US-12616310-B2 - Mattress assembly with reduced heat index

Abstract

Mattress assemblies that provide reduced heat index during use include a thermally conductive layer and a spacer layer and in direct contact with the thermally conductive layer. Optionally, the thermally conductive foam layer can be perforated. In some embodiments, the thermally conductive layer and the spacer layer can overlay an innerspring mattress core, one or more foam layers, or a hybrid of foam and innersprings. In other embodiments, the mattress assemblies include a foam layer such as a viscoelastic foam layer overlying the thermally conductive layer and the spacer layer. Also, disclosed are processes for reducing the heat index in a mattress assembly.

Inventors

• Christopher Francis Chunglo

Assignees

• DREAMWELL, LTD.

Dates

Publication Date

20260505

Application Date

20220826

Claims (20)

1. 1 . A mattress assembly, comprising: an upper foam layer; a thermally conductive layer underlying and in direct contact with the upper foam layer; and a spacer layer underlying and in direct contact with the thermally conductive layer, wherein the spacer layer comprises a three-dimensional polymeric fibrous structure including substantially planar top and bottom polymeric fiber mesh surfaces including a plurality of openings and substantially vertically oriented filaments extending between the planar top and bottom polymeric fiber mesh surfaces, wherein the spacer layer has a free volume of at least 50% and is formed of monofilament polyester fibers having a diameter selected to provide a desired compression response, wherein the spacer layer maintains a percentage of free volume such that air flow though the layer is maintained under compression, and wherein the thermally conductive layer is perforated and cooperates with the spacer layer to maintain airflow under load.
2. 2 . The mattress assembly of claim 1 , wherein the spacer layer has is configured to maintain at least 40% of its free volume when subjected to a compressive load of 10 pounds per square foot.
3. 3 . The mattress assembly of claim 1 , wherein the thermally conductive layer comprises foil or a composite having a thickness less than 0.0625 inches.
4. 4 . The mattress assembly of claim 1 , wherein the thermally conductive layer comprises foam and thermally conductive particles.
5. 5 . The mattress assembly of claim 4 , wherein the thermally conductive particles comprise carbon, graphene, graphite, platinum, aluminum, diamond, gold, silver, silicon, tin, copper, iron, nickel, chromium, vanadium, tungsten, or combinations thereof.
6. 6 . The mattress assembly of claim 5 , wherein the thermally conductive particles are combined with oxygen, halogens, carbon, or silicon.
7. 7 . The mattress assembly of claim 1 , wherein the upper foam layer comprises a viscoelastic foam layer.
8. 8 . The mattress assembly of claim 1 , wherein the upper foam layer is proximate to a sleeping surface.
9. 9 . The mattress assembly of claim 1 , wherein the spacer layer has a uniform thickness of about 0.125 inches to about 6 inches.
10. 10 . The mattress assembly of claim 1 , wherein the upper layer, the thermally conductive layer and the spacer layer overly one or more foam layers.
11. 11 . The mattress assembly of claim 1 , wherein the upper layer, the thermally conductive layer and the spacer layer overly an innerspring mattress core.
12. 12 . A mattress assembly, comprising: a thermally conductive layer proximate to a sleeping surface, the thermally conducive foam layer comprising thermally conductive particles within a foam matrix; and a spacer layer underlying and in direct contact with the thermally conductive layer, wherein the spacer layer comprises a three-dimensional polymeric fibrous structure consisting of substantially planar top and bottom polymeric mesh surfaces including a plurality of openings and substantially vertically oriented filaments extending between the planar top and bottom surfaces, wherein the filaments have a smaller diameter than the fibers in the top and bottom polymeric mesh surfaces, wherein the spacer layer has a free volume of at least 50%, and wherein the spacer layer is formed of monofilament polyester fibers having a diameter selected to provide a desired compression response, wherein the spacer layer maintains a percentage of free volume such that air flow though the layer is maintained under compression, and wherein the thermally conductive layer is perforated and cooperates with the spacer layer to maintain airflow under load.
13. 13 . The mattress assembly of claim 12 , wherein the thermally conductive layer comprises a thermally conductive material having a thermal conductivity greater than 5 watts per meters-Kelvin.
14. 14 . The mattress assembly of claim 12 , wherein the foam matrix comprises polyurethane, viscoelastic polyurethane, latex, polyester, polystyrene, polyethylene, polypropylene, or polyether-polyurethane.
15. 15 . The mattress assembly of claim 12 , wherein the thermally conductive particles comprise carbon, graphene, graphite, platinum, aluminum, diamond, gold, silver, silicon, tin, copper, iron, nickel, chromium, vanadium, tungsten, or combinations thereof.
16. 16 . The mattress assembly of claim 12 , wherein the three-dimensional polymeric fibrous structure comprises a polymer comprising polyesters, polyethylene, polypropylene, nylon, elastomers, copolymers and its derivatives, including monofilament or bicomponent filaments having different melting points.
17. 17 . The mattress assembly of claim 12 , wherein the spacer layer has a uniform thickness of about 0.25 inches to about 6 inches.
18. 18 . The mattress assembly of claim 12 , wherein the thermally conductive layer and the spacer layer overly an innerspring mattress core.
19. 19 . The mattress assembly of claim 12 , wherein the thermally conductive layer and the spacer layer are sandwiched between foam layers.
20. 20 . A process for reducing heat index in a mattress assembly, the process comprising: placing a spacer layer under and in direct contact with a thermally conductive layer within a mattress assembly, wherein the spacer layer comprises a three-dimensional polymeric structure of fibers consisting of planar top and bottom polymeric fiber mesh surfaces including a plurality of openings and filaments vertically extending from the bottom to the top surfaces, wherein the thermally conductive layer comprises a thermally conductive material having a thermal conductivity greater than 5 watts per meters-Kelvin, wherein the spacer layer has a free volume of at least 50%, and wherein the spacer layer is formed of monofilament polyester fibers having a diameter selected to provide a desired compression response, wherein the spacer layer maintains a percentage of free volume such that air flow though the layer is maintained under compression, and wherein the thermally conductive layer is perforated and cooperates with the spacer layer to maintain airflow under load.

