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US-12617995-B2 - RF heat dissipation plastic, method for manufacturing RF heat dissipation plastic, and repeater cabinet using same

US12617995B2US 12617995 B2US12617995 B2US 12617995B2US-12617995-B2

Abstract

An RF heat dissipation plastic including a polymer matrix comprising a polymer resin; and a first filler that is dispersed in the polymer matrix, and includes a high-strength filler, which is a polymer containing at least one hydroxy group in the repeating unit thereof, and an inorganic coating layer formed on at least a part of the surface of the high-strength filler. Therefore, the RF heat dissipation plastic has a low dielectric constant and excellent mechanical strength are simultaneously exhibited.

Inventors

  • Jin Hyoung LEE

Assignees

  • AMOGREENTECH CO., LTD.

Dates

Publication Date
20260505
Application Date
20200916
Priority Date
20190923

Claims (10)

  1. 1 . An RF heat dissipation plastic, comprising: a polymer matrix comprising a polymer resin; a first filler that is dispersed in the polymer matrix and comprises a high-strength filler, which is comprised in an amount of 1 to 15 parts by weight based on 100 parts by weight of the polymer resin, is a cellulose-based filler including at least one hydroxy group and having an average cross-sectional diameter of 20 nm to 10 μm, and an inorganic coating layer formed on at least a part of the surface of the high-strength filler and having an average thickness of 10 to 20 nm, and the first filler comprises 100 to 200 parts by weight of the inorganic coating layer based on 100 parts by weight of the high-strength filler; and a second filler dispersed in the polymer matrix to improve heat dissipation characteristics in an amount of 50 to 150 parts by weight based on 100 parts by weight of the polymer resin, which is a graphite composite comprising a plate shape graphite, nanoparticles bonded to the surface of the graphite, and a catecholamine layer bonded to the surface of the nanoparticles bonded to the surface of the graphite, and a catecholamine layer bonded to the surface of the nanoparticles, and the second filler has an average particle diameter of 10 to 250 μm, wherein the RF heat dissipation plastic has a dielectric loss of 0.0005 to 0.0006 at 28 GHz.
  2. 2 . The RF heat dissipation plastic of claim 1 , wherein the cellulose-based filler comprises at least one selected from the group consisting of cellulose nanofibrils and cellulose fibers.
  3. 3 . The RF heat dissipation plastic of claim 1 , wherein the inorganic coating layer is an inorganic coating layer in which a silicon-based compound, which comprises at least one selected from the group consisting of a straight-chain silicic acid group in which two or more orthosilicic acid groups and orthosilicic acid groups are mutually polymerized, a pulverized silicic acid group in which four or more orthosilicic acid groups are mutually polymerized, and a cyclic silicic acid group in which three or more orthosilicic acid groups are mutually polymerized, is combined with the high-strength filler.
  4. 4 . The RF heat dissipation plastic of claim 3 , wherein in the first filler, at least one hydroxy group of the silicon-based compound is chemically bonded to a hydroxy group of the high-strength filler.
  5. 5 . The RF heat dissipation plastic of claim 1 , wherein the polymer resin comprises one compound or two or more compounds or copolymers selected from the group consisting of polycarbonate, polyamide, polyester, polyketone, liquid crystal polymer, polyolefin, polyphenylene sulfide (PPS), polyether ether ketone (PEEK), polyphenylene oxide (PPO), polyether sulfone (PES), polyether imide (PEI), polyimide (PI), polyphthalamide (PPA), polybutylene terephthalate (PBT), acrylonitrile butadiene styrene copolymer resin (ABS), polymethyl methacrylate (PMMA) and polyarylate (PAR).
  6. 6 . A repeater cabinet having an accommodating part in which a device for relaying an RF signal is accommodated therein, wherein at least a part of the repeater cabinet is the RF heat dissipation plastic of claim 1 .
  7. 7 . A method for manufacturing an RF heat dissipation plastic, comprising: (1) manufacturing a first filler by treating at least a part of the surface of a high-strength filler, which is a cellulose-based filler including at least one hydroxy group and having an average cross-sectional diameter of 20 nm to 10 μm, with an inorganic coating precursor to form an inorganic coating layer having a thickness of 10 to 20 nm on at least part of the surface, and the first filler comprises 100 to 200 parts by weight of the inorganic coating layer based on 100 parts by weight of the high-strength filler; and (2) dispersing the first filler and a second filler in order to improve heat dissipation characteristics in a polymer resin, wherein the first filler is comprised in an amount of 1 to 15 parts by weight based on 100 parts by weight of the polymer resin and the second filler is comprised in an amount of 50 to 150 parts by weight based on 100 parts by weight of the polymer resin, and wherein the second filler is a graphite composite comprising a plate shape graphite nanoparticles bonded to the surface of the graphite, and a catecholamine layer bonded to the surface of the nanoparticles, and the second filler has an average particle diameter of 10 to 250 μm, and wherein the RF heat dissipation plastic has a dielectric loss of 0.0005 to 0.0006 at 28 GHz.
  8. 8 . The method of claim 7 , wherein the inorganic coating precursor comprises tetraethyl orthosilicate (TEOS).
  9. 9 . The method of claim 7 , wherein step (1) treats the high-strength filler and the inorganic coating precursor at a weight ratio of 1:10 to 50.
  10. 10 . The method of claim 7 , wherein step (1) comprises: (1)-1 reacting the high-strength filler and the inorganic coating precursor for 3 to 13 hours; and (1)-2 aging the reacted high-strength filler for 0.3 to 3 hours.

