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US-12620527-B2 - Electronic component

US12620527B2US 12620527 B2US12620527 B2US 12620527B2US-12620527-B2

Abstract

An electronic component includes a multilayered capacitor including a capacitor body and an external electrode disposed on one surface of the capacitor body, a frame terminal mounting the multilayered capacitor on a board, and a conductive bonding portion disposed between the board and the frame terminal. The frame terminal includes a base portion including a first material and a surface portion including a second material, and a coefficient of thermal expansion of the frame terminal is greater than that of the capacitor body and is smaller than that of the conductive bonding portion.

Inventors

  • Beomjoon Cho

Assignees

  • SAMSUNG ELECTRO-MECHANICS CO., LTD.

Dates

Publication Date
20260505
Application Date
20231206
Priority Date
20230313

Claims (20)

  1. 1 . An electronic component, comprising: a multilayered capacitor including a capacitor body and an external electrode on one surface of the capacitor body; a frame terminal disposed outside the external electrode and mounting the multilayered capacitor on a board; and a first conductive bonding portion disposed between the board and the frame terminal, wherein the capacitor includes dielectric layers and internal electrodes, wherein the frame terminal includes: a base portion including a first material; and a surface portion disposed on a surface of the base portion and including a second material different from the first material, a coefficient of thermal expansion of the frame terminal including the base portion and the surface portion is greater than that of the capacitor body including the dielectric layers and the internal electrodes and is smaller than that of the first conductive bonding portion, wherein the frame terminal includes a clad in which a thin film-shaped surface portion is disposed on a surface of a sheet-shaped base portion, wherein the first material includes 42 alloy, invar, or stainless 304 (SUS304), and wherein an average thickness ratio of the base portion and the surface portion is about 5:5 to about 7:3.
  2. 2 . The electronic component of claim 1 , wherein the coefficient of thermal expansion of the frame terminal is greater than or equal to about 14 ppm/K and less than about 21 ppm/K.
  3. 3 . The electronic component of claim 1 , wherein the coefficient of thermal expansion of the capacitor body is about 9 ppm/K to about 12 ppm/K.
  4. 4 . The electronic component of claim 1 , wherein the coefficient of thermal expansion of the first conductive bonding portion is greater than or equal to about 19 ppm/K and less than about 25 ppm/K.
  5. 5 . The electronic component of claim 1 , wherein electrical conductivity of the frame terminal is greater than that of the first conductive bonding portion.
  6. 6 . The electronic component of claim 5 , wherein the electrical conductivity of the frame terminal is greater than about 20 MS/m.
  7. 7 . The electronic component of claim 5 , wherein the electrical conductivity of the first conductive bonding portion is less than or equal to about 10 MS/m.
  8. 8 . The electronic component of claim 1 , wherein a Young's modulus of the frame terminal is about 118 GPa to about 150 GPa.
  9. 9 . The electronic component of claim 1 , wherein the first material includes nickel (Ni), iron (Fe), copper (Cu), silver (Ag), chromium (Cr), or an alloy thereof.
  10. 10 . The electronic component of claim 1 , wherein the second material includes copper (Cu), gold (Au), zinc (Zn), aluminum (Al), or a combination thereof.
  11. 11 . The electronic component of claim 1 , wherein the first conductive bonding portion includes solder or conductive resin paste.
  12. 12 . The electronic component of claim 11 , wherein the solder includes an alloy of tin (Sn), silver (Ag), copper (Cu), lead (Pb), antimony (Sb), bismuth (Bi), or a combination thereof.
  13. 13 . The electronic component of claim 12 , wherein the solder includes tin (Sn)-silver (Ag)-copper (Cu), tin (Sn)-silver (Ag), or tin (Sn)-lead (Pb).
  14. 14 . The electronic component of claim 1 , wherein the frame terminal has an inner surface portion on one surface of the base portion facing the multilayered capacitor and an outer surface portion on another surface of the base portion opposite to the one surface.
  15. 15 . The electronic component of claim 1 , further comprising a second conductive bonding portion between the external electrode and the frame terminal, wherein the coefficient of thermal expansion of the frame terminal is smaller than that of the second conductive bonding portion.
  16. 16 . The electronic component of claim 15 , wherein a coefficient of thermal expansion of the second conductive bonding portion is greater than or equal to about 19 ppm/K and less than about 25 ppm/K.
  17. 17 . An electronic component, comprising: a multilayered capacitor including a capacitor body and an external electrode on one surface of the capacitor body; a frame terminal disposed outside the external electrode; and a conductive bonding portion disposed between the external electrode and the frame terminal, wherein the capacitor includes dielectric layers and internal electrodes, wherein the frame terminal includes a base portion including a first material and a surface portion disposed on a surface of the base portion and including a second material different from the first material, and a coefficient of thermal expansion of the frame terminal including the base portion and the surface portion is greater than that of the capacitor body including the dielectric layers and the internal electrodes and is smaller than that of the conductive bonding portion, wherein the frame terminal includes a clad in which a thin film-shaped surface portion is disposed on a surface of a sheet-shaped base portion, wherein the first material includes 42 alloy, invar, or stainless304 (SUS304), and wherein an average thickness ratio of the base portion and the surface portion is about 5:5 to about 7:3.
  18. 18 . The electronic component of claim 17 , wherein the coefficient of thermal expansion of the frame terminal is greater than or equal to about 14 ppm/K and less than about 21 ppm/K.
  19. 19 . The electronic component of claim 17 , wherein the coefficient of thermal expansion of the capacitor body is about 9 ppm/K to about 12 ppm/K.
  20. 20 . The electronic component of claim 17 , wherein the coefficient of thermal expansion of the conductive bonding portion is greater than or equal to about 19 ppm/K and less than about 25 ppm/K.

