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KR-20260067458-A - CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME

KR20260067458AKR 20260067458 AKR20260067458 AKR 20260067458AKR-20260067458-A

Abstract

A circuit board comprises a base board, a connection pad disposed on the base board and having an upper surface including an inclined surface and including a recess formed in the center of the upper surface, and a connector disposed on the connection pad and including a connection pin in contact with the recess. The inclined surface can induce the connection pin to move toward the center of the connection pad under the influence of gravity.

Inventors

  • 기세대

Assignees

  • 삼성디스플레이 주식회사

Dates

Publication Date
20260513
Application Date
20241105

Claims (20)

  1. Base substrate; A connection pad disposed on the base substrate, having an upper surface including an inclined surface, and including a concave portion formed in the center of the upper surface; and A circuit board comprising a connector having a connection pin disposed on the connection pad and in contact with the recess.
  2. A circuit board according to claim 1, characterized in that the thickness of the connection pad decreases from the edge portion toward the center portion.
  3. A circuit board according to claim 2, wherein the connection pin is spaced apart from the edge portion of the connection pad.
  4. A circuit board according to claim 2, wherein the inclined surface of the connection pad is a concave surface in which the angle of inclination with respect to one surface of the base substrate gradually increases from the central part of the connection pad to the edge part.
  5. A circuit board according to claim 2, wherein the inclined surface of the connection pad is a convex surface in which the angle of inclination with respect to one surface of the base substrate gradually decreases from the central part of the connection pad to the edge part.
  6. A circuit board according to claim 1, characterized in that the thickness of the central portion of the connection pin is greater than the thickness of the edge portion of the connection pin.
  7. A circuit board according to claim 1, characterized in that the connection pin protrudes toward the concave portion and includes a protrusion that contacts the concave portion.
  8. A circuit board according to claim 7, wherein the protrusion has a triangular cross-sectional shape.
  9. A circuit board according to claim 7, characterized in that the protrusion has a predetermined curvature in cross-section.
  10. A circuit board according to claim 1, characterized in that the width of the connection pin is smaller than the width of the connection pad.
  11. A display panel including pixels; A circuit board electrically connected to the above display panel; A drive control unit that controls the operation of the above-mentioned display panel; and The above-mentioned drive control unit includes a processor that outputs input image data and input control signals, and The above circuit board is, Base substrate; A connection pad disposed on the base substrate, having an upper surface including an inclined surface, and including a concave portion formed in the center of the upper surface; and An electronic device comprising a connector having a connection pin disposed on the connection pad and in contact with the recess.
  12. An electronic device according to claim 11, characterized in that the thickness of the connection pad decreases from the edge portion toward the center portion.
  13. An electronic device according to claim 12, wherein the connection pin is spaced apart from the edge portion of the connection pad.
  14. An electronic device according to claim 12, wherein the inclined surface of the connection pad is a concave surface in which the angle of inclination with respect to one surface of the base substrate gradually increases from the central part of the connection pad to the edge part.
  15. An electronic device according to claim 12, wherein the inclined surface of the connection pad is a convex surface in which the angle of inclination with respect to one surface of the base substrate gradually decreases from the central part of the connection pad to the edge part.
  16. An electronic device according to claim 11, characterized in that the thickness of the central portion of the connection pin is greater than the thickness of the edge portion of the connection pin.
  17. An electronic device according to claim 11, wherein the connecting pin protrudes toward the concave portion and includes a protrusion that contacts the concave portion.
  18. An electronic device according to claim 17, wherein the protrusion has a triangular cross-sectional shape.
  19. An electronic device according to claim 17, wherein the protrusion has a predetermined curvature in cross-section.
  20. An electronic device according to claim 11, characterized in that the width of the connection pin is smaller than the width of the connection pad.

