KR-20260068091-A - Alloy, particle, alloy ribbon, preform, sintered body, composite, electronic device and method of manufacturing a sintered body

Abstract

The present invention provides an alloy capable of easily forming a sintered body with excellent bonding reliability. The alloy of the present disclosure comprises a phase in which a metal element Y is dissolved in a metal element X, and is characterized in that the metal element X is precipitated on the surface by heat treatment under a gaseous, liquid, or solid atmosphere that forms a compound with the metal element Y. Furthermore, it is preferable that the metal element X is precipitated on the surface by heat treatment under an oxygen atmosphere, and it is preferable that the metal element X is Ag and/or Cu, and it is preferable that the metal element X includes Ag and the metal element Y includes Si and/or Ge.

Inventors

• 우에시마, 미노루
• 나카야마, 고지

Assignees

• 주식회사 다이셀
• 고꾸리쯔 다이가꾸 호우징 오사까 다이가꾸

Dates

Publication Date

20260513

Application Date

20240903

Priority Date

20230908

Claims (20)

1. An alloy comprising a phase in which a metal element Y is dissolved in a metal element X, wherein the metal element X is precipitated on the surface by heat treatment under a gaseous, liquid, or solid atmosphere that forms a compound with the metal element Y.
2. An alloy according to claim 1, wherein the metal element X is precipitated on the surface by heat treatment under an oxygen atmosphere.
3. An alloy according to claim 1 or 2, wherein the metal element X is Ag and/or Cu.
4. In paragraph 3, the alloy wherein the metal element X comprises Ag and the metal element Y comprises Si and/or Ge.
5. In paragraph 3, the alloy wherein the metal element X comprises Cu and the metal element Y comprises W and/or Cr.
6. An alloy according to claim 1 or 2, comprising the metal element Y, which is a supersaturated solid solution of the metal element X.
7. An alloy according to claim 1 or 2, wherein the molar ratio [metal element X/metal element Y] of the metal element X and the metal element Y is 95/5 to 10/90.
8. A particle comprising the alloy described in paragraph 1 or 2.
9. In claim 8, particles having an average particle size of 0.1 to 100 μm.
10. An alloy ribbon comprising the alloy described in paragraph 1 or 2.
11. A paste comprising the particles described in paragraph 8, an organic material, and Ag powder and/or Cu powder.
12. A preform comprising the alloy described in paragraph 1 or 2.
13. In Clause 12, a preform that is sheet-shaped or spherical.
14. A sintered body of the alloy described in paragraph 1 or 2.
15. A composite comprising the sintered body described in paragraph 14.
16. A substrate comprising the composite described in paragraph 15.
17. An electronic device comprising the assembly described in paragraph 15.
18. A method for manufacturing a sintered body comprising a process of heat treating the alloy described in claim 1 or 2 in a gaseous, liquid, or solid atmosphere to form a compound with the metal element Y.
19. A method for manufacturing a sintered body according to claim 18, comprising a process of heat treatment under an oxygen atmosphere.
20. A method for manufacturing a sintered body according to claim 19, wherein the oxygen concentration during the heat treatment is 0.01 to 30%.

Description

Alloy, particle, alloy ribbon, preform, sintered body, composite, electronic device and method of manufacturing a sintered body The present disclosure relates to alloys, particles, alloy ribbons, preforms, sintered bodies, bonded bodies, electronic devices, and methods for manufacturing sintered bodies. Furthermore, the present application claims priority to Japanese Patent Application No. 2023-146497 filed on September 8, 2023, and incorporates the contents thereof herein by reference. Semiconductors used for power devices require high efficiency, low loss, and high-frequency switching, and the use of wide-gap semiconductors such as SiC and GaN is expanding. In these semiconductors, the operating temperature may exceed 200°C, and the bonding materials used for bonding needed to maintain high bonding reliability even during operation in the high-temperature region of the semiconductor or in harsh temperature cycle environments. In recent years, the use of silver (Ag) paste, which has high electrical and thermal conductivity, a high melting point, and stability, has attracted attention. However, because Ag has a high melting point, if it is bonded in bulk, the substrate will suffer thermal damage. Therefore, to reduce the bonding temperature, low-temperature sintering technology using nanoparticles is being adopted. As a material having high bonding reliability even in operation in such high-temperature regions or in harsh temperature cycle environments, for example, the metal sintered bond of Patent Document 1 was known. Figure 1 is an SEM image of a sintered body of the present disclosure. FIG. 2 is a cross-sectional view showing one embodiment of an electronic device of the present disclosure. [alloy] An alloy of one embodiment of the present disclosure comprises a phase in which a metal element Y is dissolved in a metal element X, and the metal element X is precipitated on the surface by heat treatment under a gaseous, liquid, or solid atmosphere in which a compound is formed with the metal element Y. In the alloy, the metal element X is precipitated on the surface of the alloy as the metal element Y in the dissolved phase forms a compound while the metal element Y in the dissolved phase forms a compound. The precipitated metal element X can be firmly bonded to a nearby alloy or workpiece, thereby ensuring excellent bonding reliability. Furthermore, since bonding occurs as the metal element X is precipitated, there is no need for specific pressure conditions, allowing for easy bonding. As for the metal element X and the metal element Y in the alloy, only one type may be used, or two or more types may be used in combination. As for the elements included in the gaseous, liquid, or solid phases that form a compound with the metal element Y, it is preferable to include, for example, oxygen and sulfur, among which sulfur dioxide and hydrogen sulfide may be cited. That is, it is preferable that the metal element X precipitates on the surface of the alloy as the metal element Y is oxidized by heat treatment under an oxygen atmosphere. It is preferable that the above alloy has a process of the metal element X and the metal element Y. By having the above alloy, it is possible to easily include a phase in which the metal element X is dissolved in the metal element Y. In addition, it is preferable that the dissolved phase exists on the surface of the alloy. Specifically, it is preferable that the ratio of the dissolved phase to the entire alloy surface (100%) is 10% or more, more preferably 15% or more, and even more preferably 20% or more. By having a ratio of the dissolved phase to the alloy surface of 10% or more, sufficient metal element X can be precipitated on the surface when sintered. In addition, the ratio of the dissolved phase in the total amount of 100 mass% of the alloy is preferably 3 mass% or more, more preferably 5 mass% or more, and even more preferably 10 mass% or more. By having a ratio of 3 mass% or more of the dissolved phase, sufficient metal element X can be precipitated on the surface when sintered. In addition, in the present disclosure, metalloid elements are also treated as metal elements. Examples of such metalloid elements include Si, Ge, etc. It is preferable that the above metal element X include Ag and/or Cu. Since Ag and Cu have high melting points, using them as metal element X can raise the melting point of the alloy and facilitate operation at high temperatures. Specifically, the metal element Y can be Si, Ge, W, Cr, etc. In particular, when the metal element X contains Ag, it is preferable that the metal element Y contains Si and/or Ge. When the metal element Y contains Cu, it is preferable that the metal element Y contains W and/or Cr. With the above configuration, it is difficult for the metal element X and the metal element Y to form a compound, and it is easy to form a solid solution phase. In addition, it is preferable that the above alloy includes the metal element Y, whic