Description

CROSS-REFERENCE TO RELATED APPLICATION This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0032770 filed in the Korean Intellectual Property Office on Mar. 13, 2023, the entire contents of which are incorporated herein by reference. TECHNICAL FIELD This disclosure relates to an electronic component, and more particularly, to an electronic component in which a multilayered capacitor is mounted on a board. BACKGROUND OF THE INVENTION Electronic components may be down-sized and realize high capacity and thus are used in various electronic devices. Particularly, the electronic components are essentially used for the latest IT devices due to high frequency characteristics and excellent heat resistance. Recently, with the rapid rise of environmentally friendly and electric vehicles, as electric power driving systems in automobiles are increasing, the demand for the electronic components such as multilayered capacitors required for the automobiles is increasing. Since automobile parts are required to have high heat resistance and electrical reliability, the electronic components are also required to have more advanced performance. Accordingly, there is an increasing demand for electronic components capable of realizing high capacity in a limited space or having excellent durability against vibration and deformation. However, since the conventional electronic components are mounted directly on a board, heat or deformation generated from the board is directly transmitted to the electronic components, failing in securing reliability. Accordingly, a method of protecting the electronic components by bonding a metal frame at the sides thereof to secure a distance between electronic components and board and thus absorb the heat or deformation by the metal is suggested. However, an increase in a conductive path by bonding of the metal frame may lead to an increase in the equivalent series resistance (ESR) of the electronic component, resulting in side effects such as heat generation and performance degradation. In addition, if a difference in coefficient of thermal expansion (CTE) between the metal frame and the board-mounted solder is excessive, crack defects may occur in the solder bonding portion when high-temperature and low-temperature environments are repeated. SUMMARY One aspect of the present disclosure is to suppress an increase in equivalent series resistance by a frame terminal, to prevent solder cracking by reducing stress generated between a frame terminal and a mounting solder when high-temperature and low-temperature environments are repeated, and to provide an electronic component capable of improving high electrical conductivity and high terminal strength characteristics simultaneously. According to one aspect, an electronic component includes a multilayered capacitor including a capacitor body and an external electrode on one surface of the capacitor body, a frame terminal disposed outside the external electrode and mounting the multilayered capacitor on a board, and a first conductive bonding portion disposed between the board and the frame terminal. The frame terminal includes a base portion including a first material and a surface portion disposed on a surface of the base portion and including a second material different from the first material. A coefficient of thermal expansion of the frame terminal is greater than that of the capacitor body and is smaller than that of the first conductive bonding portion. The coefficient of thermal expansion of frame terminal may be greater than or equal to about 14 ppm/K and less than about 21 ppm/K. A coefficient of thermal expansion of the capacitor body may be about 9 ppm/K to about 12 ppm/K. A coefficient of thermal expansion of the first conductive bonding portion may be greater than or equal to about 19 ppm/K and less than about 25 ppm/K. Electrical conductivity of the frame terminal may be greater than that of the first conductive bonding portion. The electrical conductivity of the frame terminal may be greater than about 20 MS/m. The electrical conductivity of the first conductive bonding portion may be less than or equal to about 10 MS/m. A Young's modulus of the frame terminal may be about 118 GPa to about 150 GPa. The frame terminal may include a clad in which a thin film-shaped surface portion is disposed on a surface of a sheet-shaped base portion. The clad may be obtained by overlapping a metal plate including a first material and a metal plate including a second material, and then mechanically bonding the metal plate by rolling. The first material may include nickel (Ni), iron (Fe), copper (Cu), silver (Ag), chromium (Cr), or an alloy thereof. The first material may include 42alloy, invar, or stainless304 (SUS304). The second material may include copper (Cu), gold (Au), zinc (Zn), aluminum (Al), or a combination thereof. The first conductive bonding portion may include solder or conductive resin paste. The so