Description

Circuit board and electronic device including the same The present invention relates to a circuit board. More specifically, the present invention relates to a circuit board and an electronic device including the same. As information technology develops, the importance of display devices, which serve as a medium of connection between users and information, is being highlighted. For example, the use of display devices such as liquid crystal display devices (LCDs), organic light emitting diode (OLED) displays, plasma display panels (PDPs), and quantum dot displays is increasing. A display device may include a display panel including pixels and a circuit board electrically connected to the display panel. The circuit board may include a base substrate and electronic components disposed on the base substrate. For example, the electronic components may include a voltage generating unit that generates a voltage applied to the pixels, a driving control unit that controls the driving of the display panel, and a connector that electrically connects an external device to the circuit board. The connector may include a connection pin that contacts a connection pad formed on the base substrate. Through a reflow process, the connection pin may be bonded to the connection pad, and the connector may be mounted on the base substrate. FIG. 1 is a block diagram showing a display device according to one embodiment of the present invention. Figure 2 is a plan view showing the display device of Figure 1. Figure 3 is an enlarged plan view of area A of Figure 2. FIG. 4 is a perspective view showing an example of a connection pad included in the circuit board of FIG. 2. Figure 5 is a cross-sectional view showing the connection pad of Figure 4. FIG. 6 is a perspective view showing an example of a connection pin of a connector included in the circuit board of FIG. 2. Figure 7 is a cross-sectional view showing the connection pin of Figure 6. FIG. 8 is a perspective view in which the connection pin of FIG. 6 is placed on the connection pad of FIG. 4. FIG. 9 is a cross-sectional view in which the connection pin of FIG. 6 is placed on the connection pad of FIG. 4. FIGS. 10 to 13 are drawings for explaining the process of inspecting the connection pin of FIG. 6. FIG. 14 is a cross-sectional view showing another example of a connection pad included in the circuit board of FIG. 2. FIG. 15 is a cross-sectional view showing another example of a connection pad included in the circuit board of FIG. 2. FIG. 16 is a perspective view showing another example of a connection pin of a connector included in the circuit board of FIG. 2. FIG. 17 is a cross-sectional view showing the connection pin of FIG. 16. FIG. 18 is a perspective view in which the connection pin of FIG. 16 is placed on the connection pad of FIG. 4. FIG. 19 is a cross-sectional view in which the connection pin of FIG. 16 is placed on the connection pad of FIG. 4. FIG. 20 is a block diagram showing an electronic device according to one embodiment of the present invention. FIG. 21 is a diagram showing an example in which the electronic device of FIG. 20 is implemented as a computer monitor. FIG. 22 is a diagram showing an example in which the electronic device of FIG. 20 is implemented as a smartphone. Hereinafter, embodiments of the present invention will be described in more detail with reference to the attached drawings. Identical components in the drawings are given the same reference numerals, and redundant descriptions of identical components are omitted. The present invention may be implemented in various different forms and is not limited to the embodiments described herein. FIG. 1 is a block diagram showing a display device according to one embodiment of the present invention. In this specification, a plane may be defined as a first direction (DR1) and a second direction (DR2) that intersects the first direction (DR1). For example, the first direction (DR1) and the second direction (DR2) may be perpendicular to each other. The normal direction of the plane may be a third direction (DR3, see FIG. 2). In other words, the third direction (DR3) may be perpendicular to the first direction (DR1) and the second direction (DR2), respectively. Referring to FIG. 1, a display device (DD) according to one embodiment of the present invention may include a display panel (DP) and a panel driver that drives the display panel (DP). The panel driver may include a driving control unit (TC), a gate driver (GDC), a gamma reference voltage generator (GVG), a data driver (DDC), and an emission driver (EDC). A display panel (DP) may include gate lines (GL), data lines (DL), emission lines (EML), and pixels (PX). Pixels (PX) may be electrically connected to the gate lines (GL), data lines (DL), and emission lines (EML). Each pixel (PX) may emit light according to a driving signal. For example, pixels (PX) may be arranged in a matrix form along a first direction (DR1) and a second direction (DR2). Each g