US-12617907-B2 - Resin composition, prepreg using same, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board

Abstract

A resin composition includes: a compound (A) represented by the following formula wherein X is 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-yl-10-oxide and Y is a protecting group; and a thermosetting resin (B) containing at least one selected from among an epoxy resin, a polyphenylene ether resin, a cyanate ester resin, a phenol resin, an active ester resin, a benzoxazine resin, a maleimide resin, an acrylic resin, a methacrylic resin, a vinyl resin, an allyl resin, a propenyl resin, and a hydrocarbon-based resin having an unsaturated double bond.

Inventors

• Hirosuke Saito
• Yiqun Wang
• Hiroharu Inoue
• Yasunori NISHIGUCHI

Assignees

• PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Dates

Publication Date

20260505

Application Date

20220512

Priority Date

20210513

Claims (9)

1. 1 . A resin composition comprising: a compound (A) represented by the following chemical structure: a thermosetting resin (B) containing at least one selected from among an epoxy resin, a polyphenylene ether resin, a cyanate ester resin, a phenol resin, an active ester resin, a benzoxazine resin, a maleimide resin, an acrylic resin, a methacrylic resin, a vinyl resin, an allyl resin, a propenyl resin, and a hydrocarbon-based resin having an unsaturated double bond.
2. 2 . The resin composition according to claim 1 , wherein the thermosetting resin (B) contains at least one selected from among a polyphenylene ether resin, a maleimide resin, and a hydrocarbon-based resin having an unsaturated double bond.
3. 3 . A prepreg comprising: the resin composition according to claim 1 or a semi-cured product of the resin composition according to claim 1 ; and a fibrous base material.
4. 4 . A film with resin, comprising: a resin layer containing the resin composition according to claim 1 or a semi-cured product of the resin composition according to claim 1 ; and a support film.
5. 5 . A metal foil with resin comprising: a resin layer containing the resin composition according to claim 1 or a semi-cured product of the resin composition according to claim 1 ; and a metal foil.
6. 6 . A metal-clad laminate comprising: an insulating layer containing a cured product of the resin composition according to claim 1 ; and a metal foil.
7. 7 . A wiring board comprising: an insulating layer containing a cured product of the resin composition according to claim 1 ; and wiring.
8. 8 . A metal-clad laminate comprising: an insulating layer containing a cured product of the prepreg according to claim 3 ; and a metal foil.
9. 9 . A wiring board comprising: an insulating layer containing a cured product of the prepreg according to claim 3 ; and wiring.

Description

TECHNICAL FIELD The present invention relates to a resin composition, and a prepreg using the same, a film provided with resin, a metal foil provided with resin, a metal-clad laminate, and a wiring substrate obtained using the resin composition. BACKGROUND ART In recent years, along with an increased amount of information processed, various electronic devices have rapidly progressed in mounting technologies such as higher integration of semiconductor devices to be mounted, higher density for wiring, and multi-layering. A thermosetting resin is generally used as a substrate material for constituting a base material of a wiring board used in various electronic devices, and is required to have high heat resistance (glass transition temperature) in order to respond to multilayering and a high temperature condition in a process such as reflow, and also required to have a low dielectric constant and a low dielectric loss tangent in order to increase a signal transmission speed and reduce a loss during signal transmission. Since a substrate material for a printed wiring board or a semiconductor package is required to have high flame retardancy, a flame retardant is generally added to a resin composition used as an insulating material of the substrate material. As the flame retardant, a halogen-based flame retardant such as a bromine-based flame retardant and the like are also known, but a cured product of such resin composition containing a halogen may produce a harmful substance such as hydrogen halide at the time of combustion, and has a disadvantage of negatively affecting humans and the natural environment. Because of this situation, an insulating material for printed wiring boards also are required to be halogen-free. A phosphorus-based flame retardant known as a non-halogen flame retardant is assumed to exhibit a flame retardant effect by the promotion effects of a phosphorus compound on the carbonization of a synthetic resin to turn the surface thereof into a char layer during combustion thereby shielding thermal energy of an ignition source or shielding air required for combustion. It has been reported that flame retardancy can be secured with retaining the performance as a printed wiring board to some extent by adding a predetermined phosphorus compound to a thermosetting resin such as a PPE compound or a maleimide compound (Patent Documents 1 to 3 etc.). However, in the case of a conventional non-halogen flame retardant, a large amount of flame retardant is required to be used in order to ensure sufficient flame retardancy, which has resulted in a possibility that the glass transition temperature (Tg) may decrease in the cured product of the resin composition or the dielectric properties may be insufficient. Moreover, there is also an actual situation in which there is being demanded a resin composition with a novel flame retardant having a flame retardant effect, which is different from the conventional non-halogen flame retardants, suitable for higher functionality of substrate materials in recent years. The present invention is made in view of such circumstances, and an object of the present invention is to provide a resin composition which has flame retardancy equal to or higher than that of a conventional resin composition containing a phosphorus-based flame retardant, and retains performances as a wiring board such as low dielectric properties and a high glass transition temperature (Tg), or has higher performance. CITATION LIST Patent Literatures Patent Literature 1: JP 2011-46816 APatent Literature 2: WO 2020/204175 APatent Literature 3: JP 2011-52165 A SUMMARY OF INVENTION A resin composition according to one aspect of the present invention is characterized by including a compound (A) represented by the following formula: X—Y wherein X is 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-yl-10-oxide and Y is a protecting group; anda thermosetting resin (B) containing at least one selected from among an epoxy resin, a polyphenylene ether resin, a cyanate ester resin, a phenol resin, an active ester resin, a benzoxazine resin, a maleimide resin, an acrylic resin, a methacrylic resin, a vinyl resin, an allyl resin, a propenyl resin, and a hydrocarbon-based resin having an unsaturated double bond. BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a schematic sectional view illustrating the configuration of a prepreg according to an embodiment of the present invention. FIG. 2 is a schematic sectional view illustrating the configuration of a metal-clad laminate according to an embodiment of the present invention. FIG. 3 is a schematic sectional view illustrating the configuration of a wiring board according to an embodiment of the present invention. FIG. 4 is a schematic sectional view illustrating the configuration of a metal foil with resin according to an embodiment of the present invention. FIG. 5 is a schematic sectional view illustrating the configuration of a resin film according to an embodiment of the pres