Description

BACKGROUND The present disclosure generally relates to mattress assemblies including foam layers exhibiting a reduced heat index. Mattress assemblies including foam layers such as those formed of polyurethane foam, latex foam, and the like, are generally known in the art. One of the ongoing problems associated with mattress assemblies including foam layers in close proximity to the sleeping surface is user comfort. To address user comfort, these types of mattress assemblies are often fabricated with multiple foam layers having varying properties such as density and hardness, among others, to suit the needs of the intended user. More recently, manufacturers have employed so called memory foam, also commonly referred to as viscoelastic foams, which are generally a combination of polyurethane and one or more additives that increase foam density and viscosity, thereby increasing its viscoelasticity. These foams are often open cell foam structures having both closed and open cells but, in some instances, may be reticulated foam structures. The term “reticulated” generally refers to a cellular foam structure in which the substantially all of the membrane windows are removed leaving a skeletal structure. In contrast, open cell structures include both open cell (interconnected cells) and closed cells. When used in a mattress, the memory foam conforms to the shape of a user when the user exerts pressure onto the foam, thereby minimizing pressure points from the user's body. The memory foam then returns to its original shape when the user and associated pressure are removed. Unfortunately, the high density of foams used in current mattress assemblies, particularly those employing memory foam layers, generally prevents proper ventilation. As a result, the foam material can exhibit an uncomfortable level of heat to the user after a period of time. Additionally, these foams can retain a high level of moisture, further causing discomfort to the user and potentially leading to foul odors. To overcome this, mattress manufacturers utilize phase change materials and/or thermally conductive materials such as graphite, metals, or the like within and/or on the foams layers to help dissipate heat. The thermally conductive material can be a composite of a carrier layer with high conductivity materials bonded to and/or impregnated in the carrier. These thermally conductive layers tend to be very good at moving heat away from a user on sleeping surface but also tend to be non-permeable, which can cause a buildup of humidity near the surface of the thermally conductive foam layer. These conductive materials need to be near the surface of the bed to be effective at moving heat away from the sleeper. The buildup of humidity near the sleeper will cause an undesirable increase in heat index and degrade the end user's sleep experience. To reduce the buildup of humidity, mattress manufacturers have attempted to increase ventilation at the surface through the use of an overlying perforated foam layer and/or added perforations to the thermally conductive film layer. While movement of moisture will be improved as a function of the perforations, the moisture movement is still insufficient to significantly improve the sleep experience. Moreover, when an end user lays on the mattress, compression of the foam layers proximate to the sleeping surface, which typically includes the thermally conductive layer, results and serves to limit the amount of air flow through the perforations from the foam layer including the thermal conductive materials. BRIEF SUMMARY Disclosed herein are mattress assemblies including a spacer layer underlying and in direct with a thermally conductive layer and processes for reducing heat index in a mattress assembly. In one embodiment, the mattress assembly includes an upper foam layer; a thermally conductive layer underlying and in directed contact with the upper foam layer; and a spacer layer underlying and in direct contact with the thermally conductive layer, wherein the spacer layer comprises a three-dimensional polymeric fibrous structure including substantially planar top and bottom surfaces and substantially vertically oriented fibers extending between the planar top and bottom surfaces. In another embodiment, the mattress assembly includes a thermally conductive layer proximate to a sleeping surface, the thermally conducive foam layer comprising thermally conductive particles within a foam matrix; and a spacer layer underlying and in direct contact with the thermally conductive layer, wherein the spacer layer comprises a three-dimensional polymeric fibrous structure including substantially planar top and bottom surfaces and substantially vertically oriented fibers extending between the planar top and bottom surfaces. A process for reducing heat index in a mattress assembly includes placing a spacer layer under and in direct contact with a thermally conductive layer within a mattress assembly, wherein the spacer l