KR-20260067639-A - Display panel manufacturing apparatus

KR20260067639AKR 20260067639 AKR20260067639 AKR 20260067639AKR-20260067639-A

Abstract

The present specification relates to a display panel manufacturing apparatus that prevents damage to the donor member or panel defects by ensuring that light-emitting elements do not remain on the transfer member during the transfer process. To realize this, the display panel manufacturing apparatus of the present specification can remove light-emitting elements remaining on the transfer member by causing the light-emitting elements remaining on the transfer member in the transfer process to adhere to a maintenance wafer substrate. Therefore, by removing the light-emitting elements remaining on the transfer material during the transfer process, it is possible to prevent damage to the donor material or panel defects.

Inventors

황영석
곽도영

Assignees

엘지디스플레이 주식회사

Dates

Publication Date: 20260513
Application Date: 20241106

Claims (15)

A transfer member comprising a transfer portion in which a plurality of light-emitting elements for transferring to a display panel are aligned and arranged, and an edge portion surrounding the transfer portion; and A wafer substrate comprising a storage portion accommodating some of the plurality of light-emitting elements and an outer portion surrounding the storage portion; A display panel manufacturing device including
In Article 1, A display panel manufacturing device in which the above-mentioned storage portion has a groove shape with a certain depth, and the surface of the above-mentioned storage portion is lower than the surface of the above-mentioned outer portion.
In Article 2, A display panel manufacturing device having the shape of a uniform uneven pattern on the upper surface of the above outer portion.
In Article 2, A display panel manufacturing device in which the depth of the storage portion is equal to the height of the light-emitting element or has a depth greater than the height of the light-emitting element.
In Paragraph 3, A display panel manufacturing device having an adhesive material or a tack material applied to the upper surface of the groove of the above-mentioned storage portion and the upper surface of the uneven pattern of the above-mentioned outer portion, respectively.
In Article 1, The wafer substrate includes an active region and an inactive region, and In the above active area, a plurality of unit repair areas are arranged in a matrix form, and A display panel manufacturing device in which each of the above unit repair areas includes the above storage portion and the above outer portion.
In Article 1, A display panel manufacturing device comprising a base layer and a stamp layer disposed on one surface of the base layer.
In Article 7, A display panel manufacturing device having an adhesive material or a tackifying material applied to the surface of the above stamp layer.
In Article 8, A display panel manufacturing device in which the stamp layer is adhered to or bonded with the light-emitting element remaining after transferring to the display panel among the plurality of light-emitting elements, or with the light-emitting element for which a transfer error has occurred.
In Article 1, The above storage portion corresponds to the above transfer portion, and The above outer portion corresponds to the above edge portion, a display panel manufacturing device.
In Article 10, The above transfer member is a display panel manufacturing device that moves light-emitting elements attached to the transfer portion and the edge portion among the plurality of light-emitting elements, which are transferred to the display panel and remain or have a transfer error, to the wafer substrate and attaches them to the storage portion and the outer portion.
In Article 1, The above storage portion has an area equal to or larger than the area of the above transfer portion, and A display panel manufacturing device having an area equal to or larger than the area of the edge portion, wherein the outer portion is the same as or larger than the area of the edge portion.
In Article 9, A display panel manufacturing device in which the adhesion force between the stamp layer and the light-emitting element is greater than the adhesion force between the light-emitting element and the donor substrate.
In Article 11, A display panel manufacturing device having an adhesive material or a tackifying material applied to each surface of the storage portion and the outer portion.
In Article 14, The adhesive force between the storage portion and the light-emitting element is greater than the adhesive force between the transfer portion and the light-emitting element, and A display panel manufacturing device in which the adhesion force between the outer portion and the light-emitting element is greater than the adhesion force between the edge portion and the light-emitting element.

Description

Display panel manufacturing apparatus The present specification relates to a display panel manufacturing apparatus, and more specifically, to a display panel manufacturing apparatus for transferring a light-emitting element (LED) to a display panel. Recently, display devices including light-emitting diodes (LEDs) have been attracting attention as next-generation display devices. Since light-emitting diodes are made of inorganic materials rather than organic materials, they have a faster lighting speed compared to liquid crystal displays or organic light-emitting displays, superior luminous efficiency, and the ability to display high-brightness images. These light-emitting elements are transferred to the display panel through a transfer member, but some elements remain on the transfer member or at the edges of the transfer member due to transfer errors. The light-emitting elements remaining on the transfer material in this way fall onto the donor material during the next transfer process, damaging the donor material, or fall onto the display panel, causing panel defects. FIG. 1 is a schematic diagram showing the overall configuration of a display panel manufacturing device according to an embodiment of the present specification. Figure 2 is a plan view showing an example of the configuration of the transfer member illustrated in Figure 1. Figure 3 is a plan view showing an example of the configuration of a wafer substrate illustrated in Figure 1. FIG. 4 is a cross-sectional view taken along the line AA' of FIG. 3 of a wafer substrate according to an embodiment of the present specification. FIG. 5 is a drawing showing the area of a transfer member corresponding to a transfer member according to an embodiment of the present specification. FIG. 6 is a diagram showing an example in which a transfer member according to an embodiment of the present specification picks up a light-emitting element. FIG. 7 is a diagram showing an example in which a light-emitting element remains on a transfer member in a transfer process according to an embodiment of the present specification. FIG. 8 is a diagram showing an example of removing light-emitting elements remaining on a transfer member by attaching them to a wafer substrate in a transfer process according to an embodiment of the present specification. FIG. 9 is a plan view showing an example in which a plurality of light-emitting elements are bonded on a wafer substrate according to an embodiment of the present specification. FIG. 10 is a cross-sectional view taken along the line BB' of FIG. 9 of a wafer substrate according to an embodiment of the present specification. The advantages and features of this specification and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, this specification is not limited to the embodiments disclosed below but may be implemented in various different forms; these embodiments are provided merely to ensure that the disclosure of this specification is complete and to fully inform those skilled in the art of the scope of the invention, and this specification is defined only by the scope of the claims. Shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining embodiments of this specification are exemplary and are not limited to the depicted items. Throughout the specification, the same reference numerals refer to the same components. Furthermore, in describing this specification, if it is determined that a detailed description of related prior art could unnecessarily obscure the gist of this specification, such detailed description is omitted. Unless the terms "includes," "has," "consists of," etc. mentioned in this specification are used exclusively, other parts may be added. When a component is expressed in the singular, it includes cases where it is included in the plural unless specifically stated otherwise. In interpreting the components, even if there is no separate explicit description of the error range, it is interpreted as including the error range. In the case of a description of a positional relationship, for example, when the positional relationship between two parts is described using terms such as "on," "on top," "on bottom," or "next to," for example, unless "immediately" or "directly" is used, one or more other parts may be located between the two parts. In the case of an explanation of temporal relationships, if the temporal sequence is described using terms such as later, following, next, or before, it may include cases where the relationship is not continuous unless "immediately" or "directly" is used. Although terms such as "first," "second," etc. are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from another. Accordingly, the first component mentioned below may be the second component within th