US-12617942-B1 - Resin composition and applications of the same

US12617942B1US 12617942 B1US12617942 B1US 12617942B1US-12617942-B1

Abstract

A resin composition is provided. The resin composition comprises (A) an epoxy resin, (B) a dicyclopentadiene-based phenol resin, and (C) a first filler. The first filler is a boehmite filler having a D50 diameter ranging from 1 μm to 4 μm.

Inventors

Tsung-Hsien Lin

Assignees

TAIWAN UNION TECHNOLOGY CORPORATION

Dates

Publication Date: 20260505
Application Date: 20250305
Priority Date: 20241101

Claims (15)

1 . A resin composition, comprising: (A) an epoxy resin; (B) a dicyclopentadiene-based phenol resin; and (C) a first filler, which is a boehmite filler having a D50 diameter ranging from 1 μm to 4 μm, wherein the dicyclopentadiene-based phenol resin (B) has a structure represented by the following formula (I): wherein, n is an integer of 2 to 50; Ph is independently a hydroxyl-containing group derived from an aromatic phenol compound; and D has a structure represented by the following formula (II), and each D is the same or different:
2 . The resin composition of claim 1 , wherein the epoxy resin (A) is selected from the group consisting of a bisphenol epoxy resin, a phenolic epoxy resin, a trifunctional epoxy resin, a diphenylethylene epoxy resin, a triazine skeleton-containing epoxy resin, a fluorene skeleton-containing epoxy resin, a triphenol methane epoxy resin, a xylylene epoxy resin, a biphenyl epoxy resin, a biphenyl aralkyl epoxy resin, a naphthalene epoxy resin, an alicyclic epoxy resin, and combinations thereof.
3 . The resin composition of claim 1 , wherein the content of the dicyclopentadiene-based phenol resin ranges from 3 wt % to 15 wt % based on the total weight of the resin composition excluding solvent.
4 . The resin composition of claim 1 , wherein the content of the first filler ranges from 10 wt % to 31 wt % based on the total weight of the resin composition excluding solvent.
5 . The resin composition of claim 3 , wherein the content of the first filler ranges from 10 wt % to 31 wt % based on the total weight of the resin composition excluding solvent.
6 . The resin composition of claim 1 , which further comprises a curing agent selected from the group consisting of a cyanate ester resin, a benzoxazine resin, a non-dicyclopentadiene-based phenol resin, a styrene maleic anhydride (SMA) resin, dicyandiamide (Dicy), diaminodiphenyl sulfone (DDS), diaminodiphenylmethane, and combinations thereof.
7 . The resin composition of claim 5 , which further comprises a curing agent selected from the group consisting of a cyanate ester resin, a benzoxazine resin, a non-dicyclopentadiene-based phenol resin, a styrene maleic anhydride (SMA) resin, dicyandiamide (Dicy), diaminodiphenyl sulfone (DDS), diaminodiphenylmethane, and combinations thereof.
8 . The resin composition of claim 1 , which further comprises a second filler selected from the group consisting of silica, aluminum oxide, magnesium oxide, magnesium hydroxide, calcium carbonate, talc, clay, aluminum nitride, boron nitride, aluminum hydroxide, silicon aluminum carbide, silicon carbide, sodium carbonate, titanium dioxide, zinc oxide, zirconium oxide, quartz, diamond, diamond-like carbon, graphite, calcined kaolin, pryan, mica, hydrotalcite, polytetrafluoroethylene (PTFE), glass beads, ceramic whiskers, carbon nanotubes, nanosized inorganic powders, and combinations thereof.
9 . The resin composition of claim 5 , which further comprises a second filler selected from the group consisting of silica, aluminum oxide, magnesium oxide, magnesium hydroxide, calcium carbonate, talc, clay, aluminum nitride, boron nitride, aluminum hydroxide, silicon aluminum carbide, silicon carbide, sodium carbonate, titanium dioxide, zinc oxide, zirconium oxide, quartz, diamond, diamond-like carbon, graphite, calcined kaolin, pryan, mica, hydrotalcite, polytetrafluoroethylene (PTFE), glass beads, ceramic whiskers, carbon nanotubes, nanosized inorganic powders, and combinations thereof.
10 . The resin composition of claim 7 , which further comprises a second filler selected from the group consisting of silica, aluminum oxide, magnesium oxide, magnesium hydroxide, calcium carbonate, talc, clay, aluminum nitride, boron nitride, aluminum hydroxide, silicon aluminum carbide, silicon carbide, sodium carbonate, titanium dioxide, zinc oxide, zirconium oxide, quartz, diamond, diamond-like carbon, graphite, calcined kaolin, pryan, mica, hydrotalcite, polytetrafluoroethylene (PTFE), glass beads, ceramic whiskers, carbon nanotubes, nanosized inorganic powders, and combinations thereof.
11 . A prepreg, which is prepared by impregnating a substrate with the resin composition of claim 1 or by coating the resin composition of claim 1 onto a substrate and drying the impregnated or coated substrate.
12 . A metal-clad laminate, which is prepared by laminating the prepreg of claim 11 and a metal foil.
13 . A printed circuit board, which is prepared from the metal-clad laminate of claim 12 .
14 . A metal-clad laminate, which is prepared by coating the resin composition of claim 1 onto a metal foil and drying the coated metal foil.
15 . A printed circuit board, which is prepared from the metal-clad laminate of claim 14 .

