US-12617205-B2 - Liquid ejection head and manufacturing method of liquid ejection head

Abstract

The liquid ejection head including a first liquid ejection module and a second liquid ejection module, each including a printing element substrate having an ejection surface on which a plurality of ejection port rows ejecting liquid is formed and a protection member having an opening corresponding to the ejection port row, and the ejection surface and the protection member are bonded to each other with a bonding adhesive, a space between the first liquid ejection module and the second liquid ejection module is sealed with a sealing member, and on a surface on the opposite side of a surface bonded to the ejection surface with the bonding adhesive, at least one side of the protection member, which is in close proximity to the sealing member, is made water repellent.

Inventors

• Tomoki Tsuji
• Shuzo Iwanaga
• Hiromasa Amma
• Shingo OKUSHIMA
• Tatsurou Mori

Assignees

• CANON KABUSHIKI KAISHA

Dates

Publication Date

20260505

Application Date

20231214

Priority Date

20221228

Claims (10)

1. 1 . A liquid ejection head comprising: a first liquid ejection module and a second liquid ejection module, each comprising a printing element substrate having an ejection surface on which an ejection port row ejecting liquid is formed and a protection member having an opening corresponding to the ejection port row, wherein the ejection surface and the protection member are bonded to each other with a bonding adhesive, a space between the first liquid ejection module and the second liquid ejection module is sealed with a sealing member, and on a surface on an opposite side of a surface bonded to the ejection surface with the bonding adhesive, at least one side of the protection member, which is in close proximity to the sealing member, is made water repellent.
2. 2 . The liquid ejection head according to claim 1 , wherein a contact angle of an area made water repellent in the protection member is 60° or more in a pure water small contact angle.
3. 3 . The liquid ejection head according to claim 1 , wherein a width of the opening is greater than or equal to a diameter of an ejection port and a thickness of the protection member is less than or equal to a thickness of the printing element substrate.
4. 4 . The liquid ejection head according to claim 1 , wherein a width of the opening is 200 μm or more and a thickness of the protection member is less than 50 μm.
5. 5 . The liquid ejection head according to claim 1 , wherein the protection member is made of metal.
6. 6 . The liquid ejection head according to claim 5 , wherein the protection member is stainless.
7. 7 . The liquid ejection head according to claim 6 , wherein a clearance between the first liquid ejection module and the second liquid ejection module is 100 μm or less.
8. 8 . The liquid ejection head according to claim 1 , wherein a viscosity of the sealing member before hardening is 15 Pa·s or less.
9. 9 . The liquid ejection head according to claim 1 , further comprising: a cover member, wherein the cover member has an opening and from the opening of the cover member, the printing element substrate is exposed.
10. 10 . The liquid ejection head according to claim 1 , wherein the liquid ejection head is a line head corresponding to a width of a printing medium.

Description

BACKGROUND OF THE INVENTION Field of the Invention The present disclosure relates to a liquid ejection head and a manufacturing method of a liquid ejection head. Description of the Related Art A line liquid ejection apparatus is known, which performs fast printing using a liquid ejection head comprising a liquid ejection unit corresponding to the width of a printing medium, in which a plurality of printing element substrates is arrayed. In a case where continuous printing is performed in one pass while conveying a plurality of printing media continuously or intermittently, there is a possibility that the printing medium being conveyed floats and comes into contact with the printing element substrate, and therefore, the liquid ejection head is damaged. As a method of solving the above-described problem, as in Japanese Patent Laid-Open No. 2006-334910 (in the following, referred to as Literature 1) and Japanese Patent Laid-Open No. H04-234665 (in the following, referred to as Literature 2), a configuration has been disclosed in which a protection member made of resin or metal is bonded to an ejection port formation surface. Incidentally, for the liquid ejection head, a configuration is known in which the gap between the printing element substrate and the peripheral member of the printing element is sealed with a sealing member in order to improve airtightness at the time of cap suction. It is also necessary to cause the sealing member to flow into a minute space, and therefore, a material whose fluidity is high is used as the material of the sealing member. However, with the configuration as in Literature 1 and Literature 2, there is a possibility that the sealing member climbs up onto the protection member and sticks to the surface. In a case where the sealing member sticks to the surface of the protection member, there is a possibility that the sealing member having stuck to the protection member is scraped off at the time of the wiping operation and enters the inside of the ejection port, causing non-ejection. SUMMARY OF THE INVENTION The liquid ejection head of the present disclosure includes a first liquid ejection module and a second liquid ejection module, each comprising a printing element substrate having an ejection surface on which an ejection port row ejecting liquid is formed and a protection member having an opening corresponding to the ejection port row, wherein the ejection surface and the protection member are bonded to each other with a bonding adhesive, a space between the first liquid ejection module and the second liquid ejection module is sealed with a sealing member, and on a surface on the opposite side of a surface bonded to the ejection surface with the bonding adhesive, at least one side of the protection member, which is in close proximity to the sealing member, is made water repellent. Further features of the present invention will become apparent from the following description of exemplary embodiments with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic configuration diagram of an ink jet printing apparatus according to the present disclosure; FIG. 2 is a schematic diagram of a liquid circulation path of the ink jet printing apparatus according to the present disclosure; FIG. 3A and FIG. 3B are each a perspective diagram of a liquid ejection head according to the present disclosure; FIG. 4 is an exploded perspective diagram of the liquid ejection head according to the present disclosure; FIG. 5A to FIG. 5F are diagrams showing a front surface and a back surface of each flow path member of the liquid ejection head according to the present disclosure; FIG. 6 is a partially enlarged perspective diagram in a case where flow paths within a flow path member of the liquid ejection head according to the present disclosure are viewed from an ejection module side; FIG. 7 is a cross-sectional diagram along a VII-VII line in FIG. 6; FIG. 8A and FIG. 8B are a perspective diagram and an exploded diagram, respectively, of one liquid ejection module of the liquid ejection head according to the present disclosure; FIG. 9A to FIG. 9C are a plan diagram and a partially enlarged diagram on an ejection port side of a printing element substrate of the liquid ejection head according to the present disclosure; FIG. 10 is a cross-sectional perspective diagram of a X-X plane in FIG. 9; FIG. 11 is a partially enlarged diagram of adjacent printing element substrates of the liquid ejection head according to the present disclosure; FIG. 12A to FIG. 12C are a perspective diagram, an exploded perspective diagram, and a cross-sectional diagram, respectively, of a liquid ejection module of a liquid ejection head according to a first embodiment; FIG. 13A to FIG. 13C are schematic diagrams showing a state where a bonding adhesive is applied in FIG. 12A to FIG. 12C; FIG. 14A to FIG. 14C are schematic diagrams showing one example of a state where a bonding adhesive is appli