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US-12619851-B2 - Labeled molded body

US12619851B2US 12619851 B2US12619851 B2US 12619851B2US-12619851-B2

Abstract

Provided is a labeled molded body which enables a label and an RFID member to be easily separated from a molded body and to be each recycled and whose production process is simple. A labeled molded body includes a molded body and a label disposed on a surface of the molded body, and further having an RFID member disposed between the molded body and the label, wherein the molded body includes a thermoplastic resin at least in a surface layer, the label has a substrate layer including a thermoplastic resin, adhesive strength between the molded body and the RFID member (P molded body-member ) is 100 gf/15 mm or less and is equal to or less than adhesive strength between the RFID member and the label (P member-label ), and adhesive strength between the molded body and the label (P molded body-label ) is 90 to 300 gf/15 mm.

Inventors

  • Takuya IKARASHI

Assignees

  • YUPO CORPORATION

Dates

Publication Date
20260505
Application Date
20250113
Priority Date
20230907

Claims (13)

  1. 1 . A labeled molded body comprising: a molded body, a label disposed on a surface of the molded body, and an RFID member disposed between the molded body and the label, wherein the molded body is in contact with the RFID member, the molded body is in contact with the label, the molded body comprises a thermoplastic resin at least in a surface layer, the label has a substrate layer comprising a thermoplastic resin, adhesive strength between the molded body and the RFID member (P molded body-member ) is 90 gf/15 mm or less and is equal to or less than adhesive strength between the RFID member and the label (P member-label ), and adhesive strength between the molded body and the label (P molded body-label ) is 100 to 300 gf/15 mm.
  2. 2 . The labeled molded body according to claim 1 , wherein the label has a heat sealing layer, and the label and the molded body are thermally fused through the heat sealing layer.
  3. 3 . The labeled molded body according to claim 2 , wherein the heat sealing layer is a porous layer.
  4. 4 . The labeled molded body according to claim 3 , wherein the porous layer is an stretched layer of a resin composition comprising a thermoplastic resin and a filler.
  5. 5 . The labeled molded body according to claim 1 , wherein the label has a coating layer on an outermost surface on the molded body side.
  6. 6 . The labeled molded body according to claim 5 , wherein the coating layer of the label is in contact with the molded body.
  7. 7 . The labeled molded body according to claim 5 , wherein the coating layer is a layer containing a polar resin having no heat sealability or a peeling varnish layer, wherein the layer containing a polar resin having no heat sealability is a resin having a glass transition temperature of 100° C. or higher, or a resin having no melting point.
  8. 8 . The labeled molded body according to claim 7 , wherein the polar resin having no heat sealability is an ethyleneimine-based resin or cationic polymer antistatics having an ammonium salt structure or a phosphonium salt structure.
  9. 9 . The labeled molded body according to claim 1 , wherein the RFID member is bonded to the label directly or via an additional layer.
  10. 10 . The labeled molded body according to claim 9 , wherein the adhesive strength between the molded body and the RFID member (P molded body-member ) is smaller than the adhesive strength between the RFID member and the label (P member-label ).
  11. 11 . The labeled molded body according to claim 1 , wherein both of the adhesive strength between the RFID member and the molded body (P molded body-member ), and the adhesive strength between the RFID member and the label (P member-label ) are 50 gf/15 mm or less.
  12. 12 . The labeled molded body according to claim 1 , wherein the RFID member is an RFID inlay, and adhesive strength between the molded body and the RFID inlay (P molded body-inlay ) is 100 gf/15 mm or less and is equal to or less than adhesive strength between the RFID inlay and the label (P inlay-label ).
  13. 13 . The labeled molded body according to claim 1 , wherein the RFID member is an RFID circuit, and adhesive strength between the molded body and the RFID circuit (P molded body-circuit ) is 100 gf/15 mm or less and is equal to or less than adhesive strength between the RFID circuit and the label (P circuit-label ).

