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KR-20260068014-A - TEST TABLE AND HANDLER FOR TESTING ELECTRONIC COMPONENTS

KR20260068014AKR 20260068014 AKR20260068014 AKR 20260068014AKR-20260068014-A

Abstract

The present invention relates to a test table, a test tray, and a handler for testing electronic components. The test table and test tray for testing electronic components according to the present invention have at least one combination area in which loading portions can be combined to load or unload at least two different electronic components, and the test table or test tray according to the present invention is applied to the handler according to the present invention. According to the present invention, testing for the implementation of an optimized chipset can be easily performed.

Inventors

  • 나윤성
  • 정석

Assignees

  • (주)테크윙

Dates

Publication Date
20260513
Application Date
20251106
Priority Date
20241106

Claims (19)

  1. having at least one combination area formed by a combination of loading portions in which at least two or more different electronic components can be loaded or unloaded, respectively. Test table for testing electronic components.
  2. In paragraph 1, In the above-mentioned combination area, the loading portions that are combined with each other have loading grooves formed therein for mounting electronic components. Test table for testing electronic components.
  3. In paragraph 2, The above loading grooves are formed at different depths Test table for testing electronic components.
  4. In paragraph 3, The above loading grooves are formed so that the upper surfaces of different types of mounted electronic components are of the same height. Test table for testing electronic components.
  5. In paragraph 2, Opening holes are formed at the bottom of the above-mentioned loading groove to open downward the terminals of the electronic components seated in the above-mentioned loading groove. Test table for testing electronic components.
  6. In paragraph 2, Support ridges are formed at the bottom of the above-mentioned loading groove to support electronic components seated in the above-mentioned loading groove, and The terminals of the electronic components seated in the above loading groove are exposed downward between the above support jaws Test table for testing electronic components.
  7. In paragraph 2, A partition is disposed between the above loading grooves, and The above bulkhead is provided to be detachably Test table for testing electronic components.
  8. In paragraph 1, In the loading portions that combine with each other in the above combination area, vacuum holes capable of vacuum-adsorbing electronic components are formed. Test table for testing electronic components.
  9. In paragraph 8, The above test table has a protruding support on the loading area corresponding to the height of the electronic components, and The above protruding support is formed to protrude so that the upper surfaces of all electronic components in the assembly area have the same height. Test table for testing electronic components.
  10. In Paragraph 9, The above protruding support is provided to be detachably Test table for testing electronic components.
  11. In paragraph 1, A connection circuit that electrically connects electronic components mounted in the above combination area further having Test table for testing electronic components.
  12. It has at least one combination area formed by a combination of loading parts in which at least two or more different electronic components can be loaded or unloaded, and In the above-mentioned combination area, the above-mentioned loading portions that are combined with each other have loading grooves formed therein for mounting electronic components, and A fixing device capable of fixing electronic components seated in the above loading grooves Test tray for testing electronic components.
  13. In Paragraph 12, The above loading grooves are formed at different depths Test tray for testing electronic components.
  14. In Paragraph 13, The above loading grooves are formed so that the upper surfaces of different types of mounted electronic components are of the same height. Test tray for testing electronic components.
  15. A test table according to any one of paragraphs 1 through 11; A test board having connection terminals electrically connected to electronic components loaded on the test table and a connection circuit electrically connecting the connection terminals to a tester; A picker hand for loading electronic components onto the above test table or handling loaded electronic components; and A connector that moves the test table to electrically connect the electronic components on the test table and the connection terminals; comprising Handler for testing electronic components.
  16. In paragraph 15, The tips of the above connection terminals have different heights corresponding to the height of the electronic components. Handler for testing electronic components.
  17. In Paragraph 16, The above test board has protruding pushers that protrude toward the above test table, and The above connection terminals are placed on protruding pushers, and The above protruding pushers are formed at a height corresponding to the height of the electronic components. Handler for testing electronic components.
  18. In Paragraph 17, The above protruding pushers are detachably provided. Handler for testing electronic components.
  19. In paragraph 15, The above test board has a connector for electrically connecting to the tester side. Handler for testing electronic components.

