US-12617149-B2 - Systems and methods for treating a printed model

Abstract

The present disclosure relates to systems and methods for treating a printed model. The methods may include placing at least a portion of the printed model into a heat treatment medium. The methods may further include performing a heat treatment on the printed model based at least in part on the heat treatment medium. The heat treatment medium may provide a constraint force to prevent a deformation of the printed model during the heat treatment. And the methods may also include obtaining a printed object based at least in part on the heat treatment performed on the printed model.

Inventors

• Zhifeng YAO
• Guang Mike ZHU
• Yisi LU
• Kaifeng ZHAO
• Menglong HU

Assignees

• LUXCREO (BEIJING) INC.

Dates

Publication Date

20260505

Application Date

20220616

Priority Date

20191218

Claims (19)

1. 1 . A method for treating a printed model, comprising: placing at least a portion of the printed model into a heat treatment medium; performing a heat treatment on the printed model based at least in part on the heat treatment medium, wherein the heat treatment medium provides a constraint force to prevent a deformation of the printed model during the heat treatment; and obtaining a printed object based at least in part on the heat treatment performed on the printed model; wherein the portion of the printed model is placed into the heat treatment medium, and the performing the heat treatment on the printed model based at least in part on the heat treatment medium includes: directing a heating source to heat the heat treatment medium to a predetermined temperature during which heat is conducted to the printed model gradually; and directing another heating source to heat a portion of the printed model out of the heat treatment medium.
2. 2 . The method of claim 1 , wherein the printed model has a predetermined hollow ratio within a hollow ratio range from 40% to 99.9%, the performing the heat treatment on the printed model based at least in part on the heat treatment medium includes: placing a portion of the printed model with the predetermined hollow ratio into the heat treatment medium, and placing other portions of the printed model out of the heat treatment medium.
3. 3 . The method of claim 1 , wherein the heat treatment medium includes an inert liquid or a physical gel.
4. 4 . The method of claim 3 , wherein the heat treatment medium is the inert liquid and the inert liquid includes at least one of water, salt water, or an inert organic liquid.
5. 5 . The method of claim 1 , wherein the heat treatment medium is a solid particle.
6. 6 . The method of claim 5 , wherein the solid particle is an inert solid particle.
7. 7 . The method of claim 5 , wherein the solid particle is a soluble solid particle.
8. 8 . The method of claim 1 , wherein the heat treatment medium includes a heat conductive material added to the heat treatment medium, the heat conductive material being used to improve a thermal conductivity of the heat treatment medium.
9. 9 . The method of claim 1 , wherein the performing the heat treatment on the printed model based at least in part on the heat treatment medium includes: performing the heat treatment on the printed model by heating the heat treatment medium.
10. 10 . The method of claim 1 , wherein the performing the heat treatment on the printed model based at least in part on the heat treatment medium includes: performing the heat treatment on the printed model by heating the heat treatment medium and the printed model simultaneously.
11. 11 . The method of claim 1 , wherein the performing the heat treatment on the printed model based at least in part on the heat treatment medium includes: performing the heat treatment on the printed model according to a heat treatment temperature, the heat treatment temperature being within a temperature range from 60° C. to 160° C.
12. 12 . The method of claim 5 , wherein a size of the solid particle is in a range from 1 micrometer to 10 millimeters.
13. 13 . The method of claim 5 , wherein a ratio of a size of the solid particle to a size of the printed model is less than 1:100.
14. 14 . The method of claim 1 , wherein the printed model has a suspended parameter satisfying a predetermined condition, the predetermined condition including at least one of: a suspended angle of the printed model being larger than 5°, and a suspended length of the printed model being larger than 5 mm.
15. 15 . The method of claim 1 , wherein a predetermined pressure is on a force-bearing surface of the printed model, the predetermined pressure being larger than or equal to 0.01 MPa.
16. 16 . The method of claim 1 , wherein the heat treatment medium includes a liquid, and the placing at least a portion of the printed model into the heat treatment medium includes: when placing the printed model into the heat treatment medium, adding an inert gas into the liquid, the inert gas being configured to prevent a reaction between the printed model and the liquid.
17. 17 . The method of claim 1 , wherein the heat treatment medium includes one or more non-inert components, the non-inert component is configured to react with the printed model to promote a curing process of the printed model.
