US-12616992-B2 - Atomization module

US12616992B2US 12616992 B2US12616992 B2US 12616992B2US-12616992-B2

Abstract

An atomization module includes a main fixing member, an auxiliary fixing member, an atomization component and a piezoelectric component. The main fixing member includes a first bonding part, a second bonding part and a connecting part. The first bonding part has a first opening and a first bonding surface surrounding the first opening. The second bonding part is connected to the first bonding part, and the connecting part and the second bonding part surround the first bonding part. The auxiliary fixing member has a second opening and a second bonding surface surrounding the second opening. The piezoelectric component surrounds the first bonding part. The main fixing member has a first adhesive groove, which is jointly defined at least by the main fixing member, the auxiliary fixing member and the atomization component. The first adhesive is provided in the first adhesive groove.

Inventors

CHANG-HSIEH YAO
HSUN-WEI CHIANG
Chia-Chien Chang
Hsin-Yi Pai
Chun-Chia Juan

Assignees

HCMED INNOVATIONS CO., LTD.

Dates

Publication Date: 20260505
Application Date: 20231002
Priority Date: 20230615

Claims (18)

1 . An atomization module, comprising: a main fixing member, including: a first bonding part having a first opening and a first bonding surface surrounding the first opening; and a second bonding part and a connecting part, wherein the connecting part has an inclination angle between 35 degrees and 45 degrees relative to a virtual horizontal plane that is coplanar with the second bonding part, the second bonding part is connected to the first bonding part through the connecting part, and the connecting part and the second bonding part surround the first bonding part; an auxiliary fixing member disposed on the first bonding part, wherein the auxiliary fixing member has a second opening and a second bonding surface surrounding the second opening, and the second bonding surface faces the first bonding surface; an atomization component disposed between the main fixing member and the auxiliary fixing member; and a piezoelectric component disposed on the second bonding part and surrounding the first bonding part; wherein the main fixing member has a first adhesive groove, the main fixing member, the auxiliary fixing member and the atomization component jointly define the first adhesive groove, and a first adhesive that contacts the main fixing member, the auxiliary fixing member and the atomization component is provided in the first adhesive groove; wherein the main fixing member transmits a vibration generated by the piezoelectric component to the atomization component, and wherein the auxiliary fixing member cooperates with the main fixing member to jointly clamp the atomization component.
2 . The atomization module according to claim 1 , wherein the piezoelectric component and the atomization component are disposed on a side of the main fixing member, and the main fixing member, the auxiliary fixing member, the atomization component and the piezoelectric component jointly define the first adhesive groove.
3 . The atomization module according to claim 2 , wherein the connecting part is inclined relative to the first bonding part and the second bonding part, and the first adhesive further contacts the piezoelectric component.
4 . The atomization module according to claim 2 , wherein the piezoelectric component has an inner surface facing the first bonding part and an outer surface opposite to the inner surface, and the outer surface and the second bonding part jointly define a second adhesive groove.
5 . The atomization module according to claim 4 , wherein a second adhesive is provided in the second adhesive groove and contacts at least the main fixing member and the piezoelectric component.
6 . The atomization module according to claim 5 , wherein the piezoelectric component has an upper surface and a lower surface that are disposed between the inner surface and the outer surface, and the lower surface contacts the second bonding part.
7 . The atomization module according to claim 6 , wherein the auxiliary fixing member does not completely cover the first adhesive groove, and the first adhesive overflows from the first adhesive groove and extends to the upper surface of the piezoelectric component.
8 . The atomization module according to claim 6 , wherein the auxiliary fixing member completely covers the first adhesive groove, a part of the auxiliary fixing member is connected to the atomization component, and another part of the auxiliary fixing member is connected to the piezoelectric component.
9 . The atomization module according to claim 8 , wherein the piezoelectric component, the main fixing member, the auxiliary fixing member and the atomization component form an enclosed space to define the first adhesive groove.
10 . The atomization module according to claim 1 , wherein the piezoelectric component and the atomization component are arranged on different sides of the main fixing member.
11 . The atomization module according to claim 10 , wherein the connecting part is inclined relative to the first bonding part and the second bonding part, the piezoelectric component has an inner surface facing the first bonding part and an outer surface opposite to the inner surface, the outer surface and the second bonding part jointly define a second adhesive groove, and the inner surface and the connecting part jointly define a third adhesive groove.
12 . The atomization module according to claim 11 , wherein a second adhesive that contacts at least the main fixing member and the outer surface of the piezoelectric component is provided in the second adhesive groove, and a third adhesive that contacts at least the main fixing member and the inner surface of the piezoelectric component is provided in the third adhesive groove.
13 . The atomization module according to claim 12 , wherein the piezoelectric component has an upper surface and a lower surface that are disposed between the inner surface and the outer surface, and the lower surface contacts the second bonding part.
14 . The atomization module according to claim 13 , wherein the auxiliary fixing member does not completely cover the first adhesive groove, and the first adhesive overflows from the first adhesive groove and extends to a third bonding surface of the auxiliary fixing part, and the third bonding surface is opposite to the second bonding surface.
15 . The atomization module according to claim 14 , wherein the first adhesive overflows from the first adhesive groove and extends to a bottom surface of the second bonding part that is not in contact with the piezoelectric component.
16 . The atomization module according to claim 13 , wherein the auxiliary fixing member completely covers the first adhesive groove, a part of the auxiliary fixing member is connected to the atomization component, and another part of the auxiliary fixing member is connected to a bottom surface of the second bonding part which is not in contact with the piezoelectric component.
17 . The atomization module according to claim 16 , wherein the main fixing part, the auxiliary fixing part and the atomization component form an enclosed space to define the first adhesive groove.
18 . An atomization module, comprising: a main fixing member, including: a first bonding part having a first opening and a first bonding surface surrounding the first opening, wherein the first bonding surface is provided with a plurality of first notches; and a second bonding part and a connecting part, wherein the connecting part has an inclination angle between 35 degrees and 45 degrees relative to a virtual horizontal plane that is coplanar with the second bonding part, the second bonding part is connected to the first bonding part through the connecting part, and the connecting part and the second bonding part surround the first bonding part; an auxiliary fixing member disposed on the first bonding part, wherein the auxiliary fixing member has a second opening and a second bonding surface surrounding the second opening, the second bonding surface is provided with a plurality of second notches, the second bonding surface faces the first bonding surface, and the plurality of first notches and the plurality of second notches are arranged to face each other; an atomization component disposed between the main fixing member and the auxiliary fixing member; and a piezoelectric component disposed on the second bonding part and surrounding the first bonding part; wherein the main fixing member has a first adhesive groove, the main fixing member, the auxiliary fixing member and the atomization component jointly define the first adhesive groove, and a first adhesive that contacts the main fixing member, the auxiliary fixing member and the atomization component is provided in the first adhesive groove.

