Search

KR-20260067438-A - Hotmelt adhesive composition for bonding electrical and electronic components

KR20260067438AKR 20260067438 AKR20260067438 AKR 20260067438AKR-20260067438-A

Abstract

The present disclosure relates to a hot melt adhesive composition for bonding electrical and electronic components. More specifically, the hot melt adhesive composition is suitable for bonding electrical and electronic components by having improved adhesive strength, heat resistance, durability, and flame retardancy. Additionally, it can be utilized for bonding various materials, bonding battery cell pouch assemblies, etc. Furthermore, it can be applied to various industrial sectors, such as automobile manufacturing processes used in body assembly, painting, and chemical processes; assembly processes for electronic devices using multi-layer laminated composite films, conductive, magnetic, insulating, semiconductor, and structural materials; and the construction field.

Inventors

  • 김종완
  • 황진구
  • 장진우

Assignees

  • (주)엠씨에스

Dates

Publication Date
20260513
Application Date
20241104

Claims (17)

  1. Per 100 parts by weight of the composition, 70 to 90 parts by weight of a base polymer comprising a styrene-based synthetic rubber resin and a polypropylene resin; One or more selected from rosin-based and terpene-based resins; and 1 to 25 parts by weight of a tackifier resin comprising petroleum resin; 1 to 10 parts by weight of one or more plasticizers selected from oil and wax; 1 to 10 parts by weight of a filler comprising one or more selected from the group consisting of talc, calcium carbonate, white carbon, silica, and carbon black; and A hot melt adhesive composition comprising 1 to 5 parts by weight of a flame retardant comprising one or more selected from the group consisting of phosphazene polymer and phenoxyphosphazene oligomer.
  2. A hot melt adhesive composition according to claim 1, wherein the styrene-based synthetic rubber resin comprises a styrene-butadiene block copolymer and a nitron derivative.
  3. A hot melt adhesive composition according to claim 2, wherein the weight ratio of the styrene-butadiene block copolymer and the nitron derivative is 100:1 to 10.
  4. A hot melt adhesive composition according to claim 2, wherein the nitron derivative is a nitron of the following chemical formula 2: [Chemical Formula 2] In the above chemical formula 2, X and Y are each independently an aliphatic or aromatic hydrocarbon group or an aromatic heterocyclic group.
  5. A hot melt adhesive composition according to claim 1, wherein the adhesive composition further comprises one or more additives selected from the group consisting of acrylic copolymer, butyl (rubber), polyrubber, and polyester.
  6. A hot melt adhesive composition according to claim 1, wherein the wax is one or more selected from the group consisting of paraffin wax, microcrystalline wax, polyethylene wax, polypropylene wax, amide wax, and Fischer-Tropsch wax.
  7. A hot melt adhesive composition according to claim 1, wherein the oil is one or more selected from paraffin-based, naphthalene-based, and olefin-based oils.
  8. A hot melt adhesive composition according to claim 1, wherein the petroleum resin is one or more selected from the group consisting of C5-based petroleum resin, C9-based petroleum resin, copolymer-based petroleum resin, cycloaliphatic saturated hydrocarbon resin, and styrene-based petroleum resin.
  9. A hot melt adhesive composition according to claim 1, wherein the adhesive composition further comprises 1 part by weight or less of one or more stabilizers selected from phenolic and phosphorus-based stabilizers.
  10. A hot melt adhesive composition according to claim 1, wherein, as the flame retardant, a phosphazene polymer and a phenoxyphosphazene oligomer are included in a weight ratio of 1:0.5 to 0.8.
  11. In claim 1, the viscosity of the adhesive composition is 180 to 190 A hot melt adhesive composition having a thickness of 5,000 to 30,000 cps.
  12. In claim 1, the softening point of the adhesive composition is 125 to 155 Phosphorus, hot melt adhesive composition.
  13. A hot melt adhesive composition according to claim 1, wherein the room temperature adhesive strength of the adhesive composition is 3 to 4 Kgf/in.
  14. A hot melt adhesive composition according to claim 1, wherein the adhesive strength of the adhesive composition is 2 to 5 Kgf/in at 190 ℃.
  15. A hot melt adhesive composition according to claim 1, wherein the tensile strength (Kg) of the adhesive composition is 3 to 5 and the maximum elongation is 90% or more.
  16. A hot melt adhesive composition according to claim 1, wherein the adhesive holding time of the adhesive composition is 2 to 6 seconds.
  17. A hot melt adhesive composition according to any one of claims 1 to 15, wherein the adhesive composition is for bonding electronic components or electrical components.

