US-12618715-B2 - Sensing device

Abstract

A sensing device includes: a first substrate; a plurality of sensing units disposed on the first substrate, wherein the plurality of sensing units are used for sensing light with wavelengths within a wavelength range; and a second substrate disposed opposite to the first substrate and assembled to the first substrate, wherein the second substrate has an overlapping area overlapping with the plurality of sensing units in a normal direction of the first substrate, wherein the second substrate has an optical lens in the overlapping area, the optical lens includes a plurality of micro-structures, and a pitch between the plurality of micro-structures is less than or equal to a maximum wavelength value of the wavelength range.

Inventors

• I-An Yao
• Yu-Tsung Liu

Assignees

• Innolux Corporation

Dates

Publication Date

20260505

Application Date

20240328

Priority Date

20230428

Claims (19)

1. 1 . A sensing device, comprising: a first substrate; a plurality of sensing units disposed on the first substrate, wherein the plurality of sensing units are used for sensing light with wavelengths within a wavelength range; and a second substrate disposed opposite to the first substrate and assembled to the first substrate, wherein the second substrate has an overlapping area overlapping with the plurality of sensing units in a normal direction of the first substrate, wherein the second substrate has an optical lens in the overlapping area, the optical lens comprises a plurality of micro-structures, and a pitch between the plurality of micro-structures is less than or equal to a maximum wavelength value of the wavelength range; wherein a distance between the optical lens and the plurality of sensing units is between 150 μm and 250 μm in the normal direction of the first substrate.
2. 2 . The sensing device of claim 1 , wherein the second substrate has a recess, and the optical lens is disposed in the recess.
3. 3 . The sensing device of claim 1 , wherein the wavelength range is between 8 μm and 20 μm.
4. 4 . The sensing device of claim 1 , wherein the pitch between the plurality of micro-structures is greater than or equal to 1 μm and less than or equal to 20 μm.
5. 5 . The sensing device of claim 1 , wherein one of the plurality of micro-structures has a height greater than or equal to 0.1 μm and less than or equal to 20 μm.
6. 6 . The sensing device of claim 1 , wherein one of the plurality of micro-structures is a cylinder, and a diameter of the cylinder is less than the pitch between the plurality of micro-structures.
7. 7 . The sensing device of claim 1 , wherein one of the plurality of micro-structures is a cuboid with a width and a length, the width is less than the length, and the length is less than the pitch between the plurality of micro-structures.
8. 8 . The sensing device of claim 1 , wherein one of the plurality of micro-structures is a cross column with a width and a length, the width is less than the length, and the length is less than the pitch between the plurality of micro-structures.
9. 9 . The sensing device of claim 1 , wherein the second substrate comprises a first surface and a second surface opposite to the first surface, the first surface is closer to the first substrate than the second surface, and the optical lens is disposed on the first surface or the second surface.
10. 10 . The sensing device of claim 1 , further comprising an optical film disposed on the second substrate.
11. 11 . The sensing device of claim 10 , wherein a material of the optical film comprises zinc sulfide, zinc selenide, germanium, magnesium fluoride, beryllium fluoride, potassium chloride, arsenic trisulfide or a combination thereof.
12. 12 . The sensing device of claim 10 , wherein the optical film is disposed on a side of the second substrate away from the optical lens.
13. 13 . The sensing device of claim 10 , wherein the optical film is disposed on the optical lens.
14. 14 . The sensing device of claim 10 , wherein a thickness of the optical film is between 0.01 μm and 5 μm.
15. 15 . The sensing device of claim 1 , wherein a material of the second substrate comprises silicon, germanium, chalcogenide glass, gallium arsenide or a combination thereof.
16. 16 . The sensing device of claim 1 , wherein a material of the optical lens comprises silicon, germanium, chalcogenide glass, gallium arsenide, zinc sulfide, zinc selenide or a combination thereof.
17. 17 . The sensing device of claim 1 , further comprising: a plurality of first bonding units disposed on the first substrate, wherein the plurality of sensing units are disposed between the plurality of first bonding units; and a plurality of second bonding units disposed on the second substrate, wherein the optical lens is disposed between the plurality of second bonding units.
18. 18 . The sensing device of claim 17 , wherein the first substrate and the second substrate are assembled through the plurality of first bonding units and the plurality of the second bonding units.
