KR-20260067961-A - Offset Measuring Apparatus and Offset Measuring Method Including the Same

KR20260067961AKR 20260067961 AKR20260067961 AKR 20260067961AKR-20260067961-A

Abstract

An offset measuring device for measuring the offset of a shim plate of a slot die that applies an active material slurry to a current collector plate conveyed along a coating roll, wherein the offset measuring device according to an embodiment of the present invention comprises: a main body portion configured to be positioned above the slot die; a first frame portion configured to be movable in a first axis direction parallel to the slurry discharge direction of the slot die and configured to be movable between the coating roll and the slot die and a second frame portion configured to be movable in a second axis direction intersecting the first axis direction, wherein a measuring tip for measuring the offset of the shim plate is configured in the second frame portion.

Inventors

임현욱
성재영

Assignees

주식회사 엘지에너지솔루션

Dates

Publication Date: 20260513
Application Date: 20250530
Priority Date: 20241106

Claims (10)

An offset measuring device for measuring the shim plate offset of a slot die that applies an active material slurry to a current collector plate conveyed along a coating roll, A main body portion configured to be positioned on the upper part of the slot die; A first frame portion disposed in the main body portion and configured to be movable in a first axis direction parallel to the slurry discharge direction of the slot die; and A second frame portion disposed in the first frame portion and configured to be movable in a second axis direction intersecting the first axis direction between the coating roll and the slot die; comprising An offset measuring device in which a measuring tip for measuring the offset of a shim plate is disposed in the second frame portion.
In paragraph 1, The above measuring tip is an offset measuring device positioned between the discharge portion of the slot die and the coating roll that transports the current collector plate.
In paragraph 1, The above first frame part is, A first frame a arranged in the above first axis direction and It includes a first b frame connected to the first a frame, and The above 1b frame is positioned in the direction of the second axis and is an offset measuring device positioned between the coating roll and the slot die.
In paragraph 1, It further includes a first adjustment unit for adjusting the movement displacement of the first frame part, and The above-mentioned first adjustment part is an offset measuring device comprising an adjustment screw coupled to a main body part and a first frame part.
In paragraph 1, It includes a first measuring unit for measuring the displacement in the first axis direction of the first frame part, and An offset measuring device comprising a dial gauge that measures displacement in the first axis direction by contacting the first frame part.
In paragraph 1, It further includes a second adjustment unit for adjusting the movement displacement of the second frame part, and The above second adjustment unit is an offset measuring device disposed between the coating roll and the slot die.
In paragraph 1, It further includes a second measuring unit for measuring the displacement in the second axis direction of the second frame part, and The second measuring unit is an offset measuring device positioned between the coating roll and the slot die.
In paragraph 1, An offset measuring device having an 'L' shape, comprising a first frame portion that is directed toward a coating roll from a slot die and a first frame (1a) that is connected in a second axial direction to the front end of the first frame (1a).
A method for measuring the offset of a shim plate placed on a slot die in a slot die coater, A first step of moving a measuring tip disposed in the offset measuring device to a first axis direction, which is the slurry discharge direction of the slot die, and a second axis direction intersecting the first axis direction, so as to contact the front surface of the upper lip of the slot die, and setting the displacement in the first axis direction at the time of contact as a reference value; A second step of moving the above measuring tip to a reference position by aligning it to the position of the reference value in the first axis direction and aligning it to the center position of the discharge opening width of the slot die in the second axis direction; and An offset measurement method comprising: a third step of moving the measuring tip in the direction of a first axis from the reference position to contact the shim plate of a slot die, and measuring the displacement value from the reference position to the shim plate contact position to calculate the offset value of the shim plate.
In Paragraph 9, The above measurement tip is An offset measuring method that is positioned and moves between a coating roll positioned in front of the slot die and the slot die.

Description

Offset Measuring Apparatus and Offset Measuring Method Including the Same The present invention relates to an offset measuring device for measuring the offset of a shim plate of a slot die that applies an active material slurry, and an offset measuring method including the same. An electrode assembly is placed in the battery cell. The electrode assembly includes a positive electrode and a negative electrode, and each electrode is manufactured by applying an active material, which is either the positive or negative electrode, to a current collector plate. Slot die coaters are widely used to precisely coat active material onto current collector plates. Generally, a slot die coater includes a coating roll that transports the current collector plate and a slot die that precisely ejects the active material onto the surface of the plate. The coating roll and the slot die are positioned facing each other, so that active material of a uniform thickness is applied to the plate as it moves along the coating roll. The slot die consists of a lower die, an upper die positioned above the lower die, and a shim plate positioned between them. When repetitive active material supply and coating processes are performed in a slot die, a problem arises in which the shim plate moves (offsets) beyond the set allowable range due to changes in internal pressure, repetitive thermal expansion, and vibration. If this shim plate offset exceeds the allowable range, the amount of active material released from the slot die becomes non-uniform in the width direction, resulting in variations in the thickness of the active material coating on the electrode. In particular, variations in electrode thickness lead to performance variations after battery cell manufacturing, causing a degradation in battery quality. To prevent such problems, the offset of the shim plate is measured and managed regularly. However, conventionally, the method primarily used to measure shim plate offset involves completely separating the slot die from the slot die coater and then using an external measuring device to determine the shim plate position. This method has the disadvantage of requiring significant time for the die removal and reinstallation process, which leads to prolonged downtime in the production process. In particular, since there is a high probability that the alignment status will change each time the slot die is reinstalled after removal, additional readjustment time may be required before production can resume. Furthermore, depending on operator skill or environmental conditions, there is a possibility that contaminants may be introduced into the interior or surface of the slot die during the removal and reassembly process, which can lead to a decrease in the reliability and lifespan of the battery cells. Additionally, frequent removal of the slot die can accelerate mechanical wear or damage between precision components, thereby shortening equipment lifespan and increasing maintenance costs. Therefore, an offset measuring device is required that can measure the offset of a shim plate without separating the slot die from the slot die coater. FIG. 1 illustrates an offset measuring device according to an embodiment of the present invention placed in a slot die. Figure 2 is a side view of Figure 1. FIG. 3 illustrates an example of a slot die in which an offset measuring device according to an embodiment of the present invention can be used. FIG. 4 is a perspective view illustrating an offset measuring device according to an embodiment of the present invention. FIG. 5 is an exploded view of an offset measuring device according to an embodiment of the present invention. FIG. 6 illustrates an offset measuring device according to an embodiment of the present invention. FIG. 7 is a side view of an offset measuring device according to an embodiment of the present invention. FIG. 8 illustrates an offset measuring device according to an embodiment of the present invention from another perspective. Figure 9 is an enlarged view of A in Figure 2. FIG. 10 is a flowchart of an offset measurement method according to an embodiment of the present invention. Hereinafter, specific details for implementing the present invention will be described in detail with reference to the attached drawings. However, in the following description, specific descriptions regarding widely known functions or configurations will be omitted if there is a risk of unnecessarily obscuring the essence of the present invention. In the attached drawings, identical or corresponding components may be assigned the same reference numerals. Additionally, in the description of the following embodiments, the description of identical or corresponding components may be omitted. However, even if a description of a component is omitted, it is not intended that such component is not included in any embodiment. The terms used in this specification will be briefly explained, and the disclosed embodiments will b