Description

CROSS-REFERENCE TO RELATED APPLICATION This application is a 35 U.S.C. 371 National Phase Entry Application from PCT/KR2020/012483, filed Sep. 16, 2020, which claims priority to and the benefit of Korean Patent Application No. 10-2019-0116587, filed on Sep. 23, 2019, the disclosures of which are incorporated herein by reference in their entireties. TECHNICAL FIELD The present invention relates to an RF heat dissipation plastic, and more specifically to an RF heat dissipation plastic, a method for manufacturing an RF heat dissipation plastic and a repeater cabinet using the same. BACKGROUND ART A repeater for mobile communication refers to a device that receives weakened signals in the middle of a communication system, amplifies and retransmits the same, or modulates the waveform of a distorted signal and adjusts or reconstructs the timing and transmits the same. Such a repeater was initially intended for simply retransmitting signals, but recently, it plays the role of a low-cost base station in consideration of service coverage that saves equipment and operating costs. Meanwhile, the signals transmitted and received through a mobile communication repeater are radio waves, and 5G, which is currently in the process of building networks ahead of commercialization, uses the high frequency bands of 3.5 GHz and 28 GHz, and it uses significantly higher high-frequency bands compared to 4G, and thus, due to the communication characteristics of lower diffraction (strong straightness) and a shorter radio wave reach than 4G, 5G requires the installation of more base stations or repeaters than 4G. However, as the frequency of electric signals increases, there is a characteristic that the transmission loss increases, and therefore, the development of a material having excellent high-frequency transmission characteristics is an essential factor. In the case of materials with conventional high-frequency transmission characteristics, it was not possible to simultaneously achieve a low dielectric constant and high mechanical strength at a desired level, and there were also technical limitations to expressing excellent heat dissipation performance, and these characteristics could not be uniformly expressed in the entire area. As such, the situation is that there is an urgent need to develop a material which can minimize or prevent signal interference in high-frequency bands due to its low dielectric constant, exhibit excellent heat dissipation characteristics while having excellent mechanical strength, and have high-frequency transmission characteristics that exhibit uniform low-dielectric properties, mechanical strength and heat-dissipation characteristics in the entire area. DISCLOSURE Technical Problem The present invention has been devised in view of the above points, and it is an object of the present invention to provide an RF heat dissipation plastic that is capable of simultaneously expressing the effects of having a low dielectric constant and excellent mechanical strength. In addition, it is another object of the present invention to provide an RF heat dissipation plastic that exhibits excellent heat dissipation performance even though it is designed to have a low dielectric constant and excellent mechanical strength, and a repeater implemented by including the same. In addition, it is still another object of the present invention to provide an RF heat dissipation plastic that uniformly expresses low dielectric properties, excellent mechanical strength and excellent heat-dissipating properties in the entire area, and a repeater implemented by including the same. Furthermore, it is still another object of the present invention to provide various products across all industries, such as an RF heat dissipation plastic that can minimize the performance degradation or malfunction of a repeater cabinet that can be affected by the transmission and reception of high-frequency band signals according to the dielectric constant, a repeater implemented by including the same and the like. Technical Solution In order to solve the aforementioned problems, the present invention provides an RF heat dissipation plastic, including a polymer matrix including a polymer resin; and a first filler that is dispersed in the polymer matrix and includes a high-strength filler, which is a polymer including at least one hydroxy group in the repeating unit thereof, and an inorganic coating layer formed on at least a part of the surface of the high-strength filler. According to an exemplary embodiment of the present invention, the high-strength filler may include at least one selected from the group consisting of cellulose nanofibrils and cellulose fibers. In addition, the high-strength filler may have an average cross-sectional diameter of 10 nm to 20 μm, and the inorganic coating layer may have an average thickness of 5 to 30 nm. In addition, the inorganic coating layer may be an inorganic coating layer in which a silicon-based compound, which i