KR-20260067622-A - PRINTED CIRCUIT BOARD

KR20260067622AKR 20260067622 AKR20260067622 AKR 20260067622AKR-20260067622-A

Abstract

The present disclosure relates to a printed circuit board comprising: a frame having a through-hole; a core layer having at least a portion disposed within the through-hole and including a glass layer and a metal via penetrating at least a portion of the glass layer; and a first insulating layer covering at least a portion of each of the frame and the core layer and filling at least a portion of the through-hole, wherein the total thickness of the frame is thicker than the total thickness of the core layer.

Inventors

김인건

Assignees

삼성전기주식회사

Dates

Publication Date: 20260513
Application Date: 20241106

Claims (15)

Frame having a penetration part; A core layer comprising at least a portion disposed within the above-mentioned penetration portion and including a glass layer and a metal via penetrating at least a portion of the glass layer; and A first insulating layer covering at least a portion of each of the frame and the core layer and filling at least a portion of the penetration portion; comprising, The total thickness of the above frame is thicker than the total thickness of the above core layer, Printed circuit board.
In Article 1, The centerline in the thickness direction of the frame and the centerline in the thickness direction of the core layer are placed at different levels. Printed circuit board.
In Article 1, The upper surface of the above frame is substantially coplanar with the upper surface of the first insulating layer, and The lower surface of the above frame is positioned above the lower surface of the core layer, Printed circuit board.
In Article 1, The lower surface of the above frame is substantially coplanar with the lower surface of the above core layer, and The upper surface of the above frame is positioned above the upper surface of the core layer, Printed circuit board.
In Article 1, A first wiring layer disposed on the upper surface of the first insulating layer; A second wiring layer disposed on the lower surface of the first insulating layer; A first connection via penetrating at least a portion of the upper side of the first insulating layer and connecting at least a portion of the first wiring layer to the metal via; and A second connection via penetrating at least a portion of the lower side of the first insulating layer and connecting at least a portion of the second wiring layer to the metal via; further comprising Printed circuit board.
In Article 5, The thickness of the first connection via is greater than 0㎛ and within 20㎛, and The diameter of the upper portion of the first connecting via is greater than 0㎛ and within 20㎛, Printed circuit board.
In Article 5, The core layer further includes a first metal pad disposed on the upper surface of the glass layer and connected to the metal via, and a second metal pad disposed on the lower surface of the glass layer and connected to the metal via. The first and second connection vias are each connected to the first and second metal pads, Printed circuit board.
In Article 5, The first and second connecting vias are each directly connected to the metal vias, Printed circuit board.
In Article 5, A second insulating layer disposed on the upper surface of the first insulating layer; One or more third wiring layers respectively disposed on or within the second insulating layer; One or more third via layers, each disposed within the second insulating layer and connected to one or more third wiring layers; A third insulating layer disposed on the lower surface of the second insulating layer; One or more fourth wiring layers respectively disposed on or within the third insulating layer; and One or more fourth via layers, each disposed within the third insulating layer and connected to one or more fourth wiring layers; further comprising Printed circuit board.
Frame having a penetration part; A core layer comprising at least a portion disposed within the above-mentioned penetration portion, a glass layer, and a metal via penetrating at least a portion of the glass layer; A first insulating layer that covers at least a portion of each of the frame and the core layer and fills at least a portion of the penetration portion; A first connection via penetrating at least a portion of the upper side of the first insulating layer and connected to the upper side of the metal via; and A second connecting via penetrating at least a portion of the lower side of the first insulating layer and connected to the lower side of the metal via; comprising, When the outer surface of the above frame is viewed through a direction perpendicular to the thickness direction, at least a portion of each of the above frame and the first connecting via overlap each other. Printed circuit board.
In Article 10, When the outer surface of the above frame is viewed through a direction perpendicular to the thickness direction, the frame and the second connecting via do not overlap each other as a whole. Printed circuit board.
In Article 10, The total thickness of the above frame is thicker than the total thickness of the above core layer, and The centerline in the thickness direction of the frame and the centerline in the thickness direction of the core layer are placed at different levels. Printed circuit board.
In Article 10, The core layer further includes a first metal pad disposed on the upper surface of the glass layer and connected to the metal via, and a second metal pad disposed on the lower surface of the glass layer and connected to the metal via. The first and second connection vias are each connected to the first and second metal pads, Printed circuit board.
In Article 10, The first and second connecting vias are each directly connected to the metal vias, Printed circuit board.
In Article 10, A first wiring layer disposed on the upper surface of the first insulating layer, at least a portion of which is connected to the first connection via; A second wiring layer disposed on the lower surface of the first insulating layer, at least a portion of which is connected to the second connection via; A second insulating layer disposed on the upper surface of the first insulating layer; One or more third wiring layers respectively disposed on or within the second insulating layer; One or more third via layers, each disposed within the second insulating layer and connected to one or more third wiring layers; A third insulating layer disposed on the lower surface of the second insulating layer; One or more fourth wiring layers respectively disposed on or within the third insulating layer; and One or more fourth via layers, each disposed within the third insulating layer and connected to one or more fourth wiring layers; further comprising Printed circuit board.

