KR-20260067969-A - ELECTRONIC CHIP AND ELECTRONIC DEVICE INCLUDING THE SAME

Abstract

An electronic chip according to the present invention comprises a substrate; conductive pads disposed on a first surface of the substrate; and a connecting layer covering the first surface and the conductive pads, wherein the connecting layer comprises an adhesive layer and metal particles dispersed within the adhesive layer, and the adhesive layer comprises tannic acid and polyalcohol.

Inventors

• 오지영
• 구재본
• 김경현
• 양용석
• 이용준
• 피재은
• 황치선

Assignees

• 한국전자통신연구원

Dates

Publication Date

20260513

Application Date

20250806

Priority Date

20241106

Claims (20)

1. Substrate; Conductive pads disposed on a first surface of the substrate; and A connecting layer covering the first surface and the conductive pads, comprising: The above connecting layer comprises an adhesive layer and metal particles dispersed within the adhesive layer, and The above adhesive layer is an electronic chip containing tannic acid and polyalcohol.
2. In Article 1, The above metal particles comprise at least one of gold (Au), silver (Ag), copper (Cu), tin (Sn), titanium (Ti), tungsten (W), molybdenum (Mo), iron (Fe), zinc (Zn), indium tin oxide (ITO), or an alloy thereof, in an electronic chip.
3. In Article 1, The above metal particles are spherical, rod-shaped, or flake-shaped electronic chips.
4. In Article 1, The width of each of the above-mentioned conductive pads is 100 nm to 500 nm, and An electronic chip in which the distance between adjacent challenge pads is 100 nm to 250 nm.
5. In Article 1, An electronic chip in which the particle diameter of the metal particles is 0.1 to 1 times the width of each of the conductive pads and 0.1 to 0.5 times the distance between the conductive pads.
6. In Article 1, The above metal particles are electronic chips connected to the above conductive pads.
7. In Article 1, An electronic chip in which the coating area of the metal particles dispersed within the adhesive layer is 40% to 70% of the total area of the conductive pads in a planar manner.
8. In Article 1, The above-mentioned polyalcohol is an electronic chip comprising at least one of polyvinyl alcohol, polyethylene glycol, or polypropylene glycol.
9. In Article 1, The above connecting layer is an electronic chip having a thickness of 1 μm to 10 μm from the first surface of the substrate.
10. Base substrate; Electrodes disposed on the base substrate; and The electronic chip is disposed on a corresponding portion of the above electrodes, comprising: The above electronic chip is: Substrate; Conductive pads disposed on a first surface of the substrate; and A connecting layer covering the first surface and the conductive pads, interposed between the substrate and the electrodes and in contact with the electrodes, comprising: The above connecting layer comprises an adhesive layer and metal particles dispersed within the adhesive layer, and The above adhesive layer is an electronic device containing polyphenol and polyalcohol.
11. In Article 10, The above polyphenol comprises at least one of flavonoids, phenolic acids, stilbenes, lignans, or tannic acids, and The above-mentioned polyalcohol is an electronic device comprising at least one of polyvinyl alcohol, polyethylene glycol, or polypropylene glycol.
12. In Article 10, The above metal particles comprise at least one of iron (Fe), zinc (Zn), molybdenum (Mo), tungsten (W), or an alloy thereof in an electronic device.
13. In Article 10, An electronic device in which the particle size of the metal particles is 10 nm to 250 nm.
14. In Article 10, The above connecting layer is an electronic device further comprising an air gap between the metal particles.
15. In Article 10, The above-described base substrate is at least one of a glass substrate, a flexible substrate, a stretchable substrate, or a biodegradable substrate, in an electronic device.
16. In Article 10, An electronic device having a surface that is exposed toward the base substrate between the electrodes and spaced apart from the base substrate.
17. In Article 10, The maximum width of the above connection layer is greater than the width of the above substrate, and The above connecting layer extends to cover a portion of the side of the substrate in an electronic device.
18. Base substrate; Electrodes disposed on the base substrate; and The electronic chip is disposed on a corresponding portion of the above electrodes, comprising: The above electronic chip is: Substrate; Conductive pads disposed on a first surface of the substrate; and A connecting layer covering the first surface and the conductive pads, interposed between the substrate and the electrodes and in contact with the electrodes, comprising: The above connecting layer comprises an adhesive layer, metal particles dispersed within the adhesive layer, and air gaps between the metal particles, and The above adhesive layer is an electronic device containing tannic acid.
19. In Article 18, The above adhesive layer comprises at least one of polyvinyl alcohol, polyethylene glycol, or polypropylene glycol in an electronic device.
20. In Article 18, The above-mentioned challenge pads are electronic chips connected to the electrodes through the metal particles.

