RU-2861735-C1 - METHOD FOR ELECTRICAL CONNECTION OF PEROVSKITE SOLAR MODULES

Abstract

FIELD: electrical engineering. SUBSTANCE: invention relates to the field of contact soldering and electrical connection of photovoltaic converters (PVCs) based on halide perovskites for space and terrestrial applications. A method for connecting perovskite solar modules includes aligning the electrical contact pads of a rigid perovskite PVC module with conductive tracks of a flexible cable and soldering, wherein a rigid perovskite module with a thickness of about 200 mcm is used, the flexible cable is made on a polyimide substrate with a metallic current-conducting layer, soldering is performed with solder using a contact tip at a temperature not exceeding 250°C, the cable is arranged as a floating connecting element. EFFECT: increasing the mechanical reliability of the electrical connection under cyclic bending, enabling the assembly to operate at a bending radius ≤ 1 mm without breaking electrical integrity. 1 cl, 7 dwg

Inventors

• Badurin Ilya Vladimirovich
• Gren Danil Dmitrievich
• Gostishchev Pavel Andreevich
• Saranin Danila Sergeevich

Dates

Publication Date

20260508

Application Date

20251219

Claims (1)

1. A method for connecting perovskite solar modules, which includes combining electrical contact pads of a rigid perovskite photovoltaic converter module with conductive tracks of a flexible cable and soldering, characterized in that a rigid perovskite module with a thickness of approximately 200 μm is used, the flexible cable is made on a polyimide substrate with a metal conductive layer, soldering is performed with a solder contact tip at a temperature not exceeding 250°C, the cable is positioned in the form of a floating connecting element.

Description

The invention relates to the field of contact soldering and electrical connection of photovoltaic converters (PVCs) based on halide perovskites for space and terrestrial applications. Halide perovskite solar cells demonstrate high efficiency when used under terrestrial conditions in the AM 1.5 G and AM 0 spectra. Typical device structures are thin-film in the submicron range, which accounts for the lightweight nature of this type of solar cell. The device structure density is approximately 0.5 mg/ cm2 , which is an order of magnitude lower than cascade III-V cells and silicon analogs. Under terrestrial conditions, the efficiency of scaled devices reaches a range of 15 to 24%. When analyzing the impact of space factors, radiation hardness measurements demonstrate the stability of the device structures at proton fluxes reaching 10 particles per square centimeter and electron fluxes of 10 particles per square centimeter. Such radiation levels catastrophically destroy typical III-V cells and silicon space cells. This exceptional radiation resistance, due to the crystalline structure of halide perovskites, combined with the ultra-thin film architecture (300-500 nanometers) on lightweight substrates, provides a power density significantly higher than that of conventional rigid panels. Therefore, this type of cell is promising for typical solar panel applications on the Earth's surface and in space. A critical component of solar cell systems is the electrical connection of individual modules and cells. Typical approaches to electrically connecting solar cells and modules rely on soldering ribbon busbars and rigid metal bridges. For terrestrial solar cells based on crystalline silicon, such solutions provide acceptable reliability. However, when transitioning to thin-film architectures and perovskite photovoltaic converters with organic and hybrid layers based on halide perovskites, new limitations may arise due to localized thermal cycles during soldering, which lead to decomposition, defect formation, and reduced adhesion to transparent conducting electrodes. The influence of corrosion effects is accompanied by an increase in contact resistance due to metal diffusion and the formation of interfacial barriers. Moreover, in lightweight solar cell string designs, stress concentration in the terminal zone can induce fatigue cracks during bending. For space applications, it is necessary to avoid outgassing processes during module and subcell switching, as well as connection degradation during repeated thermal cycling and radiation exposure. For applications requiring reduced mass of solar cell-based electrical circuits, excess busbar and solder mass is irrelevant. Glass and laminated perovskite-based modules utilize screen-printed contact and busbar connections made of flat tinned copper tapes (copper, Cu, with tin-silver-copper alloy solders Sn-Ag-Cu), or low-temperature SnBi/SnBiAg (tin-bismuth/tin-bismuth-silver alloys), as well as round busbar wires, SmartWire systems (a dense mesh of thin copper strands on a silver-containing conductive adhesive), and braided jumpers. Typical soldering processes are carried out at 150-180°C for SnBi and 220-245°C for Sn-Ag-Cu, with the mandatory use of flux. Electrically conductive adhesives (ECA) and anisotropic conductive materials with adhesives—films and glues—cure at 80-170°C under pressure. Temperatures above 120°C are undesirable for perovskite solar cells with low thermal stability. Such solutions are considered "heavy" due to the tape weight, bulky solder beads, and localized stress concentrators, but are acceptable for solar panels made of rigid glass with an ethylene-vinyl acetate (EVA) film or polyolefin elastomer (POE) laminated sealing coating. For lightweight and flexible photovoltaic converters on ultra-thin glass and polymer substrates, printed or vacuum-deposited thin-film busbars made of silver (Ag), copper (Cu), or aluminum (Al) with nickel/titanium/chromium (Ni/Ti/Cr) diffusion barriers are used instead of tapes and soldering. Optimal solutions for switching lightweight solar cells for orbital use in space may be metallized polymer cables, which provide low weight, strain distribution, and resistance to bending cycles, while flat copper tapes, braided jumpers, and large soldered assemblies are unsuitable. A known technology (US 3973 996, published August 10, 1976) describes a method for connecting solar cells in a string using polyimide tape on silver contact pads via diffusion soldering. This technology presents a cable with a metallization layer of 500 to 1000 nm, suitable for soldering at 260°C and high pressure of 1000 PSI, as well as for soldering configurations with serial connections. A disadvantage of this technology is the requirement for high temperatures and the lack of adaptation for perovskite module structures with serial cell switching in a monolithic solar cell structure. US Patent Application No. 12155347 B1 (published February 18, 2023) desc