Description

Test Table and Handler for Testing Electronic Components The present invention relates to a technology for implementing an integrated chipset in which electronic components are combined. Electronic components requiring testing are placed on the test table. The electronic component placed on the test table is tested while electrically connected to the tester side by a connector. The electronic components to be tested can be of various forms. Electronic components can be semiconductor chips, such as bare chips in a die state or single memory chips. Electronic components can be in the form of a chipset composed of multiple semiconductor chips. The present invention relates to the manufacture of a chipset. A chipset forms an integrated circuit in which various types of semiconductor chips are combined on a single substrate. Various types of semiconductor chips combined with each other function organically so that the chipset can perform the desired functions and operations. While various types of semiconductor chips in a single chipset may all be manufactured by the same manufacturer, they may also be manufactured by different manufacturers considering factors such as product specifications, purpose, and unit cost. However, since a chipset does not become high-spec simply because a single semiconductor chip possesses outstanding performance, it is important to implement a chipset with optimized capabilities by appropriately combining various compatible semiconductor chips. To verify compatibility, a technique has been proposed in which a mounting chipset is implemented by combining various semiconductor chips, and then mounting tests are conducted by attaching and detaching specific detachable electronic components. This requires an assembly process that demands significant time and advanced technical expertise to fabricate the mounting chipset. The reliability of tests may be compromised due to various erroneous operations, including human error, during the assembly process. Even for a chipset with a single desired combination, multiple units must be manufactured and tested. Furthermore, if the results are unsatisfactory, the product must be discarded before production. Such a point requires a significant loss of time and cost to implement a single suitable chipset. FIGS. 1 to 6 are reference drawings for explaining a test table for testing electronic components according to a first embodiment of the present invention. FIGS. 7 and FIGS. 8 are reference diagrams for explaining a test table for testing electronic components according to a second embodiment of the present invention. FIGS. 9 and FIGS. 10 are reference diagrams for explaining a test table for testing electronic components according to a third embodiment of the present invention. FIG. 11 is a reference diagram for explaining a test table for testing electronic components according to the fourth embodiment of the present invention. FIGS. 12 and FIGS. 13 are reference diagrams for explaining a test table for testing electronic components according to the fifth embodiment of the present invention. FIG. 14 is a reference diagram for explaining a test table for testing electronic components according to the 6th embodiment of the present invention. FIG. 15 is a reference diagram for explaining a test table for testing electronic components according to the seventh embodiment of the present invention. FIGS. 16 to 18 are reference diagrams for explaining a test board paired with a test table. FIG. 19 is a reference diagram for explaining a handler for testing electronic components according to one embodiment of the present invention. FIGS. 20 and FIGS. 21 are reference drawings for explaining a test tray according to an embodiment of the present invention. FIG. 22 is a reference diagram for explaining an electronic component test handler to which the test tray of FIG. 20 is applied. Preferred embodiments according to the present invention are described by example with reference to the attached drawings, provided that for the sake of brevity, descriptions of well-known or redundant components are omitted or compressed as much as possible. <First Example of Test Table> FIG. 1 is a conceptual plan view of a test table (110, hereinafter abbreviated as 'test table') for testing electronic components according to a first embodiment of the present invention. The test table (110) has a combination area (111). One or more combination areas (111) is sufficient, but it is desirable to have multiple of them to increase processing capacity. The assembly area (111) is an area where one chipset is pre-assembled. In the combination area (111), there are loading parts (P1, P2, P3) that are combined with each other. Electronic components corresponding to the respective loading areas (P1, P2, P3) can be loaded or unloaded into the loading areas (P1, P2, P3). One combination area (111) has at least two loading areas (P1, P2, P3). The number of loading portions (P1, P2, P3) in