Description

Electronic chip and electronic device including the same The present invention relates to an electronic chip and an electronic device including the same, and more specifically, to an electronic chip including a connecting layer and an electronic device including the same. As modern society evolves into a highly information-driven era, the importance of the semiconductor and display industries is increasing. The transfer bonding process for electronic devices generally involves forming solder bumps on pads of a patterned substrate, attaching a semiconductor chip, and electrically connecting the pads and solder bumps. Recently, as the size of semiconductor chips and LEDs has shrunk to micro-sizes, research on the formation of micro-sized solder bumps, transfer methods for microchips, and bonding processes is continuing. FIG. 1 is a cross-sectional view of an electronic chip according to embodiments of the present invention. FIG. 2 is a schematic plan view of an electronic device according to embodiments of the present invention. FIG. 3 is a cross-sectional view of FIG. 2 taken along line A-A' according to embodiments of the present invention. Figures 4a and 4b are enlarged views of the 'R1' portion of Figure 2. Figures 5a and 5b are enlarged views of the 'R2' portion of Figure 4. FIGS. 6 and FIGS. 7 are flowcharts illustrating a method for manufacturing an electronic device according to embodiments of the present invention. FIGS. 8a to 8h are cross-sectional views sequentially illustrating the process of manufacturing an electronic device having the cross-section of FIG. 4 according to embodiments of the present invention. Figures 9a and 9b are enlarged views of the 'R3' portion of Figure 8f. FIG. 10a is an enlarged view of the 'R4' portion of FIG. 8g. FIG. 10b is an enlarged view of the 'R5' portion of FIG. 8h. FIGS. 11a and FIGS. 11b are cross-sectional views illustrating the process of manufacturing an electronic device according to embodiments of the present invention. FIG. 12 is a flowchart illustrating a method for manufacturing an electronic device according to embodiments of the present invention. FIGS. 13a and FIGS. 13b are cross-sectional views sequentially illustrating the process of manufacturing an electronic chip according to embodiments of the present invention. FIG. 14 is a microscope image of an electronic chip according to embodiments of the present invention. FIG. 15 is an experimental photograph showing the light emission characteristics confirmed after bonding an electronic chip onto a substrate according to embodiments of the present invention. FIG. 16 is a series of photographs showing the results of a tensile test performed after bonding an electronic chip onto a substrate according to embodiments of the present invention. In order to fully understand the structure and effects of the present invention, preferred embodiments of the present invention are described with reference to the attached drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various forms and various modifications can be made. The description of these embodiments is provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention. In this specification, when a component is described as being on another component, it means that it may be formed directly on the other component or that a third component may be interposed between them. Additionally, in the drawings, the thicknesses of the components are exaggerated for the effective description of the technical content. Throughout the specification, parts indicated by the same reference numeral represent the same components. The embodiments described herein will be described with reference to cross-sectional and/or plan views, which are exemplary illustrations of the invention. In the drawings, the thicknesses of films and regions are exaggerated for effective description of the technical content. Accordingly, the regions illustrated in the drawings are schematic in nature, and the shapes of the regions illustrated in the drawings are intended to illustrate specific forms of regions of the device and are not intended to limit the scope of the invention. Although terms such as first, second, third, etc., have been used to describe various components in the various embodiments of this specification, these components should not be limited by such terms. These terms are used merely to distinguish one component from another. The embodiments described and illustrated herein also include their complementary embodiments. The terms used herein are for describing the embodiments and are not intended to limit the invention. In this specification, the singular form includes the plural form unless specifically stated otherwise in the text. As used herein, 'comprises' and/or 'comprising' do not exclude the presence or addition o