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KR-20260067634-A - Apparatus for evaluating adhesive property and controlling peeled surface reflecting external environment change

KR20260067634AKR 20260067634 AKR20260067634 AKR 20260067634AKR-20260067634-A

Abstract

An adhesive characteristic analysis device and an adhesive characteristic analysis method capable of reflecting changes in the external environment are proposed, which allow for more accurate measurement of adhesive strength by directly reflecting changes in the external environment. The adhesive characteristic analysis device capable of reflecting changes in the external environment according to the present invention includes: a mounting part on which an adhesive strength measurement target is mounted; an adhesive jig attached to the adhesive strength measurement target; an environment control part that controls the external environment of the adhesive strength measurement target; and a control part that applies force to the adhesive jig to calculate the critical energy release rate of the adhesive strength measurement target and sets an environment control value for the adhesive strength measurement target of the environment control part.

Inventors

  • 이용환
  • 박노창

Assignees

  • 한국전자기술연구원

Dates

Publication Date
20260513
Application Date
20241106

Claims (12)

  1. A seating portion on which the object to be measured for adhesion is placed; Adhesive jig that adheres to the target for measuring adhesion strength; An environment control unit that controls the external environment of the adhesion strength measurement target; and An adhesive characteristic analysis device capable of reflecting changes in the external environment, comprising: a control unit that applies force to an adhesive jig to calculate the critical energy release rate of an adhesive strength measurement target and sets an environmental control value for the adhesive strength measurement target of an environmental control unit.
  2. In claim 1, An adhesive characteristic analysis device capable of reflecting changes in the external environment, characterized in that the environmental control unit controls at least one external environment among temperature, magnetic field, pH, and ultrasound applied to the adhesive strength measurement target according to an environmental control value set by the control unit.
  3. In claim 2, An adhesive property analysis device capable of reflecting changes in the external environment, characterized in that the environmental control unit comprises at least one of a heater, a magnetic induction device, a pH-adjustable solvent sink, and an ultrasonic application device.
  4. In claim 3, The environmental control unit is a heater, and An adhesive characteristic analysis device capable of reflecting changes in the external environment, characterized in that the environmental control unit is integrally formed with the mounting unit and controls the temperature of the adhesive strength measurement target mounted on the mounting unit.
  5. In claim 1, An adhesive characteristic analysis device capable of reflecting changes in the external environment, characterized in that the width of one end of the adhesive jig is smaller than the width of the other end.
  6. In claim 1, An adhesive characteristic analysis device capable of reflecting changes in the external environment, characterized by the adhesive jig being connected to a control unit and a movable connection unit.
  7. In claim 1, An adhesive characteristic analysis device capable of reflecting changes in the external environment, characterized in that the control unit applies force to an adhesive jig to measure a force-displacement value and calculates a critical strain energy release rate from the force-displacement value.
  8. A method for analyzing adhesive properties capable of reflecting changes in the external environment, wherein the adhesive strength of an adhesive strength measurement target is analyzed using an adhesive property analysis device capable of reflecting changes in the external environment according to claim 1, Step of placing the object to be measured for adhesion on the seating portion; A step of attaching an adhesive jig to the object to be measured for adhesive strength; A step of controlling the external environment of the adhesion strength measurement target; and A method for analyzing adhesive properties capable of reflecting changes in the external environment, comprising the step of applying force to an adhesive jig to calculate the critical deformation energy release rate of an adhesive strength measurement target.
  9. A mounting portion on which a semiconductor substrate is mounted; Adhesive jig that adheres to a semiconductor substrate; An environment control unit for controlling the external environment of a semiconductor substrate; and A semiconductor substrate separation device capable of controlling separated surface characteristics, comprising: a control unit that applies force to an adhesive jig to calculate the critical strain energy release rate of a semiconductor substrate and sets an environmental control value for the semiconductor substrate of an environmental control unit; The semiconductor substrate is separated into two or more substrates by a force applied to an adhesive jig, and A semiconductor substrate separation device capable of controlling separated surface characteristics, characterized in that the control unit changes the environment of the semiconductor substrate based on the calculated critical strain energy release rate to control the surface characteristics of the substrate separated by the adhesive jig.
  10. A method for separating a semiconductor substrate capable of controlling separated surface characteristics using a semiconductor substrate separation device capable of controlling separated surface characteristics according to claim 9, Step of mounting a semiconductor substrate on a mounting portion; A step of attaching an adhesive jig to a semiconductor substrate; A step of controlling the external environment of a semiconductor substrate; and A method for separating a semiconductor substrate capable of controlling separated surface characteristics, comprising the step of applying force to an adhesive jig to calculate the critical strain energy release rate of the semiconductor substrate, and changing the environment of the semiconductor substrate based on the calculated critical strain energy release rate to control the surface characteristics of the substrate separated by the adhesive jig.
  11. In claim 10, Changes in the external environment are changes in temperature, and A semiconductor substrate separation method capable of controlling separated surface characteristics, characterized by controlling the surface roughness of the separated substrate such that when the temperature is low, the surface roughness of the separated substrate is low, and when the temperature is high, the surface roughness of the separated substrate is high.
  12. In claim 10, Changes in the external environment are changes in the applied ultrasound intensity, and A semiconductor substrate separation method capable of controlling separated surface characteristics, characterized in that the surface roughness of the separated substrate is high when the ultrasonic application intensity is low, and the surface roughness of the separated substrate is low when the ultrasonic application intensity is high.