Description

Hotmelt adhesive composition for bonding electrical and electronic components This specification relates to a hot melt adhesive composition for bonding electrical and electronic components. Adhesives are polymeric materials with special properties for bonding objects. Adhesives are classified into natural and synthetic polymers based on their formation state, into thermosetting and thermoplastic resins based on thermodynamic properties, and into structural and non-structural types based on performance properties. Furthermore, they are classified into solvent-based, hot-melt, photocurable adhesives, and pressure-sensitive adhesives based on their form. These adhesives are utilized in a wide range of fields, from adhesive materials for residential and household goods such as construction, household items, and medical supplies, to industrial adhesive materials for the automotive, marine, machinery, and electrical and electronic sectors, as well as future leading industries such as biotechnology and next-generation robotics. In the construction and civil engineering industries, adhesives are used for building structures, interior and exterior finishes, and functional pressure-sensitive sheets. These are utilized as sealants for building exteriors, adhesives for furniture and flooring, adhesives for reinforced concrete, and functional films for indoor temperature control. Recent adhesive development focuses on cost reduction, the imparting of high functionality, and the development of environmentally friendly products. To reduce costs, efforts are being made to procure affordable and stable materials, improve production yields, minimize waste generation during the manufacturing process, and recycle materials lost during production. Furthermore, as the characteristics required in industrial settings become more diverse, the functionalities demanded of adhesives are also gradually increasing. In the electrical and electronics industry, the utility of adhesives is becoming increasingly prominent due to trends toward slimness, lightweighting, aesthetic appeal, and functional complexity; currently, their application is expanding across all sectors, ranging from displays, mobile devices, and semiconductors to home appliances. In the automotive and transportation industries, high-performance adhesive materials are being utilized for structural bonding, high-heat resistance, lightweighting, and process improvement, with their scope of application extending from automobiles to aircraft and spacecraft. Furthermore, in the bio and medical industries, these materials are utilized for tissue bonding, nerve bonding, bone tissue bonding, and as dental materials; their value as new types of medical materials is being highlighted as soft tissue resin bonding, nerve tissue resin bonding, hip joint surgery, and dental resins. Adhesives are classified into solvent-based, water-based, and solvent-free types depending on the solvent used. Solvent-based adhesives are widely used in most domestic general-purpose adhesive markets, including construction materials, automobiles, and tapes. Volatile components (formaldehyde) emitted from solvent-based adhesives have very adverse effects on the human body, such as causing sick building syndrome as well as environmental pollution. Currently, due to stricter environmental regulations in the adhesive market, the market for solvent-based adhesives is inevitably declining. However, the market for solvent-free adhesives is steadily growing as an eco-friendly material. Furthermore, as there are many regulations and certification requirements for adhesives, research is underway to develop adhesives that are harmless to the human body. The importance of hot melt adhesives is being highlighted due to their excellent application characteristics and the environmental issues associated with solvent-based adhesives. Hot melt adhesives are materials that remain solid at room temperature and consist entirely of solids, rather than being dissolved or dispersed in a solvent; they are applied by melting them into a liquid state using heat. Furthermore, since they are applied to the substrate in a molten state and solidify upon cooling, they are widely used in processes requiring rapid initial adhesion, such as high-speed assembly. Because hot melt adhesives are completely solvent-free, they are environmentally friendly. Additionally, since they can be handled in a molten state, they require less equipment cost and installation space, while offering high productivity. However, hot melt adhesives have the disadvantage of lacking high-temperature resistance, limiting their ability to withstand heat, and can easily lose their cohesiveness when the temperature rises; therefore, research is currently being conducted to address these issues. Ethylene-vinyl acetate (EVA) was the first to be developed and is currently produced industrially as a conventional hot-melt adhesive. It bonds objects by utilizing the property