US-12620531-B2 - Multilayer electronic component

US12620531B2US 12620531 B2US12620531 B2US 12620531B2US-12620531-B2

Abstract

A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, and third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion disposed on the third surface and a first band portion extending from the first connection portion to a first portion of the first surface; a second external electrode including a second connection portion disposed on the fourth surface and a second band portion extending from the second connection portion to a first portion of the first surface; an insulating layer disposed on the second surface and extending to the first and second connection portions, the insulating layer including a first glass and a first oxide including aluminum (Al).

Inventors

Sin Il GU
Jin Hyung Lim
Kang Ha LEE
Jung Won Lee

Assignees

SAMSUNG ELECTRO-MECHANICS CO., LTD.

Dates

Publication Date: 20260505
Application Date: 20221007
Priority Date: 20211231

Claims (20)

1 . A multilayer electronic component, comprising: a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; a first external electrode including a first connection portion disposed on the third surface, and a first band portion extending from the first connection portion to a portion of the first surface; a second external electrode including a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion to a portion of the first surface; an insulating layer disposed on the first and second connection portions and covering the second surface, the insulating layer including a first glass and a first oxide including aluminum (Al); a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion, wherein the first glass comprises one or both of calcium (Ca) and magnesium (Mg).
2 . The multilayer electronic component of claim 1 , wherein the first glass includes at least one of an anorthite-based crystal phase and a diopside-based crystal phase.
3 . The multilayer electronic component of claim 1 , wherein the first oxide including aluminum (Al) is Al 2 O 3 .
4 . The multilayer electronic component of claim 1 , wherein a content of aluminum (Al) present in the insulating layer is 40 at % or more and 60 at % or less based on a total content of materials present in the insulating layer.
5 . The multilayer electronic component of claim 1 , wherein an average thickness of the insulating layer is 500 nm or more and 1000 nm or less.
6 . The multilayer electronic component of claim 1 , wherein, an average distance from the first surface to an internal electrode closest to the first surface in the first direction among the first and second internal electrodes is defined as H1, an average distance in the first direction from an extension line of the first surface to an end of the first plating layer disposed on the first connection portion or to an end of the second plating layer disposed on the second connection portion is defined as H2, and H1<H2 is satisfied.
7 . The multilayer electronic component of claim 6 , wherein, an average size of the body in the first direction is defined as T, and H2<T/2 is satisfied.
8 . The multilayer electronic component of claim 1 , wherein the first and second plating layers are disposed below an extension line of the first surface.
9 . The multilayer electronic component of claim 1 , wherein, an average size of the body in the second direction is defined as L, an average distance in the second direction from an extension line of the third surface to an end of the first band portion is defined as B1, an average distance in the second direction from an extension line of the fourth surface to an end of the second band portion is defined as B2, and 0.2≤B1/L≤0.4 and 0.2≤B2/L≤0.4 are satisfied.
10 . The multilayer electronic component of claim 1 , further comprising: an additional insulating layer disposed on the first surface and disposed between the first band portion and the second band portion.
11 . The multilayer electronic component of claim 1 , wherein a maximum size of the multilayer electronic component in the second direction is 1.1 mm or less, and a maximum size of the multilayer electronic component in the third direction is 0.55 mm or less.
12 . The multilayer electronic component of claim 1 , wherein an average thickness of the dielectric layer is 0.35 μm or less.
13 . The multilayer electronic component of claim 1 , wherein an average thickness of the first and second internal electrodes is 0.35 μm or less.
14 . The multilayer electronic component of claim 1 , wherein the body comprises: a capacitance formation portion including the first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween and a cover portion disposed on both end surfaces of the capacitance formation portion in the first direction, wherein an average size of the cover portion in the first direction is 15 μm or less.
15 . The multilayer electronic component of claim 1 , wherein an average thickness of the first and second plating layers is less than an average thickness of the insulating layer.
16 . The multilayer electronic component of claim 1 , wherein the first plating layer is disposed to cover one end close to the first surface of the insulating layer, and the second plating layer is disposed to cover an other end close to the first surface of the insulating layer.
17 . The multilayer electronic component of claim 1 , wherein the insulating layer is disposed to cover one end disposed on the first external electrode of the first plating layer and an other end disposed on the second external electrode of the second plating layer.
18 . The multilayer electronic component of claim 1 , wherein the first external electrode further includes a first side band portion extending from the first connection portion to portions of the fifth and sixth surfaces and the second external electrode further includes a second side band portion extending from the second connection portion to portions of the fifth and sixth surfaces, and wherein sizes of the first and second side band portions in the second direction gradually increase toward the first surface.
19 . The multilayer electronic component of claim 1 , wherein the first and second external electrodes are spaced apart from the fifth and sixth surfaces.
20 . The multilayer electronic component of claim 1 , wherein the insulating layer is disposed to extend from the first and second connection portions on to the fifth and sixth surfaces.

Description

CROSS-REFERENCE TO RELATED APPLICATION(S) This application claims benefit of priority to Korean Patent Application No. 10-2021-0193639 filed on Dec. 31, 2021 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. TECHNICAL FIELD The present disclosure relates to a multilayer electronic component. BACKGROUND A multilayer ceramic capacitor (MLCC), a multilayer electronic component, may be a chip-type capacitor which may be mounted on the printed circuit boards of various electronic products including an imaging device such as a liquid crystal display (LCD) and a plasma display panel (PDP), a computer, and the like, smartphones and mobile phones and may charge or discharge electricity. Such a multilayer ceramic capacitor may be used as a component of various electronic devices as a multilayer ceramic capacitor may have a relatively small size and high capacitance and may be easily mounted. As various electronic devices such as a computer and a mobile device have been miniaturized and have been designed to have high output, demand for miniaturization and high capacitance of a multilayer ceramic capacitor has increased. Also, as interest in electronic components for a vehicle has recently increased, a multilayer ceramic capacitor has also been required to have high reliability properties to be used in automobiles or an infotainment system. For miniaturization and high capacitance of the multilayer ceramic capacitor, it may be necessary to increase the number of laminated layers by reducing thicknesses of internal electrodes and dielectric layers, and by reducing the volume of the portion not affecting capacitance formation, an effective volume fraction required to implement capacitance may need to be increased. Also, it may be necessary to reduce a mounting space to mount a greater number of components within a limited area of a substrate. Also, as a thickness of a margin decreases with miniaturization and high capacitance of a multilayer ceramic capacitor, external moisture and a plating solution may easily permeate thereinto, and accordingly, reliability may degrade. Accordingly, a method for protecting a multilayer ceramic capacitor from permeation of external moisture or a plating solution may be necessary. SUMMARY An aspect of the present disclosure is to provide a multilayer electronic component having improved capacitance per unit volume. An aspect of the present disclosure is to provide a multilayer electronic component having improved reliability. An aspect of the present disclosure is to provide a multilayer electronic component having a reduced mounting space. According to an aspect of the present disclosure, a multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; a first external electrode including a first connection portion disposed on the third surface, a first band portion extending from the first connection portion to a first portion of the first surface, and a third band portion extending from the first connection portion to a first portion of the second surface; a second external electrode including a second connection portion disposed on the fourth surface, a second band portion extending from the second connection portion to a second portion of the first surface, and a fourth band portion extending from the second connection portion to a second portion of the second surface; an insulating layer disposed on the first and second connection portions and covering the second surface and the third and fourth band portions, the insulating layer including a first glass and a first oxide including aluminum (Al); a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion. According to another aspect of the present disclosure, a multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction, a first external electrode including a first connection portion disposed on the third surface and a first band portion extending from the first connection portion to a first portion of the first surface; a second e