KR-20260067785-A - Printed circuit heat exchanger with gap space for uniform flow distribution and method for manufacturing the same

KR20260067785AKR 20260067785 AKR20260067785 AKR 20260067785AKR-20260067785-A

Abstract

According to one embodiment of the technical concept of the present invention, a printed circuit board type heat exchanger having a gap space arranged for uniform flow distribution and a method for manufacturing the same relate to a printed circuit board type heat exchanger and a method for manufacturing the same, wherein a gap space connecting the flow paths is formed above the flow paths of the printed circuit board type heat exchanger to enable fluid flow between the flow paths, thereby resolving non-uniformity of flow rates among the flow paths. The printed circuit board type heat exchanger includes a plurality of flow paths, and two or more adjacent flow paths can be connected to each other so that fluid can move through a gap space located above the flow paths. Each flow path extends in the longitudinal direction, and the gap space may be positioned to connect the flow paths only for a portion of the lengthwise direction of the flow paths.

Inventors

김창현
도규형
김태훈
유화롱
김민창
배준혁
한용식
최병일

Assignees

한국기계연구원

Dates

Publication Date: 20260513
Application Date: 20241106

Claims (14)

In a method for manufacturing a printed circuit board type heat exchanger, A step of forming concave channels extending longitudinally and having an open top on the upper surface of a first metal plate; A step of forming at least one concave gap space with an open bottom on the lower surface of the second metal plate; and The method includes the step of positioning a second metal plate on the upper surface of a first metal plate and joining them, A method for manufacturing a printed circuit board type heat exchanger characterized in that the gap space is located above at least a portion of the area of the fluid paths.
In Article 1, A method for manufacturing a printed circuit board type heat exchanger characterized by a gap space located above all the fluid passages to connect the fluid passages so that fluid can move through the gap space.
In Article 1, The second metal plate includes a plurality of mutually spaced gap spaces, and The gap spaces are each located above predetermined Euros, and A method for manufacturing a printed circuit board type heat exchanger characterized by connecting fluid passages located below the gap space so that fluid can move through the gap space only between the fluid passages located below the gap space.
In Article 1, A method for manufacturing a printed circuit board type heat exchanger characterized in that the cross-section of the Euro is semicircular or polygonal.
In Article 1, A method for manufacturing a printed circuit board type heat exchanger characterized by the Euro being formed through an etching step.
In Article 1, A method for manufacturing a printed circuit board type heat exchanger characterized in that the gap space is formed through a milling step.
In Article 1, A method for manufacturing a printed circuit board type heat exchanger characterized in that the first metal plate and the second metal plate are joined through a lamination and diffusion bonding step.
In a printed circuit board type heat exchanger comprising at least one connecting channel, The cross-sectional shape of the connecting channel consists of an upper shape and a lower shape, The upper shape is a square shape and The lower shape is two or more semicircular or polygonal shapes, and A printed circuit board type heat exchanger characterized in that the lower shape is connected to the upper shape so that fluid can move.
In a printed circuit board type heat exchanger comprising a plurality of flow paths, A printed circuit board type heat exchanger characterized in that two or more adjacent fluid passages are connected to each other so that fluid can move through a gap space located above the fluid passages.
In Article 9, Each Euro is extended in the longitudinal direction, and A printed circuit board type heat exchanger characterized in that the gap space is positioned to connect the fluid paths only in some sections along the longitudinal direction of the fluid paths.
In a printed circuit board type heat exchanger in which a first metal plate and a second metal plate are joined together, The first metal plate is located beneath the second metal plate, and At least one concave gap space with an open bottom is formed on the lower surface of the second metal plate, and On the upper surface of the first metal plate, channels with an open top and a concave bottom are formed and extend along the longitudinal direction, and A printed circuit board type heat exchanger characterized in that the gap space is located above at least a portion of the length direction of two or more adjacent flow paths.
In Article 11, A printed circuit board type heat exchanger characterized in that the first metal plate and the second metal plate are joined through lamination and diffusion bonding steps.
In Article 11, A printed circuit board type heat exchanger characterized in that the gap space is a cuboid-shaped space formed on the lower surface of the second metal plate.
In Article 11, A printed circuit board type heat exchanger characterized by a lower cross-section that is semicircular or polygonal.