Description

CLAIM FOR PRIORITY This application claims the benefit of Taiwan Patent Application No. 113141987 filed on Nov. 1, 2024, the subject matters of which are incorporated herein in their entirety by reference. BACKGROUND OF THE INVENTION Field of the Invention The present invention provides a resin composition, especially a resin composition comprising an epoxy resin, a dicyclopentadiene-based phenol resin, and a specific filler. The resin composition of the present invention can either be used in combination with a reinforcing material to constitute a prepreg or serve as an adhesive for metal foils, facilitating the production of metal-clad laminates and printed circuit boards (PCBs). Descriptions of the Related Art PCBs serve as circuit substrates in electronic devices, providing stability and electrical connections for electronic components. Traditional PCBs, known as copper-clad laminates (CCLs), consist primarily of resins, reinforcing materials and copper foils. Resins include epoxy resins, phenolic resins, polyamine formaldehyde resins, silicone, and Teflon. Reinforcing materials include glass fiber cloths, glass fiber mats, insulating papers, and linen cloths. PCBs are typically produced by the following method: impregnating a reinforcing material, such as a glass fiber fabric, with a resin composition (such as an epoxy resin composition) and partially curing the impregnated glass fiber fabric to a half-cured state (i.e., B-stage) to obtain a prepreg; superimposing specific layers of the prepregs and superimposing a metal foil on at least one external surface of the superimposed prepregs to provide a superimposed object; hot-pressing the superimposed object (i.e., C-stage) to obtain a metal-clad laminate; etching the metal foil on the surface of the metal-clad laminate to form a defined circuit pattern; and drilling a plurality of holes on the metal-clad laminate and plating these holes with a conductive material to form via holes to complete the printed circuit board. In recent years, due to the multi-functionalization and high-performance development of household electronic products, the circuits used in printed circuit boards have become increasingly dense. Additionally, since the voltage used in such electronic products is relatively high, the requirements for insulation reliability between circuits have become more stringent. In particular, when these electronic products are used in harsh environments such as high temperature, humidity, and contamination, dust, moisture, and pollutants can easily accumulate on the surface of the insulating substrate of the circuit board. This accumulation can lead to the formation of dissociable contaminants, which, under the influence of an external electric field, can easily cause partial discharges that form conductive or partially conductive channels, leading to progressive degradation of the surface of material and a significant reduction in the performance of the end circuit or electrical properties. The “leakage tracking phenomenon” refers to the process in which a conductive channel gradually forms under the influence of dissociable contaminants and an external electric field. In this process, repeated arc discharge between the circuits generates electrical sparks, which can easily form traces of carbonized conductive circuits, thereby damaging the insulating performance of the substrate surface. The “leakage tracking index” is used to measure the ability of insulating materials to resist leakage tracking. The higher the index, the less likely the material is to experience leakage tracking. In order to improve the leakage tracking index of material, CN 101654004 and CN 102585440 teach the use of low-bromine content epoxy resins (bromine content of 10 wt % to 15 wt %) or halogen-free epoxy resins, along with the addition of a large amount of aluminum hydroxide inorganic fillers. However, the excessive use of aluminum hydroxide can lead to a decrease in heat resistance, as aluminum hydroxide has a low thermal decomposition temperature, beginning to dehydrate at 200° C. This causes the resulting substrate to easily delaminate and bubble at high temperatures, thus affecting the thermal reliability of the product. For the safety and reliability of electronic products, especially the insulation reliability of printed circuit boards used in humid and easily contaminated environments, there is an urgent need to develop an insulating substrate with a high comparative tracking index (CTI). SUMMARY OF THE INVENTION In view of the aforementioned technical problems, the present invention aims to provide a resin composition that includes epoxy resin, dicyclopentadiene-based phenol resin, and specific fillers. The electronic materials obtained by curing the resin composition have high glass transition temperature (Tg), low coefficient of thermal expansion (CTE), high heat resistance (as indicated by T288, solder resistance, and heat resistance after moisture absorption),