Description

CLAIM FOR PRIORITY This application is a Continuation of PCT/JP2024/005474 filed Feb. 16, 2024, and claims the priority benefit of Japanese application 2023-145562 filed Sep. 7, 2023, the contents of which are expressly incorporated by reference herein in their entireties. TECHNICAL FIELD The present invention relates to a labeled molded body. BACKGROUND ART Non-contact IC tags such as RFID (radio frequency identification) tags have heretofore been utilized in various fields including transport, distribution, sales management, process management in factories, inventory management, commodity delivery, and handling of baggage. For example, Patent Literature 1 has proposed a method of embedding RFID in a side part in a synthetic resin container. Patent Literature 2 has proposed a method of disposing an RFID inlay provided with a thermoplastic adhesive in a mold with the adhesive exposed, and subsequently supplying a heated container material into the mold. Patent Literature 2 has proposed, based on this method, a method for producing a container with an RFID inlay bonded to an outer surface of the container. Patent Literature 3 has proposed an in-mold label having an antenna and an IC chip in an inner layer, and a labeled thermoplastic resin container formed using the same. The in-mold label of Patent Literature 3 achieves the protection of an IC module in a production process or the like by encapsulating and fixing the IC module between at least two thermoplastic resin films. CITATION LIST Patent Literature [Patent Literature 1] Japanese Patent Laid-Open No. 2021-31104[Patent Literature 2] Japanese Patent Laid-Open No. 2023-46872[Patent Literature 3] Japanese Patent Laid-Open No. 2006-48016 SUMMARY OF INVENTION Problems to be Solved by the Invention In these days, it is required for reducing environmental load that resin containers used in various products should be recycled as fresh resources after use. However, in the case of containers described in Patent Literatures 1 and 2, an RFID member (e.g., an RFID inlay or an RFID circuit) is embedded in the container itself or firmly bonded to the container. Hence, such a container is usable for various purposes, whereas the container is not easy to recycle by removing the RFID member after use. An in-mold label described in Patent Literature 3 requires holding an antenna and an IC chip between two thermoplastic resin films. It is therefore expected that a simpler production process is provided. Means for Solving the Problems The present inventors have conducted diligent studies to solve the problems described above, and consequently found the present invention which relates to a labeled molded body having an RFID member (e.g., an RFID inlay) between a label and a molded body, and having adhesive strength between the molded body and the RFID member and adhesive strength between the molded body and the label equal to or less than predetermined values. According to the present invention, sufficient adhesive strength is present between the label and the molded body at the time of use of the molded body, and the RFID member can be easily removed together with the label from the molded body during the recycling process. Specifically, the present invention is as follows. [1] A labeled molded body comprising a molded body, anda label disposed on a surface of the molded body, andfurther having an RFID member disposed between the molded body and the label, whereinthe molded body comprises a thermoplastic resin at least in a surface layer,the label has a substrate layer comprising a thermoplastic resin,adhesive strength between the molded body and the RFID member (Pmolded body-member) is 100 gf/15 mm or less and is equal to or less than adhesive strength between the RFID member and the label (Pmember-label), and adhesive strength between the molded body and the label (Pmolded body-label) is 90 to 300 gf/15 mm. [2] The labeled molded body according to [1], wherein the label has a heat sealing layer, and the label and the molded body are thermally fused through the heat sealing layer. [3] The labeled molded body according to [1] or [2], wherein the label has a coating layer on an outermost surface on the molded body side. [4] The labeled molded body according to any of [1] to [3], wherein the RFID member is bonded to the label directly or via an additional layer. [5] The labeled molded body according to any of [1] to [4], wherein the adhesive strength between the molded body and the RFID member (Pmolded body-member) is smaller than the adhesive strength between the RFID member and the label (Pmember-label). [6] The labeled molded body according to any of [1] to [5], wherein both of the adhesive strength between the RFID member and the molded body (Pmolded body-member), and the adhesive strength between the RFID member and the label (Pmember-label) are 50 gf/15 mm or less. [7] The labeled molded body according to any of [2] to [6], wherein the heat sealing layer is a porous la