TW-I925354-B - CLAMPING SYSTEM, MOULDING SYSTEM FOR ENCAPSULATING ELECTRONIC COMPONENTS, AND A METHOD FOR DEGASSING HYDRAULIC FLUID
Inventors
- HAANAPPEL, Robertus Johannes Maria
- HENGEVELD, Robin
Assignees
- 荷商貝西荷蘭有限公司
Dates
- Publication Date
- 20260511
- Application Date
- 20241119
- Priority Date
- 20231124