KR-20260067543-A - Method of manufacturing ceramic substrate unit and ceramic substrate unit

KR20260067543AKR 20260067543 AKR20260067543 AKR 20260067543AKR-20260067543-A

Abstract

A method for manufacturing a ceramic substrate unit and a ceramic substrate unit are disclosed. The disclosed method for manufacturing a ceramic substrate unit comprises a substrate preparation step of preparing a ceramic substrate having a metal layer bonded to at least one of an upper surface and a lower surface, and a component mounting step of mounting a metal component on the surface of the metal layer. The component mounting step comprises a bonding layer formation step of forming a dot bonding layer in a component mounting area on the surface of the metal layer using a paste-type filler, a component loading step of placing a metal component on the dot bonding layer on the surface of the metal layer, and a heat treatment step of bonding the metal component to the metal layer by performing heat treatment under specific conditions so that the dot bonding layer mediates bonding between the metal component and the metal layer. The disclosed method for manufacturing a ceramic substrate unit By overcoming the disadvantages of the conventional paste bonding method and brazing filler bonding method used for mounting metal components on ceramic substrates, and by combining the unique advantages of each method, it is possible to manufacture a more reliable product.

Inventors

박승곤

Assignees

주식회사 아모그린텍

Dates

Publication Date: 20260513
Application Date: 20241106

Claims (16)

A substrate preparation step of preparing a ceramic substrate having a metal layer bonded to at least one of an upper surface and a lower surface; and A component mounting step of mounting a metal component on the surface of the metal layer; is included, The above component mounting step is, A bonding layer forming step of forming a dot bonding layer in a component mounting area on the surface of the metal layer using a paste-type filler, and A part loading step of placing a metal part on the dot bonding layer on the surface of the metal layer, and A method for manufacturing a ceramic substrate unit, comprising: a heat treatment step of bonding a metal part to a metal layer by performing heat treatment such that the dot bonding layer mediates bonding between the metal part and the metal layer.
In Article 1, The above dot bonding layer is, A method for manufacturing a ceramic substrate unit composed of multiple dot cells in the shape of dots, the planar shape of which is one of a circle, an ellipse, or a polygon.
In Article 2, A method for manufacturing a ceramic substrate unit, wherein the dot bonding layer is formed in a closed ring shape in which at least a portion of adjacent dot cells overlap.
In Article 1, The above bonding layer formation step is, A first process of forming a dot bonding layer by dotting the paste-type filler into the component mounting area, and A method for manufacturing a ceramic substrate unit, comprising a second process of pre-curing the dot bonding layer by performing heat treatment under a first condition.
In Article 4, The above paste-type filler is, A method for manufacturing a ceramic substrate unit, wherein the main component is an Ag sintering paste having silver (Ag) particles.
In Article 4, The first condition for the curing of the dot bonding layer is, A method for manufacturing a ceramic substrate unit, maintained in a nitrogen atmosphere and having a heat treatment temperature of 150 to 180°C.
In Article 1, In the above substrate preparation step, A method for manufacturing a ceramic substrate unit, wherein a metal foil composed of one of Cu, Cu alloy, OFC, EPT Cu, and Al is brazed to at least one of the upper and lower surfaces of a ceramic substrate to prepare a ceramic substrate comprising said metal layer.
In Article 1, In the above bonding layer formation step, the dot bonding layer formed in the component mounting area is subjected to pre-curing treatment, and A method for manufacturing a ceramic substrate unit, wherein in the above heat treatment step, heat treatment is performed at a temperature higher than the curing treatment temperature of the dot bonding layer in the above bonding layer formation step.
In Article 8, The above paste-type filler is an Ag sintering paste whose main component is silver (Ag) particles, and The heat treatment temperature for the pre-curing of the above dot bonding layer is 150°C or higher and 180°C or lower, and A method for manufacturing a ceramic substrate unit, wherein the heat treatment temperature in the above heat treatment step is 650°C or higher and 700°C or lower.
Ceramic substrate; A metal component mounted on the ceramic substrate; and It includes a dot bonding layer disposed between the ceramic substrate and the metal component; and The ceramic substrate comprises a ceramic base and a metal layer bonded to at least one of the upper and lower surfaces of the ceramic base, and The dot bonding layer is disposed in the component mounting area on the surface of the metal layer, and A ceramic substrate unit in which the dot bonding layer disposed in the component mounting area mediates the bonding between the metal layer and the metal component.
In Article 10, A ceramic substrate unit in which the above dot bonding layer is formed by dotting a paste-type filler into the component mounting area and heat treating it.
In Article 11, A ceramic substrate unit in which the paste-type filler forming the dot bonding layer is an Ag sintering paste whose main component is silver (Ag) particles.
In Article 10, The above dot bonding layer is, A ceramic substrate unit composed of multiple dot cells in the shape of dots, the planar shape of which is one of a circle, ellipse, or polygon.
In Article 13, The above dot bonding layer is formed in the shape of a closed ring, and A ceramic substrate unit in which a plurality of dot cells forming a closed ring-shaped dot junction layer overlap at least partially with neighboring ones.
In Article 13, A ceramic substrate unit in which a plurality of dot cells are arranged such that a virtual cell outline connecting the outermost surfaces of the plurality of dot cells constituting a single dot bonding layer is positioned on a virtual partition line that partitions the component mounting area.
In Article 13, A ceramic substrate unit in which a plurality of dot cells are arranged such that a virtual cell outline connecting the outermost surfaces of the plurality of dot cells constituting a single dot bonding layer is positioned closer to the center of the component mounting area than a virtual partition line partitioning the component mounting area.

