TW-I924841-B - THERMAL SETTING RESIN COMPOSITION, THERMAL SETTING SHEET, AND SEMICONDUCTOR CHIP COATING MEMBER
Inventors
- SHISHIDO, YUICHIRO
- SATO, SATOSHI
- TAKAMOTO, NAOHIDE
Assignees
- 日商日東電工股份有限公司
Dates
- Publication Date
- 20260511
- Application Date
- 20220415
- Priority Date
- 20210428