KR-20260067684-A - MULTILAYER ELECTRONIC COMPONENT

KR20260067684AKR 20260067684 AKR20260067684 AKR 20260067684AKR-20260067684-A

Abstract

A stacked electronic component according to one embodiment of the present disclosure comprises: first and second surfaces facing each other in a first direction; third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction; fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction; an overlapping region comprising a dielectric layer and first and second internal electrodes alternately arranged in the first direction with the dielectric layer in between; a first margin region disposed between the overlapping region and the third surface where the second internal electrode is not present; and a second margin region disposed between the overlapping region and the fourth surface where the first internal electrode is not present; a body comprising first and second external electrodes respectively disposed on the third and fourth surfaces and connected to the first and second internal electrodes respectively, and first and second through electrodes respectively penetrating the first and second margin regions and connected to the first and second internal electrodes respectively; wherein, in the cross-section of the body in the second and third directions, the area of the first through electrode relative to the area of the first margin region When the ratio of the area is R1 and the ratio of the area of the second penetrating electrode to the area of the second margin region is R2, at least one of 3% ≤ R1 ≤ 7% and 3% ≤ R2 ≤ 7% can be satisfied.

Inventors

이지훈
김상엽
김태용

Assignees

삼성전기주식회사

Dates

Publication Date: 20260513
Application Date: 20241106

Claims (11)

It includes first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction, A body comprising a dielectric layer and an overlapping region including first and second internal electrodes alternately arranged in the first direction with the dielectric layer in between, a first margin region disposed between the overlapping region and a third surface where the second internal electrode is not present, and a second margin region disposed between the overlapping region and a fourth surface where the first internal electrode is not present; First and second external electrodes respectively disposed on the third and fourth surfaces and connected to the first and second internal electrodes respectively; and First and second penetrating electrodes that penetrate the first and second margin regions, respectively, and are connected to the first and second internal electrodes, respectively; comprising In the second and third cross-sections of the body, when the ratio of the area of the first penetrating electrode to the area of the first margin region is denoted as R1 and the ratio of the area of the second penetrating electrode to the area of the second margin region is denoted as R2, satisfying one or more of 3% ≤ R1 ≤ 7% and 3% ≤ R2 ≤ 7% Stacked electronic components.
In paragraph 1, The first and second penetrating electrodes are each arranged in multiple numbers, and The area of the first penetrating electrode is the total area of the plurality of first penetrating electrodes, and The area of the second penetrating electrode is the sum of the areas of the plurality of second penetrating electrodes. Stacked electronic components.
In paragraph 2, The plurality of first penetrating electrodes are arranged in the third direction, and The plurality of second penetrating electrodes are arranged in the third direction. Stacked electronic components.
In paragraph 1, Let L1 be the length of the first margin region in the second direction, and L1a be the distance in the second direction between the third surface and the first penetrating electrode, and the ratio of L1a to L1 (L1a/L1) is 5% or more. Stacked electronic components.
In paragraph 1, Let L1 be the length of the first margin region in the second direction, and L1b be the distance in the second direction between the overlapping region and the first penetrating electrode, and the ratio of L1b to L1 (L1b/L1) is 5% or more. Stacked electronic components.
In paragraph 1, When the diameter of the first penetrating electrode is denoted as D1, D1 is 5 μm or more Stacked electronic components.
In paragraph 3, When the diameter of the first penetrating electrode is D1 and the spacing between the plurality of first penetrating electrodes is D2, the ratio of D2 to D1 (D2/D1) is 1.2 or greater. Stacked electronic components.
In Paragraph 7, The ratio of D2 to D1 (D2/D1) is 2.5 or less. Stacked electronic components.
In paragraph 1, The first external electrode is disposed extending from the third surface onto the first and second surfaces, and The second external electrode is disposed extending from the fourth surface onto the first and second surfaces, and The first penetrating electrode is exposed to the first and second surfaces and connected to the first external electrode, and The second penetrating electrode is exposed to the first and second surfaces and connected to the second external electrode. Stacked electronic components.
In paragraph 1, The first internal electrode comprises a first main portion disposed in the overlapping area and overlapping with the second internal electrode, and a first lead portion disposed in the first margin area and extending from the first main portion to be exposed to the third surface. The second internal electrode comprises a second main portion disposed in the overlapping region and overlapping with the first internal electrode, and a second lead portion disposed in the second margin region and extending from the second main portion to be exposed to the fourth surface. Stacked electronic components.
In paragraph 1, In the second and third cross-sections of the body, the cross-sections of the first and second penetrating electrodes are circular. Stacked electronic components.