Description

Method of manufacturing ceramic substrate unit and ceramic substrate unit The present invention relates to a method for manufacturing a ceramic substrate unit, and more particularly to a method for manufacturing a ceramic substrate unit in which metal parts are mounted (bonded) on a metal layer of a ceramic AMB (Active Metal Brazing) substrate having metal layers attached to both sides, and to a ceramic substrate unit manufactured by the method. Among ceramic substrates, Active Metal Brazing (AMB) substrates are primarily used in power semiconductor modules to enhance thermal management and electrical characteristics. Ceramic AMB substrates generally feature a structure containing metal conductive layers on both the top and bottom. These metal conductive layers are typically composed of copper; this structure provides high mechanical strength, thermal conductivity, and strong electrical connections, enabling the maintenance of excellent performance even in high-temperature environments. Metal parts, such as electrical connection elements like metal pads, electrodes, and terminals, or heat dissipation elements like heatsinks, are attached to the metallized surface (top or bottom) of the ceramic AMB substrate. Various attachment methods are used during the process of bonding metal parts to the ceramic AMB substrate, and the durability and electrical and thermal performance of the bonding site are considered important factors when determining the method. There are two main methods primarily used for mounting (bonding) metal components onto ceramic AMB substrates. The first method involves bonding metal components to the AMB substrate using paste, which cures the paste in a low-temperature environment to secure them at the bonding site. The second method utilizes brazing filler, which is melted at high temperatures and used as a bonding medium. Metal component mounting using paste is performed at relatively low temperatures. Consequently, the thermal stress applied to the substrate during the manufacturing process is not significant. However, the paste-curing method has the disadvantage that the adhesive weakens under various external environmental conditions, such as thermal shock, peeling, pulling, or dropping, making components prone to detachment. The brazing filler method, which uses brazing fillers, provides high bonding strength and excellent thermal and electrical conductivity. However, it is difficult to handle the filler accurately, which can lead to problems with quantity control and handling. Additionally, due to the nature of the operation being performed at high temperatures (approximately 900°C), thermal stress on the substrate increases, which may degrade its physical properties. In particular, warping or microcracks occurring at high temperatures can have a critical adverse effect on the performance or reliability of the substrate. In the sheet method, which is primarily used for mounting small components on circuit boards among brazing filler methods, metal sheets for brazing are generally blanked to match the shape of the component to be mounted. However, there is a problem where the material loss rate increases because, depending on the shape of the component, the amount of wasted material (loss part) exceeds the amount of material actually used (use part) during the blanking process. The sheet method also requires separate alignment loading equipment and adhesive to accurately place the punched filler sheet in the desired position, and since punches and jigs must be manufactured to fit the shape of the part, it is not suitable for multi-variety, small-batch production. In addition, in some cases, it is necessary to manufacture the sheet to be used as a brazing filler with a thickness of 30㎛ or less, but this is subject to technical and physical limitations. Moreover, the sheet method requires complex procedures such as preparing a ceramic AMB substrate, applying a primary adhesive to the surface of the metal layer of the substrate, sheet die-cutting, placing the die-cut filler sheet, applying a secondary adhesive, placing the metal part, and brazing to mount a single metal part. Therefore, it is not efficient in terms of product mass production, and there is a problem of increased manufacturing costs due to the complex process. The matters described in the background technology above are intended to aid in understanding the background of the invention and may include matters that are not disclosed prior art. FIG. 1 is a flowchart illustrating a method for manufacturing a ceramic substrate unit according to an embodiment of the present invention. FIG. 2 is a schematic diagram of a process for manufacturing a ceramic substrate unit according to an embodiment of the present invention. FIG. 3 is a drawing illustrating a preferred embodiment of a dot bonding layer. FIG. 4 is a schematic cross-sectional view of a ceramic substrate unit manufactured by the method for manufacturing a ceramic substr