Description

Printed circuit heat exchanger with gap space for uniform flow distribution and method for manufacturing the same The present invention relates to a printed circuit board type heat exchanger having a gap space arranged for uniform flow distribution and a method for manufacturing the same. More specifically, the invention relates to a printed circuit board type heat exchanger and a method for manufacturing the same, wherein a gap space connecting the flow paths is formed above the flow paths of the printed circuit board type heat exchanger to enable fluid flow between the branched flow paths, thereby resolving the non-uniformity of flow rates among the flow paths. A Printed Circuit Heat Exchanger (PCHE) is a heat exchanger designed to withstand extreme environments such as high pressure and low temperature, and is capable of providing stable structural and thermal fluid performance in cryogenic environments such as liquid hydrogen. A printed circuit board type heat exchanger is formed by stacking and combining multiple metal plates, and generally one fluid flows through one metal plate, and heat exchange occurs between a high-temperature fluid and a low-temperature fluid by flowing two or more fluids alternately through multiple layers. Figure 1 is a drawing illustrating the shapes of the flow paths of a conventional printed circuit board type heat exchanger. In a printed circuit board type heat exchanger (10), fluid entering through a head (distributor) is branched and flows into several flow paths (11) with a uniform flow rate, which is one of the important factors in increasing the efficiency and stability of the heat exchanger. In a general printed circuit board type heat exchanger (10), as shown in FIG. 1(a), the flow paths (11) are positioned in a separated state after branching, and since the flow paths (11) do not cross in the middle of the flow paths (11), it is impossible to exchange flow between the flow paths (11). Therefore, it is important to branch with the same flow rate for each flow path (11) at the beginning of branching. However, in reality, differences in the flow rate entering each channel (11) may occur due to the asymmetric shape of the head and the fine non-uniformity of the channels that occurs during the manufacturing process. In addition, some or all of the microchannels may become clogged due to contaminants, particles, or corrosion, and in such cases, a decrease in the performance of the heat exchanger may occur. To solve these problems, a bypass channel (12) was formed between the channels (11) as shown in FIG. 1(b). However, in this case, there is a problem in that the flow rate exchange occurs only in a specific part of a specific channel. Many inventors recognize the importance of resolving flow non-uniformity between channels in printed circuit board type heat exchangers and are researching and developing solutions, but satisfactory results have not yet been obtained. A brief description of each drawing is provided to help to better understand the drawings cited in this specification. Figure 1 is a drawing illustrating the shapes of the flow paths of a conventional printed circuit board type heat exchanger. FIG. 2 is a diagram illustrating an etching step performed by a method for manufacturing a printed circuit board type heat exchanger according to one embodiment of the technical concept of the present invention. FIG. 3 illustrates the lamination and diffusion bonding steps performed by a method for manufacturing a printed circuit board type heat exchanger according to one embodiment of the technical concept of the present invention. FIG. 4 is a drawing illustrating exemplary shapes of gap spaces of a printed circuit board type heat exchanger according to one embodiment of the technical concept of the present invention. The present invention is capable of various modifications and may have various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. However, this is not intended to limit the present invention to specific embodiments, and it should be understood that the present invention includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the invention. In describing the present invention, if it is determined that a detailed description of related prior art may unnecessarily obscure the essence of the present invention, such detailed description is omitted. Additionally, numbers used in the description of this specification (e.g., 1st, 2nd, etc.) are merely identification symbols to distinguish one component from another. In addition, when a component is described in this specification as being "connected" or "connected" to another component, it should be understood that the component may be directly connected to or directly connected to the other component, but unless otherwise specifically stated, it may also be connected or connected through another com