KR-20260068023-A - APPARATUS FOR TREATING BONDED SUBSTRATE

KR20260068023AKR 20260068023 AKR20260068023 AKR 20260068023AKR-20260068023-A

Abstract

The present invention relates to a substrate processing apparatus, comprising a substrate support member that supports a substrate assembly having a first substrate and a second substrate bonded to overlap the upper side of the first substrate, a crack forming member that forms a crack between the first substrate and the second substrate from one side of the first substrate and the second substrate, and a lifting member that includes a plurality of adsorption members that adsorb and lift the second substrate upward so that the crack expands and the second substrate is separated from the first substrate, wherein the plurality of adsorption members include a first adsorption pad that contacts the upper surface of the second substrate, and the first adsorption pad is arranged along a curved path.

Inventors

모성원
박상효
한흥수
이승훈

Assignees

주식회사 제우스

Dates

Publication Date: 20260513
Application Date: 20260402

Claims (10)

A substrate support member supporting a substrate assembly having a first substrate and a second substrate bonded so as to overlap the upper side of the first substrate; A crack forming portion that forms a crack between the first substrate and the second substrate from one side of the first substrate and the second substrate; and A lifting part comprising a plurality of adsorption parts that adsorb and lift the second substrate upward so that the crack is enlarged and the second substrate is separated from the first substrate; A plurality of the above-mentioned adsorption portions include a first adsorption pad that contacts the upper surface of the second substrate, and A substrate processing device characterized in that the first adsorption pads are arranged along a curved path.
In Article 1, A plurality of the above-mentioned adsorption parts are, A second adsorption part closest to the above-mentioned side; A first adsorption part closest to the one side after the second adsorption part; and A substrate processing apparatus characterized by including an Nth adsorption part (N is a natural number greater than or equal to 3) arranged sequentially starting from the one side closest to the first adsorption part.
In Article 2, Each of the plurality of the above-mentioned adsorption portions includes at least one adsorption pad that contacts the upper surface of the second substrate, and A substrate processing device characterized in that the first adsorption pad is included in the first adsorption part.
In Paragraph 3, A substrate processing device characterized by the above-mentioned adsorption pad including bellows whose length is elastically deformed.
In Paragraph 3, A substrate processing device characterized in that the diameter of the adsorption pad included in the second adsorption part is larger than the diameter of the adsorption pad not included in the second adsorption part.
In Paragraph 3, The planar shape of the second substrate is circular, and The second adsorption unit is equipped with a plurality of the adsorption pads, A substrate processing apparatus characterized in that when a plurality of the adsorption pads included in the second adsorption part come into contact with the second substrate, the shortest distance between each of the adsorption pads included in the second adsorption part and the outer edge of the second substrate is the same.
In Article 2, A substrate processing device characterized in that, among the plurality of adsorption parts, the adsorption force of the second adsorption part is greater than the adsorption force of the remaining adsorption parts.
In Article 2, A substrate processing apparatus characterized by changing the distance between one of the first to Nth adsorption parts and the one side.
In Article 2, A substrate processing device characterized in that the distance from the first adsorption part to the second adsorption part is smaller than the distance from the first adsorption part to the third adsorption part.
In Article 1, A negative pressure generating unit that generates negative pressure so that a plurality of the above-mentioned adsorption units adsorb the second substrate; and A substrate processing apparatus further comprising a negative pressure control unit for controlling the negative pressure distributed to a plurality of the adsorption units.

Description

Apparatus for Treating Bonded Substrate The present invention relates to a substrate processing apparatus for separating bonded substrates into individual substrates spaced apart from each other. Recently, semiconductor manufacturing processes have been trending toward increasing the diameter and thinning the thickness of substrates, such as wafers, to boost productivity and lower manufacturing costs. However, substrates with large diameters and thin thicknesses are prone to warping or damage during transport or surface polishing processes. In order to prevent bending or damage to a large and thin substrate during the return or polishing process, a bonded substrate may be formed by bonding a carrier substrate to a device substrate, the bonded substrate may be returned or polished, and then the carrier substrate may be separated from the device substrate from the bonded substrate. A substrate processing device for separating a carrier substrate from a device substrate includes a lifting unit that adsorbs and lifts the carrier substrate. During the process of separating and lifting the carrier substrate from the device substrate, precise control of the magnitude and distribution of the suction force is required. The background technology of the present invention is disclosed in Korean Published Patent Application No. 10-2014-0033327 (published March 18, 2014; Title of Invention: Method for separating a product substrate from a carrier substrate). FIG. 1 is a schematic diagram illustrating a substrate processing apparatus according to one embodiment of the present invention. FIG. 2 is a perspective view of a lifting part according to a first example included in a substrate processing device of the present invention. Figure 3 is a plan view showing a plurality of adsorption pads of the lifting part of Figure 2 superimposed on the substrate assembly of Figure 1. FIG. 4 is an enlarged view showing the state in which the blade tip of FIG. 1 is close to one side of the first substrate and the second substrate. FIG. 5 is an enlarged view illustrating the state in which the blade tip of FIG. 1 penetrates between one side of the first substrate and the second substrate to form a crack. FIG. 6 is a front view of a lifting part according to a first example included in a substrate processing device of the present invention. Figure 7 is a longitudinal section view showing an enlarged view of section VII of Figure 6. FIG. 8 is a perspective view of a lifting part according to a second example included in a substrate processing device of the present invention. FIG. 9 is a plan view showing a plurality of adsorption pads of a lifting part according to a third example included in the substrate processing device of the present invention superimposed on the substrate assembly of FIG. 1. Hereinafter, a substrate processing apparatus according to an embodiment of the present invention will be described in detail with reference to the attached drawings. The terminology used in this specification is used to appropriately express preferred embodiments of the present invention, and may vary depending on the intent of the user or operator or the conventions of the field to which the present invention belongs. Therefore, the definitions of these terms should be based on the content throughout this specification. FIG. 1 is a schematic diagram illustrating a substrate processing apparatus according to one embodiment of the present invention, FIG. 2 is a perspective view of a lifting part according to a first example included in the substrate processing apparatus of the present invention, FIG. 3 is a plan view illustrating a plurality of adsorption pads of the lifting part of FIG. 2 overlapping on a substrate assembly of FIG. 1, FIG. 4 is an enlarged view illustrating a state in which the blade tip of FIG. 1 is close to one side of a first substrate and a second substrate, FIG. 5 is an enlarged view illustrating a state in which the blade tip of FIG. 1 penetrates between one side of a first substrate and a second substrate to form a crack, FIG. 6 is a front view of a lifting part according to a first example included in the substrate processing apparatus of the present invention, and FIG. 7 is a longitudinal cross-sectional view illustrating an enlarged portion VII of FIG. 6. Referring to FIGS. 1 to 7, a substrate processing device (20) according to one embodiment of the present invention is a device for separating a second substrate (6) from a first substrate (3) in a bonded substrate (2) of a substrate assembly (1). The substrate assembly (1) may include a bonded substrate (2), a ring frame (15), and an adhesive tape (10). The bonded substrate (2) may include a first substrate (3) and a second substrate (6) bonded so as to overlap the upper side of the first substrate (3). The first substrate (3) may be, for example, a device substrate on which a microcircuit is formed on the surface and which is diced into semiconductor chip units. The