19. 19 . The sensing device of claim 1 , further comprising a pad disposed on the first substrate, wherein the pad is disposed adjacent to a sensing array comprising the plurality of sensing units and is electrically connected to the sensing array.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS This application claims the benefits of the Chinese Patent Application Serial Number 202310477326.2, filed on Apr. 28, 2023, the subject matter of which is incorporated herein by reference. BACKGROUND Field The present disclosure relates to a sensing device and, more particularly to a sensing device with an optical lens. Description of Related Art Infrared sensors can detect infrared rays that are invisible to the naked eye. They have the advantages of detection without contact with objects, high sensitivity, and high anti-noise characteristics. They can be used in object distance sensing, temperature detection, human body detection, etc., and has high application value. However, the infrared sensing array is easily affected by the external environment, causing the sensing signal to be affected. In addition, an additional optical lens is required, resulting in complex manufacturing steps and high cost. Therefore, it is desirable to provide a sensing device to improve the conventional defects. SUMMARY The present disclosure provides a sensing device, comprising: a first substrate; a plurality of sensing units disposed on the first substrate, wherein the plurality of sensing units are used for sensing light with wavelengths within a wavelength range; and a second substrate disposed opposite to the first substrate and assembled to the first substrate, wherein the second substrate has an overlapping area overlapping with the plurality of sensing units in a normal direction of the first substrate, wherein the second substrate has an optical lens in the overlapping area, the optical lens comprises a plurality of micro-structures, and a pitch between the plurality of micro-structures is less than or equal to a maximum wavelength value of the wavelength range. Other novel features of the disclosure will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a schematic top view of part of a sensing device according to one embodiment of the present disclosure. FIG. 2 is a schematic cross-sectional view of a sensing unit according to one embodiment of the present disclosure. FIG. 3A to FIG. 3C are schematic cross-sectional views showing a method for manufacturing a sensing device according to one embodiment of the present disclosure. FIG. 4 is a schematic view of a sensing device according to one embodiment of the present disclosure. FIG. 5 is a schematic view of a sensing device according to one embodiment of the present disclosure. FIG. 6A is a schematic top view of an optical lens according to one embodiment of the present disclosure. FIG. 6B is a side view of FIG. 6A. FIG. 7A and FIG. 7B are perspective views of part of an optical lens according to one embodiment of the present disclosure. DETAILED DESCRIPTION The following is specific embodiments to illustrate the implementation of the present disclosure. Those who are familiar with this technique can easily understand the other advantages and effects of the present disclosure from the content disclosed in the present specification. The present disclosure can also be implemented or applied by other different specific embodiments, and various details in the present specification can also be modified and changed according to different viewpoints and applications without departing from the spirit of the present disclosure. It should be noted that, in the present specification, when a component is described to have an element, it means that the component may have one or more of the elements, and it does not mean that the component has only one of the element, except otherwise specified. Furthermore, the ordinals recited in the specification and the claims such as “first”, “second” and so on are intended only to describe the elements claimed and imply or represent neither that the claimed elements have any proceeding ordinals, nor that sequence between one claimed element and another claimed element or between steps of a manufacturing method. The use of these ordinals is merely to differentiate one claimed element having a certain designation from another claimed element having the same designation. In the specification and the appended claims of the present disclosure, certain words are used to refer to specific elements. Those skilled in the art should understand that electronic device manufacturers may refer to the same components by different names. The present specification does not intend to distinguish between elements that have the same function but have different names. In the following description and claims, words such as “comprising”, “including”, “containing”, and “having” are open-ended words, so they should be interpreted as meaning “containing but not limited to . . . ”. Therefore, when the terms “comprising”, “including”, “containing” and/or “having” are used in the description of the present disclosure, they