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KR-20260067553-A - PRINTED CIRCUIT BOARD

KR20260067553AKR 20260067553 AKR20260067553 AKR 20260067553AKR-20260067553-A

Abstract

One embodiment of the present invention provides a printed circuit board comprising a first insulating layer including a protrusion and a metal layer disposed on the protrusion of the first insulating layer, wherein the protrusion has a shape in which the width of the lowest portion is wider than the width of the upper portion.

Inventors

  • 박찬진
  • 양현석
  • 정명근
  • 권은수

Assignees

  • 삼성전기주식회사

Dates

Publication Date
20260513
Application Date
20241106

Claims (17)

  1. A first insulating layer including a protrusion; and A metal layer disposed on a protrusion of the first insulating layer; comprising, The above-mentioned protrusion is a printed circuit board having a shape in which the width of the lowest part is wider than the width of the highest part.
  2. In paragraph 1, A printed circuit board having a shape in which the width of the above-mentioned protrusion increases from the top to the bottom.
  3. In paragraph 1, The above metal layer is a printed circuit board having a shape in which the width of the lowest part is wider than the width of the upper part.
  4. In paragraph 1, The above metal layer is a printed circuit board having a shape in which the width increases from the top to the bottom.
  5. In paragraph 1, A printed circuit board in which the width of the lowest part of the metal layer is narrower than the width of the lowest part of the protrusion.
  6. In paragraph 1, A printed circuit board in which the width of the lowest part of the metal layer and the width of the upper part of the protrusion are the same.
  7. In paragraph 1, A printed circuit board in which the side of the metal layer and the side of the protrusion form a co-plane in at least a portion of the region where the metal layer and the protrusion are connected.
  8. In Paragraph 7, A printed circuit board having a shape in which the metal layer and the protrusion increase in width from the uppermost part of the metal layer to the lowermost part of the protrusion.
  9. In paragraph 1, The above metal layer comprises a seed layer and a plating layer disposed on the seed layer, forming a printed circuit board.
  10. In Paragraph 9, A printed circuit board in which the width of the lowest part of the seed layer is wider than the width of the lowest part of the plating layer.
  11. In Paragraph 9, The above seed layer is a printed circuit board that does not extend from the first insulating layer to an area beyond the protrusion.
  12. In paragraph 1, The first insulating layer includes a plurality of protrusions, and A printed circuit board in which the width of the lowest portion of the metal layer is wider than the spacing between adjacent protrusions among the plurality of protrusions.
  13. In Paragraph 12, A printed circuit board in which the width of the uppermost portion of the metal layer is wider than the spacing between adjacent protrusions among the plurality of protrusions.
  14. In Paragraph 12, A printed circuit board in which the width of the lowest portion of the above-mentioned protrusion is wider than the spacing between adjacent protrusions among the plurality of above-mentioned protrusions.
  15. In paragraph 1, The above metal layer is a printed circuit board in which the width of the top and bottom parts are the same.
  16. In paragraph 1, The upper surface of the metal layer above is a printed circuit board including a curved surface.
  17. In paragraph 1, A printed circuit board having a pointed shape on the upper surface of the metal layer.

Description

Printed Circuit Board The present invention relates to a printed circuit board. In response to the recent trend of lightweighting and miniaturization in mobile devices, there is an increasing need to implement thin and thin printed circuit boards mounted on them. Meanwhile, as mobile devices become thinner and lighter, undercut phenomena occur during the process of implementing microcircuits, which can cause defects in the microcircuits. In response to these technical demands, research is continuing to improve reliability while implementing circuits with fine line widths and spacing. Figure 1 is a block diagram schematically illustrating an example of an electronic device system. FIG. 2 is a schematic perspective view of an example of an electronic device. Figure 3 is a schematic cross-sectional view of an example of a printed circuit board. FIG. 4 is a top view of a metal layer placed on a protrusion of a first insulating layer. Figure 5 is a cross-sectional view schematically showing another example of a printed circuit board. Figure 6 is a cross-sectional view schematically showing another example of a printed circuit board. Figure 7 is a cross-sectional view schematically showing another example of a printed circuit board. Figures 8 to 10 show examples of methods for manufacturing printed circuit boards. Embodiments of the present invention will be described below with reference to specific embodiments and the attached drawings. However, embodiments of the present invention may be modified in various different forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Accordingly, the shapes and sizes of elements in the drawings may be exaggerated for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements. electronic devices Figure 1 is a block diagram schematically illustrating an example of an electronic device system. Referring to the drawing, the electronic device (1000) accommodates a main board (1010). Chip-related components (1020), network-related components (1030), and other components (1040), etc., are physically and/or electrically connected to the main board (1010). These are also combined with other electronic components described later to form various signal lines (1090). The chip-related components (1020) include memory chips such as volatile memory (e.g., DRAM), non-volatile memory (e.g., ROM), and flash memory; application processor chips such as central processors (e.g., CPU), graphics processors (e.g., GPU), digital signal processors, encryption processors, microprocessors, and microcontrollers; and logic chips such as analog-to-digital converters and ASICs (application-specific ICs), but are not limited thereto, and other types of chip-related electronic components may also be included. Furthermore, it is obvious that these chip-related components (1020) may be combined with each other. The chip-related components (1020) may also be in the form of a package containing the aforementioned chips or electronic components. Network-related components (1030) include Wi-Fi (IEEE 802.11 family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, LTE (long term evolution), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G, and any other wireless and wired protocols designated thereafter, but are not limited thereto, and any of a number of other wireless or wired standards or protocols may be included. In addition, it goes without saying that network-related components (1030) can be combined with chip-related components (1020). Other components (1040) include high-frequency inductors, ferrite inductors, power inductors, ferrite beads, LTCC (low temperature co-firing ceramics), EMI (electromagnetic interference) filters, MLCC (multi-layer ceramic condensers), etc. However, they are not limited to these, and may also include passive components in the form of chip components used for various other purposes. In addition, it goes without saying that other components (1040) may be combined with chip-related components (1020) and/or network-related components (1030). Depending on the type of electronic device (1000), the electronic device (1000) may include other electronic components that may or may not be physically and/or electrically connected to the main board (1010). Examples of other electronic components include a camera module (1050), an antenna module (1060), a display (1070), a battery (1080), etc. However, it is not limited thereto, and may include an audio codec, a video codec, a power amplifier, a compass, an accelerometer, a gyroscope, a speaker, a mass storage device (e.g., a hard disk drive), a CD (compact disk), a DVD (digital versatile disk), etc. In addition to these, other electronic components used for v