18. 18 . The method of claim 5 , wherein the solid particle is a mixture of NaCl and Na 2 CO 3 , and a ratio of a mass of the NaCl to a mass of the Na 2 CO 3 in the mixture is in a range from 1:99 to 99:1.
19. 19 . The method of claim 5 , wherein the solid particle is a mixture including two or more kinds of substances, and shapes and sizes of the two or more kinds of substances are different.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of International Patent Application No. PCT/CN2020/136196, filed on Dec. 14, 2020, which claims priority to International Patent Application No. PCT/CN2019/126134, filed on Dec. 18, 2019, the contents of each of which are hereby incorporated by reference. TECHNICAL FIELD The present disclosure generally relates to printing field, and in particular, to systems and methods for treating a printed model. BACKGROUND With the development of computer and mechanical technologies, the exploration of three-dimensional (3D) printing has developed rapidly nowadays. During a 3D printing process, a 3D printing system can obtain a printed model by using, for example, a fused deposition modeling technique, a photocuring technique, etc. Further, the system may perform a heat treatment on the printed model to improve properties of the printed model. However, during the heat treatment, a deformation of the printed model may occur, which may affect the properties and/or characteristics (e.g., shape, size) of a final printed object. Therefore, it is desirable to provide systems and methods for treating a printed model efficiently and accurately, thereby reducing a deformation of the printed model and improving properties of the printed model. SUMMARY An aspect of the present disclosure relates to a method for treating a printed model. The method may include placing at least a portion of the printed model into a heat treatment medium. The method may further include performing a heat treatment on the printed model based at least in part on the heat treatment medium. The heat treatment medium may provide a constraint force to prevent a deformation of the printed model during the heat treatment. And the method may also include obtaining a printed object based at least in part on the heat treatment performed on the printed model. Another aspect of the present disclosure relates to a system. The system may include at least one storage medium including a set of instructions and at least one processor in communication with the at least one storage medium. When executing the set of instructions, the at least one processor may be directed to cause the system to place at least a portion of the printed model into a heat treatment medium. The at least one processor may be directed to cause the system further to perform a heat treatment on the printed model based at least in part on the heat treatment medium. The heat treatment medium may provide a constraint force to prevent a deformation of the printed model during the heat treatment. And the at least one processor may be directed to cause the system further to obtain a printed object based at least in part on the heat treatment performed on the printed model. A further aspect of the present disclosure relates to a system. The system may include a printed model placing module configured to place at least a portion of the printed model into a heat treatment medium. The system may further include a heat treatment module configured to perform a heat treatment on the printed model based at least in part on the heat treatment medium. The heat treatment medium may provide a constraint force to prevent a deformation of the printed model during the heat treatment. And the system may also include a printed object obtaining module configured to obtain a printed object based at least in part on the heat treatment performed on the printed model. A still further aspect of the present disclosure relates to a non-transitory computer readable medium. The non-transitory computer readable medium may include executable instructions that, when executed by at least one processor, direct the at least one processor to perform a method. The method may include placing at least a portion of the printed model into a heat treatment medium. The method may further include performing a heat treatment on the printed model based at least in part on the heat treatment medium. The heat treatment medium may provide a constraint force to prevent a deformation of the printed model during the heat treatment. And the method may also include obtaining a printed object based at least in part on the heat treatment performed on the printed model. Additional features will be set forth in part in the description which follows, and in part will become apparent to those skilled in the art upon examination of the following and the accompanying drawings or may be learned by production or operation of the examples. The features of the present disclosure may be realized and attained by practice or use of various aspects of the methodologies, instrumentalities and combinations set forth in the detailed examples discussed below. BRIEF DESCRIPTION OF THE DRAWINGS The present disclosure is further described in terms of exemplary embodiments. These exemplary embodiments are described in detail with reference to the drawings. These embodiments are non-limiting exemplary em