KR-20260067840-A - ADJUSTMENT APPARATUS FOR FILM THICKNESS UNIFORMITY MODULE AND PLASMA GENERATOR INCLUDING THE SAME

KR20260067840AKR 20260067840 AKR20260067840 AKR 20260067840AKR-20260067840-A

Abstract

An adjustment device for a film thickness uniformization module for a plasma generating device according to one embodiment includes an alignment unit mounted on a film thickness uniformization module that includes a dimple plate having a plurality of grooves and a slot plate having a plurality of slot holes, and aligns the dimple plate and the slot plate with each other, wherein the alignment unit includes an alignment degree measuring unit installed on the dimple plate and measuring the degree of alignment between the dimple plate and the slot plate, and a position adjustment unit that adjusts the position of the dimple plate using the degree of alignment measured by the alignment degree measuring unit.

Inventors

이현정
박주성
김선호
이용희

Assignees

삼성전자주식회사

Dates

Publication Date: 20260513
Application Date: 20241106

Claims (10)

An alignment part mounted on a film thickness uniformization module comprising a dimple plate having a plurality of grooves and a slot plate having a plurality of slot holes, which forms a film of uniform thickness on a substrate located inside a plasma chamber, and aligning the dimple plate and the slot plate with each other. Includes, The above alignment part An alignment measuring unit installed on the dimple plate and measuring the degree of alignment between the dimple plate and the slot plate, and A position adjustment unit that adjusts the position of the dimple plate using the alignment measured by the alignment measurement unit. An adjustment device for a film thickness homogenization module for a plasma generation device, comprising
In Paragraph 1, The above alignment measurement unit A first ring frame covering the edge portion of the upper surface of the above dimple plate, A plurality of sensing transmitters installed on the first ring frame, A second ring frame on which the edge portion of the lower surface of the above-mentioned dimple plate is seated, and A plurality of sensing receivers installed on the second ring frame and corresponding to the plurality of sensing transmitters An adjustment device for a film thickness homogenization module for a plasma generation device, comprising
In Paragraph 1, The above-mentioned sensing transmitter A sensing transmitting body installed on the first ring frame, and A light sensor installed inside the above-mentioned sensing transmitting body and transmitting light to the above-mentioned sensing receiving unit Adjustment device for a film thickness homogenization module for a plasma generation device including
In Paragraph 3, The above-mentioned sensing transmitter Sensor cover protecting the above light sensor from the outside An adjustment device for a film thickness homogenization module for a plasma generation device, further comprising
In Paragraph 3, The above-mentioned sensing receiver A sensing receiving body installed on the second ring frame, and A light receiver installed in the above-mentioned sensing receiving body and receiving light irradiated from the light sensor Includes, The above optical sensor transmits light to the above optical receiver to measure the alignment distance between the optical sensor and the above optical receiver. An adjustment device for a film thickness uniformization module for a plasma generation device.
In Paragraph 1, The above position adjustment part A dimple plate handling part for handling the above dimple plate, and A dimple plate position adjustment unit installed in correspondence with the above-mentioned sensing receiver and adjusting the position of the dimple plate. An adjustment device for a film thickness homogenization module for a plasma generation device, comprising
In paragraph 6, The above dimple plate position adjustment part A position control body connected to the above-mentioned sensing receiving body, and A rotary screw part installed on the above-mentioned position adjustment body that rotates to press the side wall of the dimple plate and adjusts the position of the dimple plate. An adjustment device for a film thickness homogenization module for a plasma generation device, comprising
In Paragraph 1, An adjustment device for a film thickness uniformization module for a plasma generation device, further comprising a control unit connected to the alignment unit and optimizing the alignment degree using alignment degree data regarding the alignment degree measured by the alignment unit.
In paragraph 8, The above control unit A data storage unit that stores the above alignment data, A data display unit that displays the above alignment data, and A data communication unit that transmits and receives the above alignment data to and from an external database An adjustment device for a film thickness homogenization module for a plasma generation device, comprising
A plasma chamber that generates plasma inside; and An adjustment device for a film thickness uniformization module for a plasma generation device, which adjusts a film thickness uniformization module that is detachably attached to the above plasma chamber and includes a dimple plate having a plurality of grooves and a slot plate having a plurality of slot holes, forming a film of uniform thickness on a substrate located inside the plasma chamber. Includes, The adjustment device of the film thickness uniformization module for the above-mentioned plasma generation device Alignment part that aligns the above dimple plate and the above slot plate with each other Includes, The above alignment part An alignment measuring unit installed on the dimple plate to measure the degree of alignment between the dimple plate and the slot plate, and A position adjustment unit that adjusts the position of the dimple plate using the alignment measured by the alignment measurement unit. A plasma generation device comprising

