RU-2861388-C2 - INTEGRATED COOLING SYSTEM

Abstract

FIELD: cooling devices engineering. SUBSTANCE: integrated cooling system comprises a housing and a cooling device integrated as a single unit into the housing, the cooling device comprises a heat exchange mechanism, a plurality of heat dissipation pipes, the diameter of the heat dissipation pipe is smaller than the diameter of the liquid inlet pipe and the liquid return pipe, the heat dissipation pipes extend along the length direction, are arranged in parallel and are connected sequentially end to end, communicate with the liquid inlet pipe and the liquid return pipe, and are configured to dissipate heat for the cooling liquid. EFFECT: increasing the heat dissipation efficiency of the cooling liquid. 9 cl, 5 dwg

Inventors

• HUANG, SHAOMING
• ZHU, Hongshan
• Hu, Hangkong
• ZENG, HONGBO
• HAO, MINGLIANG
• XIAO, SHENGQIANG
• ZHENG, PENGFEI
• PENG, Yurong
• PI, Te
• LI, FENGJIE

Dates

Publication Date

20260505

Application Date

20230727

Priority Date

20220816

Claims (11)

1. 1. An integrated cooling system for cooling a computing device provided with a cooling channel, comprising a housing and a cooling device integrated into the housing; wherein the cooling device comprises a heat exchange mechanism, a liquid inlet pipe, a liquid return pipe and a pressure pump, the heat exchange mechanism and the cooling channel communicate via the liquid inlet pipe, and the heat exchange mechanism and the cooling channel communicate via the liquid return pipe, and the pressure pump is mounted on the liquid inlet pipe and/or the liquid return pipe and is configured to circulate coolant between the heat exchange mechanism and the cooling channel for cooling the computing device;
2. wherein the housing comprises a container, and the cooling device is located inside the container; the interior of the container is divided in the length direction to form a first cavity and a second cavity, a liquid inlet pipe and a liquid return pipe are provided in the first cavity, and a heat exchange mechanism is provided in the second cavity;
3. The heat exchange mechanism comprises a plurality of heat dissipation pipes, the diameter of the heat dissipation pipe is smaller than the diameter of the liquid inlet pipe and the liquid return pipe, the heat dissipation pipes extend along the length direction, are arranged in parallel and connected in series end to end, communicate with the liquid inlet pipe and the liquid return pipe, and are configured to dissipate heat for the cooling liquid.
4. 2. The system according to paragraph 1, characterized in that the injection pump is provided in the first cavity and/or the second cavity.
5. 3. The system according to claim 2, characterized in that the integrated cooling system further comprises a rack, and the rack is placed in the first cavity, the rack comprises several levels of space for multi-level placement, and the placement space is designed with the possibility of placing a computing device provided with a cooling channel.
6. 4. The system according to claim 3, characterized in that the integrated cooling system further comprises a power distribution cabinet, wherein the power distribution cabinet is provided on the side of the rack facing away from the heat exchange mechanism in the length direction.
7. 5. The system according to claim 4, characterized in that the integrated cooling system additionally contains a control device, and the control device is provided above the power distribution cabinet.
8. 6. The system according to claim 2, characterized in that the container is provided with an air inlet and an air outlet; the integrated cooling system further comprises a fan, and the fan is mounted on the container and is located directly opposite the air outlet and/or the air inlet.
9. 7. The system according to paragraph 6, characterized in that the number of fans is three, and three fans are arranged in a row in the direction of length.
10. 8. The system according to claim 6, characterized in that the integrated cooling system additionally contains a protective enclosure, wherein the protective enclosure is installed on the container and placed around the fan.
11. 9. The system according to paragraph 8, characterized in that the fan and protective guard are installed so as to be removable on the container.

Description

[1] This application claims priority to Chinese Patent Application No. 202222157258.5 entitled “COOLING INTEGRATED SYSTEM” filed with the National Intellectual Property Administration of China on August 16, 2022. The aforementioned application is hereby incorporated by reference herein. AREA OF TECHNOLOGY [2] This application relates to the field of cooling devices and in particular to an integrated cooling system. Background of the invention [3] A server is a high-performance computer in a network environment that listens for service requests from other computers (clients) on the network and provides the corresponding services. A server must be able to provide and guarantee services, and therefore must meet higher requirements in terms of stability, security, performance, and so on. Therefore, server power supplies typically use designs with improved heat dissipation to increase operational stability and service life, in order to fully meet the server's requirement for 24-hour continuous operation. [4] Most servers use traditional air or liquid cooling methods to dissipate heat. Air cooling uses fans to increase airflow and dissipate heat from the server into the air; liquid cooling uses a working fluid as an intermediate heat transfer medium to transfer heat from a hot area to a remote location for further cooling. Because the specific heat capacity of liquid is much greater than that of air, and the rate of heat dissipation by liquid is much greater than that of air, the cooling efficiency of liquid cooling is much higher than that of air cooling. [5] However, in the course of implementing the present application, the authors of the present application found that all internal components of the cooling device of the currently used integrated cooling system that uses liquid cooling to cool servers are configured separately during production, and users need to personally connect the internal components of the cooling device during use. The essence of the invention [6] The main technical problem to be solved by the embodiments of the present application is to provide an integrated cooling system in which the cooling devices are formed as a single unit, so that users do not need to personally connect the cooling device and the cooling channel of the server. [7] In order to solve the above-mentioned technical problems, the technical solution presented in the first aspect of the present application consists in creating an integrated cooling system for cooling a computing device provided with a cooling channel. The integrated cooling system comprises a housing and a cooling device integrally integrated into the housing. The cooling device comprises a heat exchange mechanism, a liquid inlet pipe, a liquid return pipe and a pressure pump. The heat exchange mechanism and the cooling channel communicate via the liquid inlet pipe, and the heat exchange mechanism and the cooling channel communicate via the liquid return pipe. The pressure pump is mounted on the liquid inlet pipe and/or the liquid return pipe and is configured to circulate coolant between the heat exchange mechanism and the cooling channel to cool the computing device. [8] In addition, the body includes a container, and the cooling device is located inside the container; wherein the inside of the container is divided in the length direction to form a first cavity and a second cavity, a liquid inlet pipe and a liquid return pipe are provided in the first cavity, a heat exchange mechanism is provided in the second cavity; and wherein the heat exchange mechanism includes multiple heat dissipation pipes, the diameter of the heat dissipation pipe is smaller than the diameter of the liquid inlet pipe and the liquid return pipe, the heat dissipation pipes extend along the length direction, are arranged in parallel and connected in series end to end, communicate with the liquid inlet pipe and the liquid return pipe and are configured to dissipate heat for the cooling liquid. [9] In a preferred embodiment, the injection pump is provided in the first cavity and/or the second cavity. [10] In a preferred embodiment, the integrated cooling system further comprises a rack, and the rack is located in the first cavity, the rack comprises several levels of space for multi-level placement, and the placement space is configured to accommodate a computing device provided with a cooling channel. [11] In a preferred embodiment, the integrated cooling system further comprises a power distribution cabinet, wherein the power distribution cabinet is provided on the side of the rack facing away from the heat exchange mechanism in the length direction. [12] In a preferred embodiment, the integrated cooling system further comprises a control device, and the control device is provided above the power distribution cabinet. [13] In a preferred embodiment, the container is provided with an air inlet and an air outlet; the integrated cooling system further comprises a fan, wherein the