Description

Apparatus for evaluating adhesive property and controlling peeled surface reflecting external environment change The present invention relates to an adhesive characteristic analysis device and an adhesive characteristic analysis method capable of reflecting changes in the external environment. More specifically, it relates to an adhesive characteristic analysis device and an adhesive characteristic analysis method capable of reflecting changes in the external environment, which allows for more accurate measurement of adhesive strength by directly reflecting changes in the external environment to measure adhesive strength. Due to the depletion of chemical energy sources such as coal and oil, and environmental pollution problems caused by their use, efforts have recently been focused on developing alternative energy sources, one of which is the photovoltaic system utilizing solar energy. Solar power generation refers to a series of technologies that convert solar energy (solar thermal or photovoltaic) into electrical energy. The basic principle utilizes the result of current flowing to an externally connected load, which is generated by the photovoltaic effect. When sunlight is irradiated onto a solar cell composed of a p-n junction semiconductor, electron-hole pairs are created by the light energy, and an electromotive force is generated as the electrons move across the n-layer and p-layer, causing current to flow. A solar module comprises solar cells, an encapsulation layer that encapsulates the solar cells, and a glass substrate. The adhesion between the solar cells and the encapsulation layer is measured using conventional adhesion characteristic evaluation methods, such as the lab shear test and the peel adhesion test. Although these conventional methods are widely used to analyze adhesion characteristics, they have limitations in that they only measure the load value under conditions where peeling occurs, inevitably leading to different results depending on the sample size and conditions. With the recent rise in the recycling of solar modules and secondary battery products, changes in adhesive properties under specific conditions have become critical. However, there is a complete lack of evaluation methods and equipment to engineeringly analyze the adhesive properties of heterogeneous bonded structures under specific conditions. Therefore, there is a need for the development of technology capable of reflecting changes in the external environment in the results when analyzing adhesive strength characteristics. FIG. 1 is a cross-sectional view of an adhesive characteristic analysis device according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of an adhesive characteristic analysis device according to another embodiment of the present invention. FIG. 3 is a drawing for explaining an adhesive jig attached to an adhesive strength measurement target in an adhesive characteristic analysis device according to another embodiment of the present invention, and FIG. 4 is a drawing for explaining an adhesive jig attached to an adhesive strength measurement target in an adhesive characteristic analysis device according to another embodiment of the present invention. FIGS. 5a and 5b are surface images of a semiconductor substrate separated by a semiconductor substrate separation device according to another embodiment of the present invention, and FIGS. 6a and 6b are surface images of a semiconductor substrate separated by a semiconductor substrate separation device according to another embodiment of the present invention. Hereinafter, embodiments of the present invention will be described with reference to the attached drawings. However, embodiments of the present invention may be modified in various different forms, and the scope of the present invention is not limited to the embodiments described below. The embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Although there may be components in the attached drawings that are depicted to have a specific pattern or have a predetermined thickness, this is for convenience of explanation or distinction, and therefore, even if a specific pattern and a predetermined thickness are depicted, the present invention is not limited only to the features of the depicted components. FIG. 1 is a cross-sectional view of an adhesive characteristic analysis device according to an embodiment of the present invention. An adhesive characteristic analysis device capable of reflecting changes in the external environment according to the present embodiment (hereinafter referred to as the adhesive characteristic analysis device (100)) comprises: a seating portion (120) on which an adhesive strength measurement target (130) is seated; an adhesive jig (140) that is attached to the adhesive strength measurement target (130); an environment control portion (110) that controls the external env