US-12620526-B2 - Method for manufacturing multilayer coil component

US12620526B2US 12620526 B2US12620526 B2US 12620526B2US-12620526-B2

Abstract

A method for manufacturing a multilayer coil component 1 includes: a step of forming a conductor by a photolithography method using photosensitive conductive paste; a step of forming an insulating film covering the conductor by a photolithography method using photosensitive insulating paste; a step of forming a resin layer holding the conductor covered with the insulating film by a positive-type photoresist; a step of forming a plurality of the conductors and the insulating film and then removing the resin layer by irradiating the resin layer with ultraviolet rays and developing the resin layer; and a step of filling the conductor covered with the insulating film with a magnetic material after removing the resin layer.

Inventors

Yuya ISHIMA
Kosuke Ito
Shinichi Kondo
Shingo Hattori
Hidenobu Umeda

Assignees

TDK CORPORATION

Dates

Publication Date: 20260505
Application Date: 20220307
Priority Date: 20210309

Claims (4)

1 . A method for manufacturing a multilayer coil component including an element body and a coil disposed in the element body and configured to include a plurality of conductors, the method comprising: forming at least one conductor of the plurality of the conductors by a photolithography method using photosensitive conductive paste; forming an insulating film covering the at least one conductor by a photolithography method using photosensitive insulating paste; forming a resin layer holding the at least one conductor covered with the insulating film by a positive-type photoresist; after forming the at least one conductor and the insulating film, irradiating the resin layer with ultraviolet rays and developing the resin layer to remove the resin layer; and filling the at least one conductor covered with the insulating film with a magnetic material after removing the resin layer.
2 . The method for manufacturing a multilayer coil component according to claim 1 , wherein the photosensitive insulating paste is photosensitive glass paste and a glass film is formed as the insulating film.
3 . The method for manufacturing a multilayer coil component according to claim 1 , further comprising performing heat treatment on the at least one conductor and the insulating film covering the at least one conductor after removing the resin layer.
4 . The method for manufacturing a multilayer coil component according to claim 1 , further comprising performing heat treatment after the filling with the magnetic material.

Description

TECHNICAL FIELD The present invention relates to a method for manufacturing a multilayer coil component. BACKGROUND The method described in, for example, Patent Literature 1 (Japanese Unexamined Patent Publication No. 2019-186525) is known as a multilayer coil component manufacturing method of the related art. The method described in Patent Literature 1 is to manufacture a coil component that has an element body containing a filler and a resin material, a coil portion configured from a coil conductor embedded in the element body, and a pair of external electrodes electrically connected to the coil conductor covered with a glass film. The method includes a step of forming a conductor paste layer with photosensitive metal paste containing a metal constituting a coil conductor on a substrate by a photolithography method, a step of forming a glass paste layer so as to cover the conductor paste layer with photosensitive glass paste containing glass constituting a glass film by a photolithography method, a step of forming a holding layer with photosensitive paste removable after firing in a region on the substrate lacking the conductor paste layer and the glass paste layer, and a step of forming the coil portion on the substrate by firing the substrate where the conductor paste layer, the glass paste layer, and the holding layer are formed. SUMMARY In the method for manufacturing a multilayer coil component of the related art, the glass film covering the coil conductor and the coil is formed and the holding layer disappears by the substrate being fired with the conductor paste layer, the glass paste layer, and the holding layer formed. However, when the holding layer disappears as a result of the firing in the method of the related art, the coil conductor held by the holding layer may deviate or the posture of the coil conductor may collapse by being affected by binder removal of the photosensitive paste forming the holding layer or the like. In a case where the coil conductor is problematic as described above, the reliability of the multilayer coil component may decline or a decline in yield may arise. One aspect of the present invention is to provide a method for manufacturing a multilayer coil component by which a coil conductor becoming problematic in a manufacturing process can be suppressed. A method for manufacturing a multilayer coil component according to one aspect of the present invention is a method for manufacturing a multilayer coil component including an element body and a coil disposed in the element body and configured to include a plurality of conductors. The method includes: a step of forming the conductor by a photolithography method using photosensitive conductive paste; a step of forming an insulating film covering the conductor by a photolithography method using photosensitive insulating paste; a step of forming a resin layer holding the conductor covered with the insulating film by a positive-type photoresist; a step of, after forming the conductor and the insulating film, irradiating the resin layer with ultraviolet rays and developing the resin layer to remove the resin layer; and a step of filling the conductor covered with the insulating film with a magnetic material after removing the resin layer. In the method for manufacturing the multilayer coil component according to one aspect of the present invention, the resin layer is formed by a positive-type photoresist, the resin layer is irradiated with ultraviolet rays and developed, and the resin layer is removed. In this manner, the resin layer can be removed without firing by the method for manufacturing the multilayer coil component. Accordingly, by the method for manufacturing the multilayer coil component, it is possible to suppress the coil conductor becoming problematic in the manufacturing process due to binder removal during firing or the like. As a result, by the method for manufacturing the multilayer coil component, a decline in the reliability of the multilayer coil component and a decline in yield can be avoided. In one embodiment, the photosensitive insulating paste may be photosensitive glass paste and a glass film may be formed as the insulating film. By this method, the adjacent coil conductors can be electrically insulated from each other appropriately. In one embodiment, the method may include a step of performing heat treatment on the conductor and the insulating film after removing the resin layer. In this method, filling with the magnetic material is performed after the conductor and the insulating film are sintered by heat treatment, and thus it is possible to further suppress the conductor becoming problematic. In one embodiment, the method may include a step of performing heat treatment after filling the conductor with the magnetic material. In this method, heat treatment is performed after the conductor is filled with the magnetic material after resin layer removal, and thus the conductor is held by the magneti