photosensitive organic insulating material such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, and polyethylene or silicon oxycarbon, or a photosensitive organic insulating material such as photoacrylic.

Description

Display apparatus and method for manufacturing the same This specification relates to a display device, and more specifically, to a display device capable of preventing cathode lifting when a temporary protective film is removed, and a method for manufacturing the same. Video display devices, which display various information on a screen, are a core technology of the information and communication era and are evolving in a direction that is thinner, lighter, more portable, and higher in performance. Accordingly, display devices that can be manufactured in a lightweight and thin form are gaining attention. Specific examples of such display devices include Liquid Crystal Display apparatus (LCD), Quantum Dot Display apparatus (QD), Field Emission Display apparatus (FED), and Organic Light Emitting Diode (OLED). An organic light-emitting display device includes a light-emitting diode as an essential component, comprising an anode and a cathode facing each other with an organic light-emitting layer in between, and displays an image by combining holes and electrons injected from the anode and cathode, respectively, in the organic light-emitting layer to emit light. Therefore, since organic light-emitting display devices are self-emissive display devices, they are being studied as display devices because they are not only advantageous in terms of power consumption due to low-voltage driving, but also offer excellent color reproduction, response speed, viewing angle, and contrast ratio (CR). Meanwhile, there has recently been an increasing demand for flexible display devices using flexible substrates such as plastic substrates. Since flexible display devices can be carried when folded and display images when unfolded, they have the advantage of being portable while enabling large screen displays. Because these plastic substrates have flexible properties, they are difficult to use in the manufacturing process of display devices on their own. Therefore, the plastic substrate is attached to one side of a carrier substrate, such as a glass substrate, to carry out the process. That is, a plastic substrate is formed on a carrier substrate, and a thin-film transistor array layer, a light-emitting element array layer, and an encapsulation layer are formed sequentially on the plastic substrate. Then, a temporary protective film is adhered to the encapsulation layer. Then, the carrier substrate is removed from the plastic substrate, and after removing the temporary protective film, a polarizer and a cover glass are adhered to the encapsulation layer. In this manufacturing process, when removing the temporary protective film, the applied force may cause the end of the cathode to lift, resulting in defects. FIG. 1 is a schematic cross-sectional view of a flexible display device according to one embodiment of the present specification. FIG. 2 is a circuit diagram of a subpixel included in a display device according to one embodiment of the present specification. FIG. 3 is a cross-sectional example of any pixel placed in a display area of a display panel according to one embodiment of the present specification. FIG. 4 is a cross-sectional example of a non-display area of a light-emitting display panel according to one embodiment of the present specification. FIGS. 5a to 5e are exemplary cross-sectional views of a process of a display panel in a display area according to one embodiment of the present specification. FIGS. 6a to 6e are exemplary cross-sectional views of a process of a display panel in a non-display area according to one embodiment of the present specification. FIG. 7 is a plan view of a display panel in a bezel area according to one embodiment of the present specification. Hereinafter, preferred embodiments of the present specification will be described with reference to the attached drawings. Throughout the specification, the same reference numerals denote substantially the same components. In the following description, if it is determined that a detailed description of the technology or configuration related to this specification could unnecessarily obscure the essence of this specification, such detailed description is omitted. Additionally, the component names used in the following description have been selected for the ease of drafting the specification and may differ from the actual product part names. Shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for describing various embodiments of this specification are exemplary, and therefore this specification is not limited to the matters shown in the drawings. Throughout this specification, the same reference numerals refer to the same components. Furthermore, in describing this specification, if it is determined that a detailed description of related prior art could unnecessarily obscure the gist of this specification, such detailed description is omitted. Where terms such as 'includes,' 'have,' and 'consists of' are used in this specificatio