TW-I925602-B - Bonding body and substrate
Inventors
- NAGATO, Keisuke
- AONO, Kota
- EBIHARA, Yusuke
- NAKAO, MASAYUKI
- UEDA, YUKI
- OKUNO, SHINGO
- KOMORI, HIROKAZU
- YAMAUCHI, AKIYOSHI
- KISHIKAWA, YOSUKE
Assignees
- 國立大學法人東京大學
- 日商大金工業股份有限公司
Dates
- Publication Date
- 20260511
- Application Date
- 20220407
- Priority Date
- 20210427