TW-I924701-B - A conductive composite for bonding, a bonding structure using the conductive composite for bonding, and a method for manufacturing the bonding structure.
Inventors
- KONNO, SATOSHI
- YAMAUCHI, SHINICHI
- ANAI, KEI
Assignees
- 日商三井金屬股份有限公司
Dates
- Publication Date
- 20260511
- Application Date
- 20210916
- Priority Date
- 20210304