Description

Printed Circuit Board The present disclosure relates to a printed circuit board. To meet the high-performance and miniaturization strategies of semiconductors, the required levels of miniaturization and high density for printed circuit boards are increasing. For example, manufacturing high-end products such as server boards requires high multi-layer structures and large bodies. However, as the number of wiring layers increases and the body size grows, the board may become vulnerable to warpage. To address this problem, the use of glass cores is being considered. Figure 1 is a block diagram schematically illustrating an example of an electronic device system. FIG. 2 is a schematic cross-sectional view of an example of a printed circuit board. FIG. 3 is a schematic cross-sectional view of another example of a printed circuit board. Figure 4 is a schematic cross-sectional view showing another example of a printed circuit board. Figure 5 is a schematic cross-sectional view of another example of a printed circuit board. The present disclosure will be described below with reference to the attached drawings. In the drawings, the shapes and sizes of elements may be exaggerated or reduced for clearer explanation. Figure 1 is a block diagram schematically illustrating an example of an electronic device system. Referring to the drawing, the electronic device (1000) accommodates a main board (1010). Chip-related components (1020), network-related components (1030), and other components (1040), etc., are physically and/or electrically connected to the main board (1010). These are also combined with other electronic components described later to form various signal lines (1090). The chip-related components (1020) include memory chips such as volatile memory (e.g., DRAM), non-volatile memory (e.g., ROM), and flash memory; application processor chips such as central processors (e.g., CPU), graphics processors (e.g., GPU), digital signal processors, encryption processors, microprocessors, and microcontrollers; and logic chips such as analog-to-digital converters and ASICs (application-specific ICs), but are not limited thereto, and other types of chip-related electronic components may also be included. Furthermore, it is obvious that these chip-related components (1020) may be combined with each other. The chip-related components (1020) may also be in the form of a package containing the aforementioned chips or electronic components. Network-related components (1030) include Wi-Fi (IEEE 802.11 family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, LTE (long term evolution), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G, and any other wireless and wired protocols designated thereafter, but are not limited thereto, and any of a number of other wireless or wired standards or protocols may be included. In addition, it goes without saying that network-related components (1030) can be combined with chip-related components (1020). Other components (1040) include high-frequency inductors, ferrite inductors, power inductors, ferrite beads, LTCC (low temperature co-firing ceramics), EMI (electromagnetic interference) filters, MLCC (multi-layer ceramic condensers), etc. However, they are not limited to these, and may also include passive components in the form of chip components used for various other purposes. In addition, it goes without saying that other components (1040) may be combined with chip-related components (1020) and/or network-related components (1030). Depending on the type of electronic device (1000), the electronic device (1000) may include other electronic components that may or may not be physically and/or electrically connected to the main board (1010). Examples of other electronic components include a camera module (1050), an antenna module (1060), a display (1070), a battery (1080), etc. However, it is not limited thereto, and may include an audio codec, a video codec, a power amplifier, a compass, an accelerometer, a gyroscope, a speaker, a mass storage device (e.g., a hard disk drive), a CD (compact disk), a DVD (digital versatile disk), etc. In addition to these, other electronic components used for various purposes may be included depending on the type of electronic device (1000). The electronic device (1000) may be a smartphone, personal digital assistant, digital video camera, digital still camera, network system, computer, monitor, tablet, laptop, netbook, television, video game, smart watch, automotive, server, etc. However, it is not limited to these, and it may be any other electronic device that processes data in addition to these. FIG. 2 is a schematic cross-sectional view of an example of a printed circuit board. Referring to the drawings, a printed circuit board (100A) according to an example comprises: a frame (105) having a through-hole (H); a core layer (180) comprising a metal via (131) that penetrates at least a portion of a glass layer (111)