US-12619132-B2 - Cooling device and electronic apparatus system

US12619132B2US 12619132 B2US12619132 B2US 12619132B2US-12619132-B2

Abstract

There is provided a cooling device including: a heat sink on which a plurality of fins for heat radiation are formed; and an attachment mechanism for attachably and detachably attaching the heat sink to an outer surface of an electronic apparatus, at least a part of the attachment mechanism overlapping a formation region of the fins.

Inventors

Yuta WATANABE
Yoshihiro Hayashi
Nobuaki Suzuki
Kouhei Awazu

Assignees

FUJIFILM CORPORATION

Dates

Publication Date: 20260505
Application Date: 20230910
Priority Date: 20210325

Claims (11)

1 . A cooling device comprising: a heat sink on which a plurality of fins for heat radiation are formed; an attachment mechanism for attachably and detachably attaching the heat sink to an outer surface of an electronic apparatus, at least a part of the attachment mechanism overlapping a formation region of the fins; a housing that covers the heat sink; and a falling-off prevention member that prevents the attachment mechanism from falling off from the housing, wherein the attachment mechanism includes an insertion hole provided in the formation region, an insertion portion to be inserted into the insertion hole, and an operation portion that is provided at one end of the insertion portion and is operated by a user in a case of attaching and detaching the heat sink, wherein the insertion hole is provided between two fins adjacent to each other, the insertion portion is disposed inside the housing, and the operation portion is disposed outside the housing, and the falling-off prevention member is provided at a boundary portion between the insertion portion and the operation portion.
2 . The cooling device according to claim 1 , wherein the insertion hole penetrates the fin.
3 . The cooling device according to claim 1 , wherein the fins include a first fin and a second fin having a height lower than a height of the first fin, the second fin is at least any of a fin adjacent to the insertion hole or a fin overlapping the insertion hole, and the falling-off prevention member is provided between the housing and the second fin.
4 . The cooling device according to claim 1 , further comprising: a fan that sends cooling air to the heat sink, wherein a plurality of the attachment mechanisms are provided, and the plurality of attachment mechanisms are provided at positions where the fan is interposed therebetween.
5 . The cooling device according to claim 1 , further comprising: a fan that sends cooling air to the heat sink and is attached to the formation region, wherein the fins include a first fin and a third fin having a height lower than a height of the first fin, and the third fin overlaps the fan in a plan view.
6 . A cooling device comprising: a heat sink on which a plurality of fins for heat radiation are formed; an attachment mechanism for attachably and detachably attaching the heat sink to an outer surface of an electronic apparatus, at least a part of the attachment mechanism overlapping a formation region of the fins; an elastic sheet that is provided on an attachment surface of the heat sink to the outer surface and is used for adhering the heat sink to the outer surface; a fan that sends cooling air to the heat sink; and a power receiving connector that is provided on the attachment surface of the heat sink to the outer surface and receives drive power of the fan from the electronic apparatus, wherein the attachment mechanism includes an insertion hole provided in the formation region, the insertion hole is provided between two fins adjacent to each other, and the elastic sheet is not provided in a portion of the power receiving connector.
7 . The cooling device according to claim 6 , wherein the elastic sheet is not provided in a portion of the attachment mechanism.
8 . A cooling device comprising: a heat sink on which a plurality of fins for heat radiation are formed; an attachment mechanism for attachably and detachably attaching the heat sink to an outer surface of an electronic apparatus, at least a part of the attachment mechanism overlapping a formation region of the fins; a fan that sends cooling air to the heat sink; a power receiving connector that receives drive power of the fan from the electronic apparatus; a connector cover that covers the power receiving connector during non-use of the cooling device; and an accommodation portion having a space that accommodates the connector cover removed from the power receiving connector during use of the cooling device, wherein the attachment mechanism includes an insertion hole provided in the formation region, and the insertion hole is provided between two fins adjacent to each other.
9 . The cooling device according to claim 8 , further comprising: a housing that covers the heat sink, wherein the accommodation portion is provided between the power receiving connector and the housing.
10 . An electronic apparatus system comprising: an electronic apparatus; and the cooling device according to claim 1 .