Description

Adjustment apparatus for film thickness uniformity module and plasma generator including the same The present disclosure relates to an adjustment device for a film thickness uniformization module and a plasma generation device including the same, and more specifically, to an adjustment device for a film thickness uniformization module that forms a film of uniform thickness on a substrate located inside a plasma generation device and a plasma generation device including the same. Semiconductor devices can be manufactured by various semiconductor manufacturing processes, such as etching, deposition, ashing, or cleaning processes. In plasma generation devices used in the manufacturing process of such semiconductor devices, plasma-generating gases are concentrated in the center of the substrate located inside the plasma chamber, making it difficult to form a film of uniform thickness in both the center and periphery of the substrate. Accordingly, a film thickness uniformization module for a plasma generation device can be installed in a plasma chamber to increase the plasma density of the plasma adjacent to the periphery of the substrate, thereby forming a film of uniform thickness in the central and periphery of the substrate. This film thickness uniformization module includes a dimple plate and a slit plate facing each other, and by utilizing a plurality of grooves in the dimple plate and a plurality of slit holes in the slit plate, the plasma density of the plasma formed in the periphery inside the plasma chamber can be increased to form a film of uniform thickness in the central and periphery of the substrate. At this time, since the dimple plate and the slit plate must be aligned with each other, the position of the dimple plate is adjusted to align the dimple plate and the slit plate. However, since a separate alignment pin is installed between the dimple plate and the inner wall of the plasma chamber and the position of the dimple plate is adjusted by pushing the heavy dimple plate with the user's hand, it is difficult to finely align the dimple plate and the slit plate, and process defects may occur due to misalignment of the dimple plate and the slit plate. FIG. 1 is a schematic cross-sectional view of a plasma generation device according to one embodiment. Figure 2 is a detailed plan view of the dimple plate of the film thickness uniformization module of Figure 1. Figure 3 is a specific plan view of the slot plate of the film thickness uniformization module of Figure 1. FIG. 4 is a detailed plan view of the dimple plate and slot plate of FIG. 2 and FIG. 3 aligned. Figure 5 is a detailed perspective view of the adjustment device of the film thickness uniformization module. Fig. 6 is an exploded perspective view of Fig. 5. Figure 7 is an enlarged perspective view of the alignment measurement section of Figure 6. Figure 8 is a plan view of the sensing transmitter and sensing receiver of the alignment measurement unit of Figure 6. FIG. 9 is a detailed exploded perspective view of the control unit of FIG. 6. Hereinafter, various embodiments of the present invention will be described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present invention. The present invention may be embodied in various different forms and is not limited to the embodiments described herein. To clearly explain the present invention, parts unrelated to the explanation have been omitted, and the same reference numerals are used for identical or similar components throughout the specification. Furthermore, the size and thickness of each component shown in the drawings are depicted arbitrarily for convenience of explanation, and thus the present invention is not necessarily limited to what is illustrated. Thicknesses have been enlarged in the drawings to clearly represent various layers and regions. Additionally, for convenience of explanation, the thickness of some layers and regions has been exaggerated in the drawings. Furthermore, when it is said that a part, such as a layer, membrane, region, or plate, is "on" or "on" another part, this includes not only the case where it is "directly above" the other part, but also the case where there is another part in between. Conversely, when it is said that a part is "directly above" another part, it means that there is no other part in between. Also, saying that a part is "on" or "on" a reference part means that it is located above or below the reference part, and does not necessarily mean that it is located "on" or "on" in the direction opposite to gravity. Furthermore, throughout the specification, when a part is described as "including" a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components. Additionally, throughout the specification, "planar" means when the subject part is viewed from above, and "cross-sectional" means when the cros