Description

CROSS-REFERENCE TO RELATED PATENT APPLICATION This application claims the benefit of priority to Patent Application No. 202310707257.X, filed on Jun. 15, 2023, in the People's Republic of China. The entire content of the above identified application is incorporated herein by reference. This application claims the benefit of priority to the U.S. Provisional Patent Application Ser. No. 63/416,593, filed on Oct. 16, 2022, which application is incorporated herein by reference in its entirety. Some references, which may include patents, patent applications and various publications, may be cited and discussed in the description of this disclosure. The citation and/or discussion of such references is provided merely to clarify the description of the present disclosure and is not an admission that any such reference is “prior art” to the disclosure described herein. All references cited and discussed in this specification are incorporated herein by reference in their entireties and to the same extent as if each reference was individually incorporated by reference. FIELD OF THE DISCLOSURE The present disclosure relates to an atomization module, and more particularly to an atomization module capable of improving structural strength. BACKGROUND OF THE DISCLOSURE A nebulizer atomizes medicinal liquid through an internal atomization component to form and spray an aerosol. The atomization component vibrates to convert the medicinal liquid into the aerosol with tiny droplets by powering a piezoelectric component of an atomization component inside. However, bonding surfaces between the atomization component and a support member may be easily peeled off under long-term vibration of the atomization component, resulting in gaps, moisture permeation or even peeling of the atomization component, which further affects service life of the atomization component. Moreover, any such moisture permeation into the atomization component can easily result in short circuits between positive and negative electrodes of the piezoelectric component. Therefore, improving a structural design of the atomization component to increase structural strength and avoid forming short circuits between the positive and negative electrodes of the piezoelectric component has become one of important issues to be addressed in the relevant art. SUMMARY OF THE DISCLOSURE In response to the above-referenced technical inadequacies, the present disclosure provides an atomization module capable of addressing peeling issues due to vibration of the atomization component. In one aspect, the present disclosure provides an atomization module, which includes a main fixing member, an auxiliary fixing member, an atomizing unit and a piezoelectric component. The main fixing member includes a first bonding part, a second bonding part and a connecting part. The first bonding part has a first opening and a first bonding surface surrounding the first opening. The second bonding part is connected to the first bonding part through the connecting part, and the connecting part and the second bonding part surround the first bonding part. The auxiliary fixing member is disposed on the first bonding part, and has a second opening and a second bonding surface surrounding the second opening. The second bonding surface faces the first bonding surface. The atomization component is disposed between the main fixing member and the auxiliary fixing member. The piezoelectric component is disposed on the second bonding part and surrounds the first bonding part. The main fixing member has a first adhesive groove, and the main fixing member, the auxiliary fixing member and the atomization component jointly define at least the first adhesive groove. A first adhesive that contacts at least the main fixing member, the auxiliary fixing member and the atomization component is provided in the first adhesive groove. Therefore, in the atomization module provided by the present disclosure, the first adhesive groove can be filled with adhesive to increase bonding strengths among the main fixing member, the atomization component, and the auxiliary fixing member, thereby strengthening an overall structure of the atomization module. In addition, moisture can be prevented from penetrating through bonding interfaces among the atomization component, the main fixing member, and the auxiliary fixing member, so as to avoid short circuits between the positive and negative electrodes of the piezoelectric component due to moisture permeation. These and other aspects of the present disclosure will become apparent from the following description of the embodiment taken in conjunction with the following drawings and their captions, although variations and modifications therein may be affected without departing from the spirit and scope of the novel concepts of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS The described embodiments may be better understood by reference to the following description and the accompanying