11 . The electronic apparatus system according to claim 10 , wherein the electronic apparatus is an imaging apparatus comprising a mobile monitor that is movable to at least a first position and a second position, and the outer surface is a surface that faces the mobile monitor in a case in which the mobile monitor is at the first position and is exposed in a case in which the mobile monitor is at the second position.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation application of International Application No. PCT/JP2022/003878 filed on Feb. 1, 2022, the disclosure of which is incorporated herein by reference in its entirety. Further, this application claims priority from Japanese Patent Application No. 2021-051661 filed on Mar. 25, 2021, the disclosure of which is incorporated herein by reference in its entirety. BACKGROUND 1. Technical Field The technology of the present disclosure relates to a cooling device and an electronic apparatus system. 2. Description of the Related Art JP3108585Y discloses a projector comprising a light source lamp, a light tunnel for forming light emitted from the light source lamp into a rectangular shape, a projection lens for projecting a video, a light modulation element that reflects the light emitted from the light source lamp and supplies the reflected light to the projection lens, a fixing member for fixing the light modulation element, and an optical component holder for mounting the projection lens and the light modulation element. The optical component holder is made of aluminum (Al) and has an opening portion, and the light tunnel is attached to the optical component holder made of Al. The fixing member for fixing the light modulation element is inserted into the opening portion of the optical component holder. The optical component holder made of Al is integrally formed with a heat radiating member that is made of Al and has a plurality of heat radiating fins for cooling the light modulation element. JP2017-169357A discloses a power conversion device comprising a substrate, a heat sink, a plurality of electronic components, and a fastening member. The heat sink has a plate-like base portion having a first surface and a second surface located on a back surface of the first surface, and a plurality of fin parts protruding from the first surface, and the substrate has a third surface located on the second surface, a fourth surface located on a back surface of the third surface, and through-holes provided from the third surface to the fourth surface. The plurality of electronic components are located on the fourth surface. The fastening member fixes the heat sink and the substrate. The fastening member is located and fixed inside the fin parts through the through-holes. SUMMARY One embodiment according to the technology of the present disclosure provides a cooling device and an electronic apparatus system capable of cooling an electronic apparatus at a necessary time and suppressing a decrease in cooling performance. A cooling device according to the present disclosure comprises: a heat sink on which a plurality of fins for heat radiation are formed; and an attachment mechanism for attachably and detachably attaching the heat sink to an outer surface of an electronic apparatus, at least a part of the attachment mechanism overlapping a formation region of the fins. It is preferable that the attachment mechanism includes an insertion hole provided in the formation region. It is preferable that the insertion hole is provided between two fins adjacent to each other. It is preferable that the insertion hole penetrates the fin. It is preferable that the attachment mechanism includes an insertion portion to be inserted into the insertion hole, and an operation portion that is provided at one end of the insertion portion and is operated by a user in a case of attaching and detaching the heat sink. It is preferable that the cooling device further comprises: a housing that covers the heat sink; and a falling-off prevention member that prevents the attachment mechanism from falling off from the housing, the insertion portion is disposed inside the housing, and the operation portion is disposed outside the housing, and the falling-off prevention member is provided at a boundary portion between the insertion portion and the operation portion. It is preferable that the fins include a first fin and a second fin having a height lower than a height of the first fin, the second fin is at least any of a fin adjacent to the insertion hole or a fin overlapping the insertion hole, and the falling-off prevention member is provided between the housing and the second fin. It is preferable that the cooling device further comprises: a fan that sends cooling air to the heat sink, a plurality of the attachment mechanisms are provided, and the plurality of attachment mechanisms are provided at positions where the fan is interposed therebetween. It is preferable that the cooling device further comprises: a fan that sends cooling air to the heat sink and is attached to the formation region, the fins include a first fin and a third fin having a height lower than a height of the first fin, and the third fin overlaps the fan in a plan view. It is preferable that the cooling device further comprises: an elastic sheet that is provided on an attachment surface of the heat sink to the outer surfa