Description

Multilayer Electronic Components The present disclosure relates to a stacked electronic component. Multilayer Ceramic Capacitors (MLCCs), a type of multilayer electronic component, are chip-type capacitors mounted on printed circuit boards of various electronic products—such as video devices like Liquid Crystal Displays (LCDs) and Plasma Display Panels (PDPs), as well as computers, smartphones, and mobile phones—to charge or discharge electricity. Due to their advantages of being compact, offering high capacitance, and being easy to mount, these multilayer ceramic capacitors can be used as components in a wide range of electronic devices. Recently, as the performance of electronic products equipped with MLCCs has improved, there is a demand for higher capacitance and uniform capacitance of MLCCs. However, capacitance variation and ESR variation may occur due to poor contact between the internal and external electrodes of the MLCC. To solve these problems, there is a method of arranging via electrodes that connect internal electrodes of the same polarity by machining holes in the body. FIG. 1 is a schematic perspective view of a stacked electronic component according to one embodiment of the present disclosure. Figure 2 is a schematic cross-sectional view showing the II' section of Figure 1. Figure 3 is a schematic cross-sectional view of the II-II' section of Figure 1. Figure 4 is a schematic cross-sectional view of the III-III' section of Figure 2. Figure 5 is a cross-sectional view with the internal electrode and through electrode removed from Figure 4, schematically illustrating the area of the margin region. FIG. 6 is a cross-sectional view with the internal electrode removed from FIG. 4, schematically illustrating the area of the through electrode. Hereinafter, embodiments of the present disclosure will be described with reference to specific examples and the accompanying drawings. However, the embodiments of the present disclosure may be modified in various different forms, and the scope of the present disclosure is not limited to the embodiments described below. Furthermore, the embodiments of the present disclosure are provided to more fully explain the present disclosure to those skilled in the art. Accordingly, the shapes and sizes of elements in the drawings may be exaggerated for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements. Furthermore, in order to clearly explain the present disclosure in the drawings, parts unrelated to the explanation are omitted, and the size and thickness of each component shown in the drawings are depicted arbitrarily for convenience of explanation; thus, the present disclosure is not necessarily limited to what is illustrated. Additionally, components with the same function within the scope of the same concept are described using the same reference numerals. Moreover, throughout the specification, when a part is described as "comprising" a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components. In the drawing, the first direction (X) can be defined as the thickness (T) direction, the second direction (Y) as the length (L) direction, and the third direction (Z) as the width (W) direction. Stacked electronic components FIG. 1 is a schematic perspective view of a stacked electronic component according to one embodiment of the present disclosure. Figure 2 is a schematic cross-sectional view showing the I-I' section of Figure 1. Figure 3 is a schematic cross-sectional view of the II-II' section of Figure 1. Figure 4 is a schematic cross-sectional view of the III-III' section of Figure 2. Figure 5 is a cross-sectional view with the internal electrode and through electrode removed from Figure 4, schematically illustrating the area of the margin region. FIG. 6 is a cross-sectional view with the internal electrode removed from FIG. 4, schematically illustrating the area of the through electrode. Hereinafter, a stacked electronic component (100) according to an embodiment of the present invention will be described in detail with reference to FIGS. 1 to 6. In addition, a stacked ceramic capacitor is described as an example of a stacked electronic component, but the present invention is not limited thereto and may be applied to various stacked electronic components, such as inductors, piezoelectric elements, varistors, or thermistors. A stacked electronic component (100) according to one embodiment of the present disclosure may include a body (110) comprising a dielectric layer (111) and internal electrodes (121, 122), external electrodes (131, 132), and through electrodes (141, 142). There are no specific restrictions on the specific shape of the body (110), but as illustrated, the body (110) may be formed in a cuboid shape or a similar shape. Due to shrinkage of the ceramic powder contained in the body (110) during the fi