KR-20260067958-A - APPARATUS FOR TREATING SUBSTRATE

Abstract

A substrate processing device is provided. The substrate processing device comprises a first body, a second body that is combined with the first body in a first direction to form a processing space in which a substrate is processed, a moving member that moves at least one of the first body or the second body along the first direction, and a sealing member that is inserted into a groove formed by processing a part of the second body inwardly, wherein the average surface roughness of the groove is Ra 0.05 to Ra 0.5.

Inventors

• 최태종
• 한창욱
• 허광행
• 홍기택
• 송진욱
• 권정민
• 김홍관
• 손광성
• 안설
• 우병길
• 정희찬

Assignees

• 삼성전자주식회사
• 세메스 주식회사

Dates

Publication Date

20260513

Application Date

20250508

Priority Date

20241106

Claims (10)

1. First body; A second body that is combined with the first body in a first direction to form a processing space in which a substrate is processed; A moving member that moves at least one of the first body or the second body along the first direction; and A sealing member inserted into a groove formed by processing a part of the second body inward, wherein A substrate processing apparatus having an average surface roughness of Ra 0.05 to Ra 0.5 of the above grooves.
2. In paragraph 1, The above groove includes a first surface, a second surface, and a third surface, wherein The first surface is spaced apart from the second surface and is formed at a position closer to the processing space than the second surface, and The second surface forms an acute angle with respect to the third surface, and A substrate processing device in which the third surface connects the first surface and the second surface.
3. In paragraph 2, A substrate processing device in which the first surface, the second surface, and the third surface have the same surface roughness.
4. In paragraph 2, A substrate processing device in which, when at least one of the first body or the second body moves along the first direction, the sealing member contacts the first to third surfaces of the groove.
5. In paragraph 1, The above sealing member includes a fixing member inside, A substrate processing device in which the above-mentioned fixing member has a higher strength than the above-mentioned sealing member.
6. In paragraph 5. The above-mentioned groove includes a first surface, a second surface, and a third surface, wherein the first surface is formed at a location closer to the processing space than the second surface, and the third surface connects the first surface and the second surface. The sealing member comprises a first part facing the first surface and a second part facing the second surface, wherein A substrate processing device in which the above-mentioned fixed member is located between the first part and the second part in a second direction intersecting the first direction.
7. In paragraph 6, A substrate processing device in which the second surface forms an acute angle with respect to the third surface.
8. First body; A second body that is combined with the first body in a first direction to form a processing space in which a substrate is processed; A moving member that moves at least one of the first body or the second body along the first direction; and A sealing member inserted into a groove formed by processing a part of the second body inward, wherein The above sealing member includes a fixing member inside, and A substrate processing device in which the above-mentioned fixing member has a higher strength than the above-mentioned sealing member.
9. In paragraph 8, The above-mentioned groove includes a first surface, a second surface, and a third surface, wherein the first surface is formed at a location closer to the processing space than the second surface, and the third surface connects the first surface and the second surface. The sealing member comprises a first part facing the first surface and a second part facing the second surface, wherein A substrate processing device in which the above-mentioned fixed member is located between the first part and the second part in a second direction intersecting the first direction.
10. In Paragraph 9, A substrate processing device in which the above-mentioned fixed member is ring-shaped.

Description

Apparatus for Treating Substrate The present invention relates to a substrate processing device. To manufacture semiconductor devices, desired patterns are formed on a substrate through various processes such as photolithography, etching, ashing, ion implantation, and thin film deposition. Various processing solutions are used in each process, and contaminants and particles are generated during the process. To address this, cleaning processes to remove contaminants and particles are essential before and after each process. Generally, the cleaning process involves treating the substrate with chemicals and a rinse solution, followed by a drying process. The drying step is a process for drying the rinse solution remaining on the substrate, in which the substrate is dried using an organic solvent such as isopropyl alcohol (IPA). However, as the distance between patterns formed on the substrate (CD: Critical Dimension) becomes finer, organic solvents remain in the spaces between the patterns. Recently, a supercritical treatment process is performed to remove organic solvents remaining on a substrate. The supercritical treatment process is conducted in a sealed space to satisfy specific conditions for the supercritical fluid. These specific conditions involve high temperature and high pressure compared to atmospheric pressure and room temperature. FIG. 1 is a schematic diagram illustrating a substrate processing apparatus according to some embodiments of the present invention. FIG. 2 is a schematic diagram illustrating a liquid processing chamber of a substrate processing apparatus according to some embodiments of the present invention. FIG. 3 is a schematic diagram illustrating a drying chamber of a substrate processing apparatus according to some embodiments of the present invention. Figure 4 is an enlarged view of the lower body shown in area P1 of Figure 3. FIG. 5 is a plan view illustrating a sealing member of a substrate processing apparatus according to some embodiments of the present invention. FIG. 6 is a cross-sectional view illustrating a sealing member of a substrate processing device according to some embodiments of the present invention placed in a groove of a lower body. FIG. 7 is a cross-sectional view illustrating how the sealing member of FIG. 6 comes into contact with and is compressed by the upper chamber. FIG. 8 is a cross-sectional view illustrating a sealing member of a substrate processing device according to some embodiments of the present invention placed in a groove of a lower body. FIG. 9 is a schematic diagram illustrating a drying chamber according to some embodiments of the present invention. Figure 10 is a drawing showing the appearance of a sealing member of a general substrate processing device. Figure 11 is a diagram showing the appearance of a semiconductor substrate in a typical substrate processing device. Figure 12 is a drawing showing the surface of a groove of a typical substrate processing device. FIG. 13 is a drawing showing the surface of a groove of a substrate processing device according to some embodiments of the present invention. FIG. 1 is a schematic diagram illustrating a substrate processing apparatus according to some embodiments of the present invention. Referring to FIG. 1, the substrate processing device may include an index module (10), a processing module (20), and a controller (30). When viewed from above, the index module (10) and the processing module (20) may be arranged along one direction. Hereinafter, the direction in which the index module (10) and the processing module (20) are arranged is referred to as the first direction (X), the direction perpendicular to the first direction (X) when viewed from above is referred to as the second direction (Y), and the direction perpendicular to both the first direction (X) and the second direction (Y) is referred to as the third direction (Z). The index module (10) may include a load port (12) and an index frame (14). The index module (10) may return a substrate (W) from a container (C) containing the substrate (W) to a processing module (20), and receive a substrate (W) that has been processed in the processing module (20) back into the container (C). The load port (12) may be located on the opposite side of the processing module (20) relative to the index frame (14). A container (C) containing the substrates (W) may be placed in the load port (12). Multiple load ports (12) may be provided, and multiple load ports (12) may be arranged along a second direction (Y). The container (C) may be a sealed container such as a Front Open Unified Pod (FOUP). The container (C) may be placed at the load port (12) by a transport means (not shown) such as an overhead transfer, overhead conveyor, or automatic guided vehicle, or by an operator. An index robot (120) may be provided in the index frame (14). A guide rail (124) extending in a second direction (Y) may be provided within the index frame (14), and the index robot (