KR-20260067466-A - ELECTRONIC MODULE TEST SOCKET FOR HEAT RESISTANCE PERFORMANCE TEST

KR20260067466AKR 20260067466 AKR20260067466 AKR 20260067466AKR-20260067466-A

Abstract

An electronic module test socket may include a first socket cover, a module receiving portion formed at the center of the first socket cover for receiving an electronic module to be tested, a hinge provided on a first side of the first socket cover, a latch provided on a second side opposite to the first side of the first socket cover, and an air injection portion for supplying high-temperature air to the module receiving portion, a lower housing including a second socket cover, a hinge portion provided on a first side of the second socket cover and coupled with the hinge, a latch portion provided on a second side opposite to the first side of the second socket cover and coupled with the latch, and a push portion configured to press the electronic module.

Inventors

강승남
박이동
이영기
송언석

Assignees

(주)메리테크

Dates

Publication Date: 20260513
Application Date: 20241105

Claims (11)

A lower housing comprising a first socket cover, a module receiving portion formed at the center of the first socket cover and for receiving an electronic module to be tested, a hinge provided on a first side of the first socket cover, a latch provided on a second side opposite to the first side of the first socket cover, and an air injection portion for supplying high-temperature air to the module receiving portion; and The upper housing comprises a second socket cover, a hinge portion provided on a first side of the second socket cover and coupled with the hinge, a latch portion provided on a second side opposite to the first side of the second socket cover and coupled with the latch, and a push portion configured to press the electronic module. The above air injection part is, An air inlet formed at the center of the first side of the first socket cover and receiving high-temperature air; It includes a plurality of air outlets that discharge the high-temperature air injected through the air inlet to the module receiving portion, An electronic module test socket, wherein the length of the first side in which the plurality of air outlets of the air injection part are formed is equal to the length of the electronic module, and the plurality of air outlets are uniformly distributed on the first side so as to uniformly supply high-temperature air to each part of the electronic module.
In paragraph 1, A closed socket housing is formed such that the hinge of the lower housing and the hinge portion of the upper housing are joined, and the latch of the lower housing and the latch portion of the upper housing are joined, thereby providing a space inside for testing the electronic module at a high temperature. An electronic module test socket that forms an open socket housing as the connection between the above latch and the above latch portion is released.
In paragraph 1, The above air injection part is, An electronic module test socket, provided as one or provided as two separated by the central part of the air injection part.
In paragraph 1, The above module receiving part is, The area where the above electronic module is accommodated and An electronic module test socket having detachable spaces on both sides of the area in the longitudinal direction to facilitate the accommodation of the electronic module.
In paragraph 4, The above module receiving part is, An electronic module test socket further comprising a plurality of guide portions positioned at locations corresponding to the corners of the electronic module in the area where the electronic module is received, to facilitate the reception of the electronic module.
In paragraph 2, The above push part is, An electronic module test socket that protrudes toward the lower housing in accordance with the outer shape of the electronic module from the inner surface of the socket cover of the upper housing to press the outer edge of the electronic module in the closed socket housing state.
In paragraph 6, The above push part is, A first side facing the rear side where the above hinge part is provided; A second side facing the front side where the above-mentioned latch portion is provided; The two ends of the first side and the second side are connected by a third side and a fourth side; and It includes a protrusion protruding from the center of the first side toward the second side, An electronic module test socket, wherein the thickness of the protrusion, the third side and the fourth side is thicker than the thickness of the first side and the second side.
In Paragraph 7, The first side of the above-mentioned push portion is a test socket for testing an electronic module, having a plurality of holes of the same size at positions corresponding to the plurality of air outlets in the closed socket housing state.
In paragraph 8, The third and fourth sides of the above-mentioned push portion are provided with a plurality of holes for discharging high-temperature air introduced through a plurality of holes on the first side of the above-mentioned push portion, for an electronic module test socket.
In paragraph 2, An electronic module test socket further comprising a push handle rotatably provided on both sides of a second socket cover of the upper housing and pressing a latch of the lower housing when pressed while the closed socket housing is formed.
In paragraph 1, The above electronic module is an electronic module test socket, which is an LPCAMM (Low Power Compression Attached Memory Module).

Description

Electronic module test socket for heat resistance performance test Various embodiments relate to an electronic module test socket for heat resistance performance testing. With the recent availability of various computing devices, the use of memory modules equipped with RAM (Random Access Memory) is rapidly increasing. For example, DIMM (dual in-line memory module), which has DRAM chips mounted on a circuit board, is widely used as a memory device for computers. Meanwhile, ahead of the era of AI laptops, the memory industry is expected to enter full-scale mass production of next-generation DRAM LPCAMM (Low Power Compression Attached Memory Module) starting this year. With Samsung Electronics recently leading the way, followed by SK Hynix and Micron, successive unveiling of LPCAMM samples has set the stage for a competition to secure the technology. The IT industry expects LPCAM to become a 'game changer' in the laptop market, replacing the existing So-DIMM (Small Outline Dual In-line Memory Module) for the first time in about 26 years. Furthermore, starting with laptops, the application areas of LPCAMM are expected to gradually expand to artificial intelligence, servers, data centers, and edge computing. Micron stated that the power consumption and performance of the newly announced LPCAMM memory have been improved by up to 61% and 71%, respectively, compared to existing SODIMM, and introduced that it will help improve the efficiency of generative AI tasks on the latest platforms of both AMD and Intel equipped with AI accelerators. Memory modules can generate heat on their own depending on usage time and application. To prevent operational issues caused by such self-heating from the module's operation or temperatures applied by the usage environment, it is crucial to perform a procedure to test (or evaluate) the reliability of the memory module under temperature fluctuations before product shipment. Conventionally, a method is provided in which an entire number of boards equipped with electronic modules are placed inside equipment such as a chamber, and after setting the temperature inside the chamber to a temperature environment suitable for testing, the reliability of the memory modules is tested. FIG. 1a is a perspective view of an electronic module test socket when the electronic module test socket is open. FIG. 1b is a perspective view of an electronic module test socket when the electronic module test socket is closed. FIG. 1c is a perspective view of the lower housing seen from inside the electronic module test socket. FIG. 1d is a perspective view of the upper housing seen from inside the electronic module test socket. Figure 2 is a drawing showing the appearance of an air inlet when cut along the center in the height direction so that the hollows of the air inlet and air outlet are visible. Figure 3 is a diagram illustrating the flow of high-temperature air injected into an electronic module test socket. Embodiments of the present invention are described below with reference to the attached drawings so that those skilled in the art can easily implement them. However, the present invention may be embodied in various different forms and is not limited to the embodiments described herein. Furthermore, in order to clearly explain the present invention in the drawings, parts unrelated to the explanation have been omitted, and similar parts throughout the specification are denoted by similar reference numerals. Throughout the specification, when a part is described as "comprising" a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components. The terms used in the embodiments of the present invention have been selected to be as widely used as possible, taking into account their functions in the invention; however, these terms may vary depending on the intent of those skilled in the art, case law, the emergence of new technologies, etc. Additionally, in specific cases, terms have been arbitrarily selected by the applicant, and in such cases, their meanings will be described in detail in the description of the relevant embodiments. Therefore, the terms used in these embodiments should be defined not merely by their names, but based on their meanings and the overall content of these embodiments. In embodiments of the present invention, terms including ordinal numbers, such as first, second, etc., may be used to describe various components, but said components are not limited by said terms. Such terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component. The term "and/or" includes a combination of a plurality of related described items or any of a plurality of related described items. Additionally, in emb