TW-I925678-B - METAL COVER ASSEMBLY OF SEMICONDUCTOR PACKAGING PROCESS

Inventors

• TSAI, HSING HUA
• SUN, SUNG HUAN
• CHUANG, TUNG-HAN
• KAO, HSUEH WU
• HSU, MING CHIH

Assignees

• 聖崴科技股份有限公司

Dates

Publication Date

20260511

Application Date

20250604