US-12619169-B2 - Apparatus for treating substrate and method for treating a substrate

US12619169B2US 12619169 B2US12619169 B2US 12619169B2US-12619169-B2

Abstract

The inventive concept provides a substrate treating method at a treating space. The substrate treating method includes coating a substrate with a first liquid by supplying the first liquid to the substrate; and cleaning a substrate by supplying a second liquid to remove a portion of the first liquid remaining on a specific region of the substrate, the second liquid being different from the first liquid, and wherein an atmosphere of the treating space is exhausted while the coating of the substrate and the cleaning of the substrate is performed, and an exhausting pressure of the treating space during the coating of the substrate is different from an exhausting pressure of the treating space during the cleaning of the substrate.

Inventors

Ho Jin Jang

Assignees

SEMES CO., LTD.

Dates

Publication Date: 20260505
Application Date: 20230612
Priority Date: 20221212

Claims (6)

1 . A substrate treating apparatus comprising: a support configured to support and rotate a substrate; a treating container surrounding the substrate and supported on the support, the treating container being configured to provide a treating space for treating the substrate within; an exhaust configured to combine with the treating space to exhaust an atmosphere of the treating space; a first liquid nozzle configured to supply a first liquid to the substrate on the support; a second liquid nozzle configured to supply a second liquid to the substrate on the support, the second liquid being different from the first liquid; and a controller configured to control the first liquid nozzle, the second liquid nozzle, and the exhaust so that the first liquid is supplied to a first central region of a top surface of the substrate as the substrate rotates, followed by the second liquid being supplied to an edge region of a bottom surface of the substrate as the substrate rotates, with an exhausting pressure of the treating space during the supplying of the first liquid being different from an exhausting pressure of the treating space during the supplying of the second liquid.
2 . The substrate treating apparatus of claim 1 , wherein the controller is further configured to control the exhaust so that the exhausting pressure of the treating space during the supplying of the second liquid is greater than the exhausting pressure of the treating space during the supplying of the first liquid.
3 . The substrate treating apparatus of claim 2 , wherein the controller is further configured to control the exhaust so that the exhaust pressure of the treating space is preemptively increased after the supplying of the first liquid and before the supplying of the second liquid.
4 . The substrate treating apparatus of claim 2 , wherein the controller is further configured to control the exhaust to increase the exhausting pressure of the treating space at the time of supplying the second liquid to the substrate.
5 . The substrate treating apparatus of claim 1 , wherein a discharge end of the second liquid nozzle is shielded from allowing the second liquid to contact a second central region of the bottom surface of the substrate.
6 . The substrate treating apparatus of claim 1 , wherein the controller is further configured to control the exhaust so that the exhausting pressure of the treating space during the supplying of the second liquid is greater than the exhausting pressure of the treating space during the supplying of the first liquid, the exhausting pressure acts in a direction toward a lower side of the substrate, the first liquid is supplied to the top surface on which a pattern is formed, and the second liquid is supplied to the bottom surface.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS A claim for priority under 35 U.S.C. § 119 is made to Korean Patent Application No. 10-2022-0172468 filed on Dec. 12, 2022, in the Korean Intellectual Property Office, the entire contents of which are hereby incorporated by reference. TECHNICAL FIELD Embodiments of the inventive concept described herein relate to a substrate treating apparatus and method, more specifically, a substrate treating apparatus and method for supplying a liquid to a substrate. BACKGROUND Various processes such as a photolithography process, an etching process, an ashing process, a thin film deposition process, and a cleaning process are performed to manufacture a semiconductor element or a flat plate display panel. Among these processes, the photolithography process involves sequentially or selectively performing a coating process of supplying a photoresist liquid to a semiconductor substrate to form a coating film on a substrate surface and an exposing process of exposing a coating layer using a mask, and then a developing process of obtaining a desired pattern on the semiconductor substrate by supplying a developing liquid. In the coating process, a coating liquid must be uniformly coated on an entire region of the substrate. In a process of applying the coating liquid to the substrate in the coating process, the coating liquid may flow outside an edge region of the substrate. The coating liquid flowing outside the edge region of the substrate flows to a bottom surface of the edge region of the substrate and forms the liquid film on a bottom surface of the substrate. The liquid film formed on the bottom surface of the substrate may be a source of particles in a subsequent exposing process or the like. In addition, the liquid film formed on the bottom surface of the substrate acts as a factor which makes it difficult to treat a substrate uniformly in subsequent processes. Accordingly, a cleaning liquid is supplied to the bottom surface of the edge region of the substrate to remove the liquid film formed on the bottom surface of the substrate. FIG. 1 is an enlarged view schematically illustrating a state in which the cleaning liquid is supplied to the bottom surface of the edge region of a substrate in a general substrate treating apparatus. Referring to FIG. 1, the substrate treating apparatus 1000 may include a support 1100, a cup body 1200, and a back nozzle 1300. The support 1100 supports and rotates the substrate W. In addition, the cup body 1200 surrounds the substrate W supported by the support 1100. In addition, the back nozzle 1300 sprays the cleaning liquid on the bottom surface of the edge region of the substrate W supported by the support 1100. In order to remove a liquid film formed on the bottom surface of the edge region of the substrate W, the back nozzle 1300 sprays the cleaning liquid onto the bottom surface of the edge region of the rotating substrate W. The cleaning liquid discharged to the edge region of the substrate W collides with the bottom surface of the substrate W. In the process of the substrate W colliding with the cleaning liquid, some of a residue of the liquid film formed on the bottom surface of the substrate W is attached to an inner wall of the cup body 1200. In particular, since the support 1100 rotates, a phenomenon in which the residue is attached to the inner wall of the cup body 1200 by a centrifugal force is intensified. The residue of the liquid film attached to the inner wall of the cup body 1200 is rebounded by the substrate W supported by the support 1100 to contaminate the substrate W. In addition, the residue of the liquid film is attached to the cup body 1200 and acts as a source of particles which contaminate a subsequent substrate W. SUMMARY Embodiments of the inventive concept provide a substrate treating apparatus and method for uniformly treating a substrate. Embodiments of the inventive concept provide a substrate treating apparatus and method for minimizing a contamination with respect to a substrate which is currently being treated. Embodiments of the inventive concept provide a substrate treating apparatus and method for minimizing a contamination with respect to a subsequent substrate. The technical objectives of the inventive concept are not limited to the above-mentioned ones, and the other unmentioned technical objects will become apparent to those skilled in the art from the following description. The inventive concept provides a substrate treating method at a treating space. The substrate treating method at a treating space includes coating a substrate with a first liquid by supplying the first liquid to the substrate; and cleaning a substrate by supplying a second liquid to remove a portion of the first liquid remaining on a specific region of the substrate, the second liquid being different from the first liquid, and wherein an atmosphere of the treating space is exhausted while the coating of the substrate and the cleaning of