TW-I925781-B - Electronically packaged heat dissipation substrates, their processing technology and applications, and their electronically packaged heat dissipations.
Inventors
- 周逸浩
- 彭金寶
- 李宗臻
- 李子涵
- 程善禮
Assignees
- 大陸商廣州眾山新材料股份有限公司
- 大陸商索羅曼（常州）合金新材料有限公司
Dates
- Publication Date
- 20260511
- Application Date
- 20250930
- Priority Date
- 20250603